摘要:
A semiconductor memory device comprises two memory cell arrays (1a, 1b) in which a block divisional operation is performed. Two spare rows (2a, 2b) are provided corresponding to the two memory cell arrays (1a, 1b). Spare row decoders (5a, 5b) are provided for selecting the spare rows (2a, 2b), respectively. One spare row decoder selecting signal generation circuit (18) used in common by the spare row decoders (5a, 5b) is provided. The spare row decoder selecting signal generation circuit (18) can be previously set so as to generate a spare row decoder selecting signal (SRE) when a defective row exists in either of the memory cell arrays (1a, 1b) and the defective row is selected by row decoder groups (4a, 4b). Each of the spare row decoders (5a, 5b) is activated in response to the spare row decoder selecting signal (SRE) and a block control signal.
摘要:
A test signal generator for a semiconductor integrated circuit memory, wherein when transfer transistors (20, 21, 14, 15) are rendered conductive, a test data cloumn is supplied from an I/O line pair (11, 12) to a column of a register (10) and stored therein. When a transfer (67) is rendered conductive, the test data column written in the register is written in a column of a memory cell (22) in the same pattern and when transfer transistors (16, 17) are rendered conductive, the test data column written in the register is inverted and the, written in the memory cell column, Data in the memory cell column is read out by a word line (13) and amplified by a sense amplifier (5), so that the data and the test data stored in the register are compared by a coincidence detection circuit 8 to detect whether it is coincident or not.
摘要:
Each of divided bit line pairs is selectively connected to a sub-input/output line pair through transfer gates. A register is connected to the sub-input/output line pair. Data is transferred through the sub-input/output line pair between the register and a selected bit line pair. A sense amplifier is connected to each of the bit line pairs. Sense amplifiers are independently driven by separate sense amplifier activating signals. Therefore, even if data is transferred to the selected bit line pair from the register, fluctuations in potential on the bit line pair caused in such a case does not affect a sense amplifier activating signal connected to a non-selected bit line pair. As a result, data stored in the non-selected memory cell is prevented from being destroyed.
摘要:
A dynamic random access memory amplifier arrangement includes a sense amplifier band shared between two different memory blocks. In this memory, only sense amplifiers related to a selected memory block are activated. The memory comprises a circuit for boosting a control signal voltage to a switching unit for connecting the selected memory block to the sense amplifiers up to a level higher than a power supply voltage Vcc during the activation of the sense amplifiers, and a circuit for separating a memory block paired with the selected memory block from the activated sense amplifiers during the sensing operation. The memory further comprises a circuit for generating a control signal of the power supply voltage Vcc and connecting all the memory blocks to the corresponding sense amplifiers in a stand-by state wherein a row address strobe signal is inactive. With this arrangement, a highly reliable memory consuming less power can be achieved which ensures data writing and/or rewriting at a full Vcc level.
摘要:
An arrangement for providing a compensation of capacitance coupling between word lines and bit lines in a memory structure including twisted bit lines. Two dummy word lines maintained at a predetermined potential are formed at a twisted portion of a pair of bit lines. Dummy cells are provided at respective twisted portions of the dummy word lines and the bit lines. A plurality of word lines are formed in a direction intersecting with the bit lines and the word lines are divided into four word line groups according to positions of the twisted portions of the bit line pairs. When an arbitrary word line is selected, a potential of at least one dummy word line corresponding to the word line group to which the selected word line belongs is lowered. Consequently, the rise of the potential of the bit lines caused by the selection of the word line is compensated for by the lowering of the potential of at least one dummy word line, making it possible to decrease errors in reading. Particular cell layer arrangements simplify increase in integration density in the combination of dummy cell compensation with the twisted bit line balancing of capacitance coupling.
摘要:
A semiconductor memory device comprises two memory cell arrays (1a, 1b) in which a block divisional operation is performed. Two spare rows (2a, 2b) are provided corresponding to the two memory cell arrays (1a, 1b). Spare row decoders (5a, 5b) are provided for selecting the spare rows (2a, 2b), respectively. One spare row decoder selecting signal generation circuit (18) used in common by the spare row decoders (5a, 5b) is provided. The spare row decoder selecting signal generation circuit (18) can be previously set so as to generate a spare row decoder selecting signal (SRE) when a defective row exists in either of the memory cell arrays (1a, 1b) and the defective row is selected by row decoder groups (4a, 4b). Each of the spare row decoders (5a, 5b) is activated in response to the spare row decoder selecting signal (SRE) and a block control signal.
摘要:
A semiconductor memory device comprises two memory cell arrays (1a, 1b) in which a block divisional operation is performed. Two spare rows (2a, 2b) are provided corresponding to the two memory cell arrays (1a, 1b). Spare row decoders (5a, 5b) are provided for selecting the spare rows (2a, 2b), respectively. One spare row decoder selecting signal generation circuit (18) used in common by the spare row decoders (5a, 5b) is provided. The spare row decoder selecting signal generation circuit (18) can be previously set so as to generate a spare row decoder selecting signal (SRE) when a defective row exists in either of the memory cell arrays (1a, 1b) and the defective row is selected by row decoder groups (4a, 4b). Each of the spare row decoders (5a, 5b) is activated in response to the spare row decoder selecting signal (SRE) and a block control signal.
摘要:
A semiconductor memory device comprises two memory cell arrays (1a, 1b) in which a block divisional operation is performed. Two spare rows (2a, 2b) are provided corresponding to the two memory cell arrays (1a, 1b). Spare row decoders (5a, 5b) are provided for selecting the spare rows (2a, 2b), respectively. One spare row decoder selecting signal generation circuit (18) used in common by the spare row decoders (5a, 5b) is provided. The spare row decoder selecting signal generation circuit (18) can be previously set so as to generate a spare row decoder selecting signal (SRE) when a defective row exists in either of the memory cell arrays (1a, 1b) and the defective row is selected by row decoder groups (4a, 4b). Each of the spare row decoders (5a, 5b) is activated in response to the spare row decoder selecting signal (SRE) and a block control signal.
摘要:
A semiconductor memory device comprises a plurality of memory array blocks (B1 to B4). In each of the plurality of memory array blocks (B1 to B4), a line mode test is performed. Results of the line mode tests performed in the memory array blocks (B1 to B4) are outputted to corresponding match lines (ML1 to ML4). A flag compress (30) performs a logic operation on the test results outputted to the plurality of match lines (ML1 to ML4) and outputs the operation results as test results for the plurality of memory array blocks (B1 to B4) to the outside.
摘要:
In a memory cell array of a semiconductor memory device, a plurality of detection circuits (14, 15, 20) are provided in correspondence with a plurality of columns. An output line (L) is provided in common to the detection circuits (14, 15 20). The output line (L) is provided with plural junction points (n1 to nn) to which detection results from the detection circuits (14, 15 20) are separately applied. Dividing transistors (T1 to Tn) are provided between the junction points (n1 to nn). During testing, the word lines (WL1 to WLn) are selected sequentially. Test results for the memory cells (MC1 to MC4) connected to the selected word line are outputted at the corresponding junction points (n1 to nn), respectively. Simultaneously, a dividing transistor corresponding to the selected word line is rendered non-conductive, the remaining dividing transistors being rendered conductive. As a result, the output line (L) is divided into two parts at a portion of the non-conductive transistor. Detection results outputted to the respective divided parts of the output line (L) are monitored and a portion at which a detection result is changed in each divided part is found out.