公开(公告)号：US06676885B2

公开(公告)日：2004-01-13

申请号：US09781789

申请日：2001-02-12

申请人： Kazuo Shimizu ,  Hisayuki Tsuruta

发明人： Kazuo Shimizu ,  Hisayuki Tsuruta

IPC分类号： B29C4514

CPC分类号： B29C45/14655 ,  H01L21/565 ,  H01L24/32 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides a resin-molding method comprising the steps of: placing a circuit base member onto a mounting face of first one of paired dies, wherein a back face of the circuit base member is in contact with the mounting face; placing the paired dies in a closing state for clamping a peripheral region of the circuit base member with the paired dies; and injecting a molten resin into a cavity of the paired dies for filling the cavity with the injected resin, wherein, in the closing state, a first pressure effected to a front face of the circuit base member is set higher in pressure level than a second pressure effected to the back face of the circuit base member, so as to secure the circuit base member to the mounting face.

摘要翻译： 本发明提供了一种树脂成型方法，包括以下步骤：将电路基底部件放置在成对的模具中的第一个的安装面上，其中电路基底部件的背面与安装面接触; 将成对的模具放置在关闭状态，以夹紧具有成对模具的电路基底构件的周边区域; 以及将熔融树脂注入所述成对模具的空腔中以用注入的树脂填充所述空腔，其中在所述关闭状态下，对所述电路基底构件的正面施加的第一压力被设定为比第二压力高的压力水平 对电路基体的背面施加压力，以将电路基体固定到安装面上。

公开(公告)号：US5357077A

公开(公告)日：1994-10-18

申请号：US183325

申请日：1994-01-19

申请人： Hisayuki Tsuruta

发明人： Hisayuki Tsuruta

IPC分类号： B41F17/36 ,  B23K26/08 ,  B41M1/40 ,  H01L23/00 ,  H01L23/544 ,  B23K26/00

CPC分类号： H01L23/544 ,  B23K26/0838 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2924/0002

摘要： The subject is an apparatus for consecutively marking a plurality of packaged semiconductor devices such as ICs by using a laser beam marker. A plurality of packaged semiconductor devices are put into a tubular holder so as to form a single file. The tubular holder is generally rectangular in cross-sectional shape and has a lengthwise opening in the upside wall. The tubular holder is placed on a conveyor belt and secured to the conveyor belt by guide belts each of which makes tight contact with the upside wall or one of the side walls of the tubular holder and advances in the same direction as the conveyor belt. On the conveyor belt the tubular holder passes a marking station where a laser beam is projected on the semiconductor devices in the holder one after another. The apparatus includes a computarized controller to automatically control the positions of the conveyor belt and the guide belts according to the width and height of the tubular holder. In changing the object of marking to another kind of semiconductor device there arises a change in the width and/or height of the tubular holder, but the positions of the conveyor belt and the guide belts can quickly be adjusted by the function of the controller.

摘要翻译： 该主题是通过使用激光束标记连续标记诸如IC的多个封装半导体器件的装置。 将多个封装的半导体器件放入管状保持器中以形成单个文件。 管状保持器通常为矩形的横截面形状，并且在上侧壁中具有纵向开口。 管状保持器放置在传送带上并且通过导带固定到传送带，每个引导带与上侧壁或管状保持器的一个侧壁紧密接触并且沿与传送带相同的方向前进。 在传送带上，管状夹持器通过一个标记工位，其中激光束一个接一个地投射在保持器中的半导体器件上。 该装置包括计算控制器，用于根据管状保持器的宽度和高度来自动控制传送带和引导带的位置。 在将标记的对象改变为另一种半导体器件时，管状保持器的宽度和/或高度发生变化，但是传送带和引导带的位置可以通过控制器的功能快速调整。

公开(公告)号：US06315540B1

公开(公告)日：2001-11-13

申请号：US09680915

申请日：2000-10-06

申请人： Hisayuki Tsuruta

发明人： Hisayuki Tsuruta

IPC分类号： H01L2156

CPC分类号： H01L24/97 ,  B29C45/14655 ,  B29C45/2669 ,  B29C45/2708 ,  H01L21/565 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A molding die used for concurrently packaging semiconductor chips in a large piece of synthetic resin has a cavity rectangular in cross section and having two long peripheral lines and two short peripheral lines for accommodating a circuit panel where the semiconductor chips are mounted, melted synthetic resin is supplied through a gate extending along one of the long peripheral lines to the cavity so that the melted synthetic resin smoothly flows over the cavity, and the smooth flow prevents the molded product from voids and a wire weep.

摘要翻译： 用于在大片合成树脂中同时封装半导体芯片的成型模具具有矩形横截面的空腔，并且具有两条长的外围线和两条短的外围线，用于容纳安装半导体芯片的电路板，熔融的合成树脂为 通过沿着长周边线之一延伸到空腔的门提供，使得熔融的合成树脂平滑地流过空腔，并且平滑流动防止模制产品的空隙和电线被弄湿。

公开(公告)号：US06554598B1

公开(公告)日：2003-04-29

申请号：US09577592

申请日：2000-05-25

申请人： Hisayuki Tsuruta

发明人： Hisayuki Tsuruta

IPC分类号： B29L7072

CPC分类号： H01L21/67126 ,  H01L21/565 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A mold assembly including: a first mold half; a second mold half relatively movable with respect to the first mold half; and a thin film disposes between the both mold halves and in contact with the surface of a semiconductor chip. Because of the contact between the edges of the surface of the semiconductor chip and the thin film, the portion of the semiconductor chip at which the burr is liable to be generated is protected and no burrs are generated.

摘要翻译： 一种模具组件，包括：第一半模; 相对于第一半模相对移动的第二半模; 并且薄膜配置在两个半模之间并与半导体芯片的表面接触。 由于半导体芯片的表面的边缘与薄膜之间的接触，易于产生毛刺的半导体芯片的部分被保护，并且不产生毛刺。

公开(公告)号：US06200121B1

公开(公告)日：2001-03-13

申请号：US09337609

申请日：1999-06-21

申请人： Hisayuki Tsuruta

发明人： Hisayuki Tsuruta

IPC分类号： H01L2158

CPC分类号： H01L24/97 ,  B29C45/14655 ,  B29C45/2669 ,  B29C45/2708 ,  H01L21/565 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A molding die used for concurrently packaging semiconductor chips in a large piece of synthetic resin has a cavity rectangular in cross section and having two long peripheral lines and two short peripheral lines for accommodating a circuit panel where the semiconductor chips are mounted, melted synthetic resin is supplied through a gate extending along one of the long peripheral lines to the cavity so that the melted synthetic resin smoothly flows over the cavity, and the smooth flow prevents the molded product from voids and a wire weep.

摘要翻译： 用于在大片合成树脂中同时封装半导体芯片的成型模具具有矩形横截面的空腔，并且具有两条长的外围线和两条短的外围线，用于容纳安装半导体芯片的电路板，熔融的合成树脂为 通过沿着长周边线之一延伸到空腔的门提供，使得熔融的合成树脂平滑地流过空腔，并且平滑流动防止模制产品的空隙和电线被弄湿。