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1.发明授权Bulk paper feeding device with intermediate conveyor for image forming device 有权具有成像装置中间输送机的散装纸送料装置公开(公告)号：US07308853B2
公开(公告)日：2007-12-18
申请号：US10796194
申请日：2004-03-10
IPC分类号： B41L13/00
CPC分类号： B65H5/34 , B65H5/062 , B65H2402/62 , B65H2405/312 , B65H2511/10 , B65H2511/514 , B65H2220/03 , B65H2220/01
摘要： Provided is a bulk paper feeding device with an intermediate conveyor comprising a carrier capable of carrying a large quantity of paper, a paper feeding mechanism for picking up and feeding one sheet at a time of the paper from the carrier, and an intermediate conveyor for transporting a sheet of paper fed from the feeding mechanism to the main paper feeding table of the paper feeder on the body of the image forming device or to the vicinity of a paper feeding port that faces the main paper feeding means of the paper feeder.
摘要翻译： 本发明提供一种具有中间输送机的散装纸供给装置，该中间输送机包括能够承载大量纸张的托架，用于在纸张从托架处拾取和供给一张纸的送纸机构，以及用于运送 从供纸机构供给到图像形成装置的主体上的给纸器的主纸张供给台的纸张或与供纸装置的主纸供给装置相对的供纸口附近。
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公开(公告)号：US07651090B2
公开(公告)日：2010-01-26
申请号：US11043261
申请日：2005-01-27
IPC分类号： B65H7/02
CPC分类号： B65H5/00 , B65H5/34 , B65H2511/10 , B65H2513/10 , B65H2557/63 , B65H2701/1311 , B65H2701/1313 , B65H2220/03 , B65H2220/01 , B65H2220/02
摘要： A paper conveyance apparatus includes a stacking portion; a feeding mechanism to extract and feed paper from the stacking portion one sheet at a time; and an intermediate portion for conveying the fed paper to the vicinity of a feeding port or feeding device of a main body of an image forming apparatus. The intermediate portion includes a plurality of conveyance devices and a plurality of paper detecting devices disposed from the upstream side to the downstream side of a conveyance path. The paper conveyance apparatus further includes a control device for reducing the conveyance speed of the plurality of conveyance devices when the leading edge of the paper is detected by a detecting device disposed at least one device further toward the upstream side than a paper detecting device disposed furthest downstream of the plurality of detecting devices.
摘要翻译： 纸张传送装置包括堆叠部分; 一次从堆叠部分提取和进给纸张的进给机构; 以及用于将进给的纸输送到图像形成装置的主体的进给口或进给装置附近的中间部分。 中间部分包括从输送路径的上游侧到下游侧设置的多个输送装置和多个纸张检测装置。 纸传送装置还包括一个控制装置，用于当通过设置在远离上游侧的至少一个装置的检测装置检测纸张的前端时，减少多个输送装置的输送速度，而不是最远设置的纸张检测装置 在多个检测装置的下游。
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公开(公告)号：US20050184443A1
公开(公告)日：2005-08-25
申请号：US11043261
申请日：2005-01-27
CPC分类号： B65H5/00 , B65H5/34 , B65H2511/10 , B65H2513/10 , B65H2557/63 , B65H2701/1311 , B65H2701/1313 , B65H2220/03 , B65H2220/01 , B65H2220/02
摘要： A paper conveyance apparatus includes a stacking portion; a feeding mechanism to extract and feed paper from the stacking portion one sheet at a time; and an intermediate portion for conveying the fed paper to the vicinity of a feeding port or feeding device of a main body of an image forming apparatus. The intermediate portion includes a plurality of conveyance devices and a plurality of paper detecting devices disposed from the upstream side to the downstream side of a conveyance path. The paper conveyance apparatus further includes a control device for reducing the conveyance speed of the plurality of conveyance devices when the leading edge of the paper is detected by a detecting device disposed at least one device further toward the upstream side than a paper detecting device disposed furthest downstream of the plurality of detecting devices.
摘要翻译： 纸张传送装置包括堆叠部分; 一次从堆叠部分提取和进给纸张的进给机构; 以及用于将进给的纸输送到图像形成装置的主体的进给口或进给装置附近的中间部分。 中间部分包括从输送路径的上游侧到下游侧设置的多个输送装置和多个纸张检测装置。 纸传送装置还包括一个控制装置，用于当通过设置在远离上游侧的至少一个装置的检测装置检测纸张的前端时，减少多个输送装置的输送速度，而不是最远设置的纸张检测装置 在多个检测装置的下游。
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公开(公告)号：US5227113A
公开(公告)日：1993-07-13
申请号：US365610
申请日：1989-06-13
申请人： Kenji Hamabe , Tomohiro Sakuraba , Hiroshi Kiyomoto , Kazuhiro Miura , Masato Ishibashi , Keiichi Satoh , Masataka Kumata
发明人： Kenji Hamabe , Tomohiro Sakuraba , Hiroshi Kiyomoto , Kazuhiro Miura , Masato Ishibashi , Keiichi Satoh , Masataka Kumata
摘要： A process for the high speed production of fiber reinforced plastic moldings forms several preforms which are solidified with chopped fibers, resin powders and a binder and are held between two preheating plates. Each plate is formed of a thin metal plate and will preheat the preforms to a temperature higher than the melting point of the resin. While the preforms are held between the preheating plates, the preforms are cold-pressed in a mold maintained at a temperature lower than the melting point of the resin for simultaneous impregnation and cooling of the resin. In addition, a preforming mold is placed in a vacuum chamber and precut chopped fibers are positioned in a tank. The preforming mold is placed into the tank and an exhauster is actuated to vacuumize both the vacuum chamber and the preforming mold, thereby adsorbing the chopped fibers in the tank onto the preforming mold and forming on the surface of the preforming mold an unsolidified preform comprising the chopped fibers. Resin powders are sprayed onto the preform for adsorption. A binder is subsequently applied under reduced pressure onto the preform. After drying the preform, the chopped fibers along with the binder are solidified.
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公开(公告)号：US4859531A
公开(公告)日：1989-08-22
申请号：US224930
申请日：1988-07-27
CPC分类号： C04B37/006 , B23K35/3006 , C04B37/026 , C04B2235/6562 , C04B2235/6581 , C04B2237/121 , C04B2237/122 , C04B2237/124 , C04B2237/125 , C04B2237/126 , C04B2237/361 , C04B2237/401 , C04B2237/403 , C04B2237/708 , C04B2237/72 , C04B2237/76 , Y10T428/12576 , Y10T428/261 , Y10T428/31678
摘要： A method for bonding a cubic boron nitride sintered compact to other cubic boron nitride sintered compact or to a body of shank material is disclosed. The method comprises forming a Ti layer of 0.01-1 .mu.m in thickness over a bonding interface between two cubic boron nitride sintered compacts or between a cubic boron nitride sintered compact and a body of shank material, forming a layer of Ni or Cu over the Ti layer to a thickness of 0.01-5 .mu.n, putting together the two cubic boron nitride sintered compacts or the cubic boron nitride sintered compact and the body of shank material with a 10-1,000 .mu.m foil of Al, Al-Ni alloy or Ag--Cu--In alloy being placed over the boding interface, and heating the cubic boron nitride sintered compact structure to temperatures above the meeting point of the metal foil and not exceeding 750.degree. C. in an inert atmosphere or in a vacuum.
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