摘要:
A process for the high speed production of fiber reinforced plastic moldings forms several preforms which are solidified with chopped fibers, resin powders and a binder and are held between two preheating plates. Each plate is formed of a thin metal plate and will preheat the preforms to a temperature higher than the melting point of the resin. While the preforms are held between the preheating plates, the preforms are cold-pressed in a mold maintained at a temperature lower than the melting point of the resin for simultaneous impregnation and cooling of the resin. In addition, a preforming mold is placed in a vacuum chamber and precut chopped fibers are positioned in a tank. The preforming mold is placed into the tank and an exhauster is actuated to vacuumize both the vacuum chamber and the preforming mold, thereby adsorbing the chopped fibers in the tank onto the preforming mold and forming on the surface of the preforming mold an unsolidified preform comprising the chopped fibers. Resin powders are sprayed onto the preform for adsorption. A binder is subsequently applied under reduced pressure onto the preform. After drying the preform, the chopped fibers along with the binder are solidified.
摘要:
Provided is a bulk paper feeding device with an intermediate conveyor comprising a carrier capable of carrying a large quantity of paper, a paper feeding mechanism for picking up and feeding one sheet at a time of the paper from the carrier, and an intermediate conveyor for transporting a sheet of paper fed from the feeding mechanism to the main paper feeding table of the paper feeder on the body of the image forming device or to the vicinity of a paper feeding port that faces the main paper feeding means of the paper feeder.
摘要:
A paper conveyance apparatus includes a stacking portion; a feeding mechanism to extract and feed paper from the stacking portion one sheet at a time; and an intermediate portion for conveying the fed paper to the vicinity of a feeding port or feeding device of a main body of an image forming apparatus. The intermediate portion includes a plurality of conveyance devices and a plurality of paper detecting devices disposed from the upstream side to the downstream side of a conveyance path. The paper conveyance apparatus further includes a control device for reducing the conveyance speed of the plurality of conveyance devices when the leading edge of the paper is detected by a detecting device disposed at least one device further toward the upstream side than a paper detecting device disposed furthest downstream of the plurality of detecting devices.
摘要:
A paper conveyance apparatus includes a stacking portion; a feeding mechanism to extract and feed paper from the stacking portion one sheet at a time; and an intermediate portion for conveying the fed paper to the vicinity of a feeding port or feeding device of a main body of an image forming apparatus. The intermediate portion includes a plurality of conveyance devices and a plurality of paper detecting devices disposed from the upstream side to the downstream side of a conveyance path. The paper conveyance apparatus further includes a control device for reducing the conveyance speed of the plurality of conveyance devices when the leading edge of the paper is detected by a detecting device disposed at least one device further toward the upstream side than a paper detecting device disposed furthest downstream of the plurality of detecting devices.
摘要:
A method for bonding a cubic boron nitride sintered compact to other cubic boron nitride sintered compact or to a body of shank material is disclosed. The method comprises forming a Ti layer of 0.01-1 .mu.m in thickness over a bonding interface between two cubic boron nitride sintered compacts or between a cubic boron nitride sintered compact and a body of shank material, forming a layer of Ni or Cu over the Ti layer to a thickness of 0.01-5 .mu.n, putting together the two cubic boron nitride sintered compacts or the cubic boron nitride sintered compact and the body of shank material with a 10-1,000 .mu.m foil of Al, Al-Ni alloy or Ag--Cu--In alloy being placed over the boding interface, and heating the cubic boron nitride sintered compact structure to temperatures above the meeting point of the metal foil and not exceeding 750.degree. C. in an inert atmosphere or in a vacuum.