-
公开(公告)号：US5486771A
公开(公告)日：1996-01-23
申请号：US363559
申请日：1994-12-23
CPC分类号： H05K7/1023 , G01R1/0433
摘要： This invention is directed to a mechanical, robotically operated burn-in socket testing apparatus for integrated circuit "chips", where such chips, as known in the art, are typically planar electronic devices. The apparatus, operationally mounted to a planar electronic board, such as a mother board, comprises a first frame member for mounting to the mother board, where the first frame member includes electrical means for engaging chip leads and applying electrical current thereto during the burn-in testing. A second frame member is disposed in sliding engagement with the first frame member, where the second frame member is movable from a first position to a second position. Finally, cooperative latching and camming means are provided between the first and second frame members to effect the movement between the first and second positions, and to securely hold the chip during burn-in, where the camming means includes a pivotal member movable from a remote position free of the chip to a position engaging the chip.
摘要翻译： 本发明涉及用于集成电路“芯片”的机械式机器人操作的老化插座测试装置，其中如本领域已知的这样的芯片通常是平面电子器件。 该装置可操作地安装在诸如母板的平面电子板上，包括用于安装到母板的第一框架构件，其中第一框架构件包括用于接合芯片引线并在燃烧期间向其施加电流的电气装置， 在测试。 第二框架构件设置成与第一框架构件滑动接合，其中第二框架构件可从第一位置移动到第二位置。 最后，协作锁定和凸轮装置设置在第一和第二框架构件之间以实现第一和第二位置之间的移动，并且在老化期间牢固地保持芯片，其中凸轮装置包括可从远程 位置没有芯片到与芯片接合的位置。
-
公开(公告)号：US5302853A
公开(公告)日：1994-04-12
申请号：US7932
申请日：1993-01-25
申请人： Keith L. Volz , Robert M. Renn , Frederick R. Deak , David C. Johnson , Warren A. Bates , Robert D. Irlbeck
发明人： Keith L. Volz , Robert M. Renn , Frederick R. Deak , David C. Johnson , Warren A. Bates , Robert D. Irlbeck
CPC分类号： H01L23/4093 , H01L2924/0002
摘要： A combination heat sink (18, 41, 43) and circuit interface comprises a metallic wafer (15) disposed between an integrated circuit (11) and a printed circuit board (14) in a land grid array package (10). A frame (13) for the integrated circuit (11) is nested within the heat sink (18, 41, 43) and a latch (30) is pivotably mounted on the frame (13) for retaining the overall package (10). The circuit interface comprises a plurality of flexible electrical connectors (19) mounted on the wafer (15).
摘要翻译： 组合散热器（18,41,43）和电路接口包括金属晶片（15），其设置在焊盘栅格阵列封装（10）中的集成电路（11）和印刷电路板（14）之间。 用于集成电路（11）的框架（13）嵌套在散热器（18,41,43）内，并且闩锁（30）可枢转地安装在框架（13）上，用于保持整个封装（10）。 电路接口包括安装在晶片（15）上的多个柔性电连接器（19）。
-
公开(公告)号：US5378169A
公开(公告)日：1995-01-03
申请号：US126848
申请日：1993-09-24
IPC分类号： H01R13/639 , H01R12/50 , H01R12/70 , H01R12/71 , H01R12/83 , H01R13/627 , H01R33/76 , H01R23/68
CPC分类号： H01R23/6873 , H01R12/714 , H01R12/83 , H01R12/7005 , H01R12/716 , H01R13/6273 , H01R2201/04 , H01R2201/06
摘要： This invention is directed to an electrical connector for sequentially connecting plural contacts provided along the respective mating surfaces of a pair of planar electronic devices, where the devices are joined to or mounted within a pair of pivotally arranged housing members. The connector comprises a first housing mounted to one of the planar devices, such as a mother board, where first housing includes an open end and a closed end, and a second housing mounting the other planar electronic device, such as a daughter board, second housing includes an open end and a closed end, and that the respective closed ends include cooperative means for hingely engaging each other. By this arrangement, as the planar electronic devices are pivotally moved about the cooperative means from a nonparallel position to a parallel position of electrical engagement, the respective plural contacts between the planar electronic devices enter into engagement in a sequentially predetermined order.
摘要翻译： 本发明涉及一种电连接器，用于顺序地连接沿着一对平面电子装置的各个配合表面设置的多个触点，其中装置连接到或安装在一对枢转布置的壳体构件内。 连接器包括安装到诸如母板之类的平面装置之一的第一壳体，其中第一壳体包括开口端和闭合端，以及安装另一平面电子装置（例如子板）的第二壳体，第二壳体 壳体包括开口端和封闭端，并且相应的封闭端包括用于铰接地彼此接合的协作装置。 通过这种布置，当平面电子装置围绕协作装置从不平行位置枢转地移动到电接合的平行位置时，平面电子装置之间的相应多个触点按顺序地预定的顺序进行接合。
-
公开(公告)号：US5402316A
公开(公告)日：1995-03-28
申请号：US56522
申请日：1993-04-28
申请人： Keith L. Volz , Frederick R. Deak , Robert M. Renn , Robert D. Irlbeck , David C. Johnson , Warren A. Bates
发明人： Keith L. Volz , Frederick R. Deak , Robert M. Renn , Robert D. Irlbeck , David C. Johnson , Warren A. Bates
CPC分类号： H01R12/714 , H01R12/87
摘要： A docking station (10) slidably receives a device (12) to provide make, break or tap functions, respectively, in a circuit interface. The circuit interface includes a pair of connector housings (17, 18) provided with flexible (or compressible) electrical connectors (19, 20), respectively. A camming member (28, 29; 31, 32; 44) separates the connector housings (17, 18) as the device (12) is slidably inserted into the docking station (10), thereby assuring a substantially zero insertion force on the circuit interface. Preferably, the circuit interface is between the flexible electrical connectors (19, 20), a printed circuit board (13), and a flexible etched circuit (15). The flexible etched circuit (15) is provided with a stiffener (24) resiliently biased by springs (27).
摘要翻译： 坞站（10）可滑动地接收装置（12），以分别在电路接口中提供制动，断路或分接功能。 电路接口包括分别设置有柔性（或可压缩）电连接器（19,20）的一对连接器壳体（17,18）。 当装置（12）可滑动地插入到对接站（10）中时，凸轮构件（28,29; 31,32; 44）分离连接器壳体（17,18），从而确保电路上的基本上零的插入力 接口。 优选地，电路接口位于柔性电连接器（19,20），印刷电路板（13）和柔性蚀刻电路（15）之间。 柔性蚀刻电路（15）设置有由弹簧（27）弹性偏压的加强件（24）。
-
公开(公告)号：US5493237A
公开(公告)日：1996-02-20
申请号：US250267
申请日：1994-05-27
CPC分类号： G01R1/0483
摘要： This disclosure relates to testing apparatus (10), preferably an LGA burn-in test socket, for an integrated chip (28). The apparatus (10), arranged for mounting on a planar electronic device (46), such as a printed circuit board, includes a frame member (12) for mounting to the planar electronic device (46), where the frame member (12) includes a central opening (22) extending between first and second surfaces, and dimensionally sized to receive the chip (28). Recesses (35) are provided for receiving an electronic interface member (18) mounting plural flexible electrical connectors (106), such as an elastomeric connector, as known in the art, for engaging the traces or pads of the chip to the planar device during testing. Further, plural recesses (40) extend from at least the first surface, where each recess includes a compression spring (41). Positioned over and for engagement with the frame member is a floatably mounted force applying member (14) having first and second parallel surfaces. A central opening (75), concentric with the central opening ( 22) of the frame member (12) is present. Additionally, plural posts (62) extend from the second parallel surface for receipt in respective recesses (44). Finally, camming levers (16) are provided for urging the force applying member toward the frame member, along with pivotal pusher members (78) responsive to the camming levers to engage and secure the chip during testing thereof.
摘要翻译： 本公开涉及用于集成芯片（28）的测试装置（10），优选地是LGA老化测试插座。 布置成安装在诸如印刷电路板的平面电子设备（46）上的设备（10）包括用于安装到平面电子设备（46）的框架构件（12），其中框架构件（12） 包括在第一表面和第二表面之间延伸的中心开口（22），并且尺寸尺寸适于接纳芯片（28）。 凹部（35）被设置用于接收安装多个柔性电连接器（106）的电子接口部件（18），所述多个柔性电连接器（106）如本领域已知的用于将芯片的迹线或焊盘接合到平面器件的弹性连接器 测试。 此外，多个凹部（40）从至少第一表面延伸，其中每个凹部包括压缩弹簧（41）。 定位在框架构件上并用于与框架构件接合的是具有第一和第二平行表面的可浮动安装的施力构件（14）。 存在与框架构件（12）的中心开口（22）同心的中心开口（75）。 此外，多个柱（62）从第二平行表面延伸以便接收在相应的凹部（44）中。 最后，提供凸轮杆（16），用于响应于所述凸轮杆将所述施力部件朝着所述框架构件推动，以及枢轴推动器构件（78），以在其测试期间接合和固定所述芯片。
-
公开(公告)号：US5308249A
公开(公告)日：1994-05-03
申请号：US78665
申请日：1993-06-16
申请人： Robert M. Renn , Robert D. Irlbeck , Frederick R. Deak , Keith L. Volz , David C. Johnson , Warren A. Bates
发明人： Robert M. Renn , Robert D. Irlbeck , Frederick R. Deak , Keith L. Volz , David C. Johnson , Warren A. Bates
CPC分类号： H01R12/79 , H01R12/89 , H01R12/7005
摘要： The invention is directed to an electronic assembly, such as a backplane assembly of the type including a mother board, a connector housing mounted on the mother board, and a daughter board slidably insertable into the connector housing for electrical interconnection to the mother board. The assembly comprises an elongated connector housing having a pair of parallelly disposed spaced apart housing members defining at least one slot therebetween for receiving the daughter board. A force generating member is disposed within the slot, where the force generating members comprises a pair of resilient, essentially L-shaped members. One leg of each of the L-shaped members is fixedly disposed between the mother board and the housing members, while the others of the legs upstand within the slot in a spaced apart relationship to receive the daughter board therebetween, the upstanding legs including at least one pair of opposing elastomeric members to apply a compressive pressure to said daughter board. Further, a flexible circuit element is mounted on the force generating member and is operatively disposed to electrically interconnect the daughter board to the mother board. A preferred feature thereof is the provision of a camming means on the upstanding legs to allow insertion of the daughter board without causing damage to the circuitry on the flexible circuit element, preferable in the form of a flat film.
摘要翻译： 本发明涉及一种电子组件，例如背板组件，其类型包括母板，安装在母板上的连接器壳体，以及可滑动地插入到连接器壳体中以与母板电连接的子板。 组件包括细长的连接器壳体，其具有一对平行设置的间隔开的壳体构件，其在其间限定了至少一个狭槽，用于接收子板。 力产生构件设置在槽内，其中力产生构件包括一对弹性的，基本上为L形的构件。 每个L形构件的一条腿固定地设置在母板和壳体构件之间，而其他腿以间隔开的关系在槽内立起，以在其间接纳子板，直立腿至少包括 一对相对的弹性体构件以向所述子板施加压缩压力。 此外，柔性电路元件安装在力产生构件上并且可操作地设置成将子板电连接到母板。 其优选的特征是在直立腿上设置凸轮装置以允许子板的插入，而不会损坏柔性电路元件上的电路，优选为平板形式。
-
公开(公告)号：US5273441A
公开(公告)日：1993-12-28
申请号：US975350
申请日：1992-11-12
申请人： Keith L. Volz , Robert M. Renn , Frederick R. Deak , Warren A. Bates , David C. Johnson , Robert D. Irlbeck
发明人： Keith L. Volz , Robert M. Renn , Frederick R. Deak , Warren A. Bates , David C. Johnson , Robert D. Irlbeck
CPC分类号： H05K7/1425 , G01R1/0433
摘要： A burn-in socket for integrated circuit chips has a clamping means actuated by a thermally-reactive resilient means, operative during the burn-in cycle itself, such that the chip frames are retained and good electrical contact with the chip leads is maintained during burn-in.
摘要翻译： 用于集成电路芯片的老化插座具有由热反应性弹性装置驱动的夹紧装置，其在老化周期本身期间操作，使得芯片框架被保持并且在烧录期间保持与芯片引线的良好电接触 -在。
-
公开(公告)号：US5584707A
公开(公告)日：1996-12-17
申请号：US218549
申请日：1994-03-28
CPC分类号： H01L23/32 , H01L2924/0002
摘要： This invention is directed to a socket system for the receipt of an integrated circuit "chip", where such a chip, as known in the art, typically is a planar electronic device having plural leads extending from the periphery thereof. The system, operatively mounted to a planar electronic device, such as a motherboard, comprises a frame having a central recess defined by converging side walls and terminating in a floor, and plural slots about the periphery of the floor for receiving elastomeric connectors for electrically interconnecting the chip leads to the mother board. Overriding the frame, for mechanical engagement therewith, is a force applying member, where such member includes plural ribs extending downwardly from the member and positioned to initially contact the respective converging side walls when the force applying member is caused to mechanically engage the frame. In the engaging mode, the ribs are caused to ride along the converging walls and flex inwardly towards the floor slots into which the chip leads lie. By this action the ribs apply a lateral force to and wipe the leads, while applying a vertical force to the ends of the chip leads overlying the elastomeric connector.
摘要翻译： 本发明涉及一种用于接收集成电路“芯片”的插座系统，其中如本领域已知的这样的芯片通常是具有从其周边延伸的多个引线的平面电子器件。 可操作地安装到诸如主板的平面电子设备的系统包括具有由会聚的侧壁限定并终止于地板中的中心凹部的框架，以及围绕地板的周边的多个槽，用于接收用于电互连的弹性连接器 芯片通向主板。 覆盖框架用于与其机械接合是施力构件，其中这种构件包括从构件向下延伸的多个肋，并且当使施力构件机械地接合框架时，该位置被定位成最初接触相应的会聚侧壁。 在接合模式下，使肋沿着会聚壁骑行并朝向芯片引线所在的地板槽向内弯曲。 通过这种作用，肋向引线施加横向力并且擦拭引线，同时向覆盖弹性体连接器的芯片引线的端部施加垂直力。
-
公开(公告)号：US5531615A
公开(公告)日：1996-07-02
申请号：US372702
申请日：1995-01-13
申请人： Robert D. Irlbeck , Robert M. Renn , Keith L. Volz , Frederick R. Deak , David C. Johnson , Warren A. Bates
发明人： Robert D. Irlbeck , Robert M. Renn , Keith L. Volz , Frederick R. Deak , David C. Johnson , Warren A. Bates
CPC分类号： H01R12/714 , H01R12/79 , H01R31/00
摘要： The invention is directed to an electronic docking connector for edge mounting an electronic device, such as a daughter board, to a mother board. The connector comprises a pair of housing members assembled to define an elongated slot planarly aligned with the edge of the mother board. Mounted therein is a pair of opposed force applying, resilient spring members operatively mounted for receiving and applying a compressive force against the electronic device. A flexible film member, containing electrical circuitry thereon, is also mounted within said housing members for electrically interconnecting corresponding circuitry on the mother board, and the electronic device. As an alternative, a dielectric insert is disposed between each spring member and its corresponding flexible film to reduce or eliminate cross talk therein.
摘要翻译： 本发明涉及一种用于将诸如子板之类的电子设备边缘安装到母板的电子对接连接器。 连接器包括一对壳体构件，其组装成限定与母板的边缘平行排列的细长槽。 安装在其中的是一对相对的力施加的弹性弹簧构件，其可操作地安装用于接收和施加抵靠电子装置的压缩力。 在其上包含电路的柔性膜构件也安装在所述壳体构件内，用于电连接母板上的对应电路和电子装置。 作为替代，电介质插入件设置在每个弹簧构件和其相应的柔性膜之间以减少或消除其中的串扰。
-
公开(公告)号：US5452183A
公开(公告)日：1995-09-19
申请号：US218550
申请日：1994-03-28
CPC分类号： H01L23/32 , H01L2924/0002
摘要： This invention is directed to a chip carrier system for mounting to a first planar electronic device, such as a motherboard or test fixture, where first planar electronic device is provided with a planar, electrical interconnection interface mounted thereto. The chip carrier system includes a frame comprising a peripheral body portion defined by upper and lower planar surfaces, a recess in the lower planar surface to receive the planar, electrical interconnection interface, a central recess terminating in a floor to receive a second planar electronic device, such as an integrated circuit chip, having leads extending therefrom, converging side walls extending from the upper planar surface down to the floor, and plural through slots for receiving the leads. Cooperating therewith is a force applying member adapted to provide a normal force to the second planar electronic device and be mechanically secured to the frame. The force applying member includes plural ribs arranged to overlie portions of the converging side walls, whereby as the force applying member is brought into engagement with the frame, the ribs, in contact with the converging side walls, are cammed inwardly into contact with the leads of the second planar electronic device to apply a normal force thereto in contact with a resilient electrical connector associated with the planar, electrical interconnection interface.
摘要翻译： 本发明涉及一种用于安装到诸如母板或测试夹具的第一平面电子装置的芯片载体系统，其中第一平面电子装置设置有安装在其上的平面电互连接口。 芯片载体系统包括框架，该框架包括由上下平面表面限定的周边主体部分，下平面表面中的凹部，用于接收平面电互连接口;终止于地板中的中央凹部，以接纳第二平面电子设备 ，例如具有从其延伸的引线的集成电路芯片，从上平面表面向下延伸到地板的会聚侧壁，以及用于接收引线的多个通槽。 与其配合是适于向第二平面电子设备提供法向力并且被机械地固定到框架的施力构件。 力施加构件包括多个肋，所述多个肋被布置成覆盖会聚侧壁的一部分，由此当施力构件与框架接合时，与会聚侧壁接触的肋被向内凸起以与引线接触 的第二平面电子设备，以向与平面电互连接口相关联的弹性电连接器接触施加法向力。
-
-
-
-
-
-
-
-
-
搜索结果
29 条记录 (耗时 0.049 秒)
