公开(公告)号：US20170178818A1

公开(公告)日：2017-06-22

申请号：US15443787

申请日：2017-02-27

Applicant: KEMET Electronics Corporation

Inventor： Brandon Summey ,  Peter Blais ,  Yanming Liu

IPC: H01G4/38 ,  H01G4/008

CPC classification number: H01G4/38 ,  H01G4/005 ,  H01G4/008 ,  H01G9/0029 ,  H01G9/055 ,  Y10T29/302 ,  Y10T29/43

Abstract: An improved array of capacitors is provided wherein the improvement includes improved electrical properties and improved packing density. The array has an anode foil and a dielectric on a surface of the anode foil. A multiplicity of areas are defined on the dielectric wherein each area is circumvented by an isolation material and the isolation material extends through the dielectric. A conductive cathode layer in each area forms a capacitive couple. At least one substrate vacancy is in the anode foil and the substrate vacancy electrically isolates adjacent anodes of adjacent capacitive couples. A carrier film is attached to the capacitive couples.

公开(公告)号：US10283276B2

公开(公告)日：2019-05-07

申请号：US15443787

申请日：2017-02-27

Applicant: KEMET Electronics Corporation

Inventor： Brandon Summey ,  Peter Blais ,  Yanming Liu

IPC: H01G4/38 ,  H01G4/005 ,  H01G9/00 ,  H01G9/055 ,  H01G4/008

Abstract: An improved array of capacitors is provided wherein the improvement includes improved electrical properties and improved packing density. The array has an anode foil and a dielectric on a surface of the anode foil. A multiplicity of areas are defined on the dielectric wherein each area is circumvented by an isolation material and the isolation material extends through the dielectric. A conductive cathode layer in each area forms a capacitive couple. At least one substrate vacancy is in the anode foil and the substrate vacancy electrically isolates adjacent anodes of adjacent capacitive couples. A carrier film is attached to the capacitive couples.

公开(公告)号：US20240237220A1

公开(公告)日：2024-07-11

申请号：US18615432

申请日：2024-03-25

Applicant: KEMET Electronics Corporation

Inventor： Brandon Summey ,  Peter Blais ,  Robert Ramsbottom ,  Jeffrey Poltorak ,  Courtney Elliott

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K1/183 ,  H05K1/028 ,  H05K1/0366 ,  H05K1/115 ,  H05K2201/10015

Abstract: An improved circuit board core material, and method of making the circuit board core material, is provided wherein the circuit board core material is particularly suitable for use in a circuit board. The circuit board core material comprises a laminate. The laminate comprises a prepreg layer with a first clad layer on the prepreg layer wherein the prepreg layer comprises a pocket. An electronic component is in the pocket wherein the electronic component comprises a first external termination and a second external termination. The first external termination is laminated to, and in electrical contact with, the first clad layer and said second external termination is in electrical contact with a conductor.

公开(公告)号：US09741494B2

公开(公告)日：2017-08-22

申请号：US14180842

申请日：2014-02-14

Applicant: Kemet Electronics Corporation

Inventor： Brandon Summey ,  Peter Blais ,  Yanming Liu

IPC: H01G4/38 ,  H01G9/00 ,  H01G4/005 ,  H01G9/055

CPC classification number: H01G4/38 ,  H01G4/005 ,  H01G4/008 ,  H01G9/0029 ,  H01G9/055 ,  Y10T29/302 ,  Y10T29/43

Abstract: An improved array of capacitors is provided wherein the improvement includes improved electrical properties and improved packing density. The array has an anode foil and a dielectric on a surface of the anode foil. A multiplicity of areas are defined on the dielectric wherein each area is circumvented by an isolation material and the isolation material extends through the dielectric. A conductive cathode layer in each area forms a capacitive couple. At least one substrate vacancy is in the anode foil and the substrate vacancy electrically isolates adjacent anodes of adjacent capacitive couples. A carrier film is attached to the capacitive couples.