摘要:
An advanced liquid cooling system with an advanced cooling characteristic and high reliability, which is small in size and light in weight, is provided. In the liquid cooling system, heating units 2, which are semiconductors, are fixed on a base having high thermal conductivity. A liquid-passage hole 7 in the base 5 allows a liquid refrigerant 6 to pass through. Since the base 5 is made of material with high thermal conductivity, and the liquid-passage hole 7 extends in the vicinity of the heating unit 2 in the base, it is sufficient to transfer the heat of heating unit 2 the liquid refrigerant 6. This enables control of the temperature rise of the heating unit to be maintained low.
摘要:
The present invention provides a thermally conductive grease composition which scarcely increases in hardness during high-temperature heating and has a minimized reduction in growth, containing: (A) an organopolysiloxane including at least two alkenyl groups per molecule, the 25° C. kinetic viscosity being 5,000 to 100,000 mm2/s; (B) a hydrolysable methyl polysiloxane, trifunctional at one terminus, represented by general formula (1) (R1 is a C1-6 alkyl group, and a is an integer 5 to 100); (C) a thermally conductive filler having a thermal conductivity of 10 W/m·° C. or greater; (D) an organohydrogenpolysiloxane containing two to five hydrogen atoms directly bonded to a silicon atom (Si—H group) per molecule; (E) an adhesion promoter having a triazine ring and at least one alkenyl group per molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.
摘要:
A thermally conductive silicone grease composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a kinetic viscosity of 5,000 to 100,000 mm2/s at 25° C.; (B) a hydrolyzable methylpolysiloxane having a trifunctional termination at one end and represented by the following general formula (2): wherein R2 represents an alkyl group having 1 to 6 carbon atoms and b is an integer of 5 to 100; (C) a thermally conductive filler having a thermal conductivity of at least 10 W/m·° C.; (D) an organohydrogenpolysiloxane containing from 2 to 5 hydrogen atoms in one molecule directly bound to silicon atoms (Si—H groups); (E) a bonding aid having a triazine ring and at least one alkenyl group in one molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.
摘要:
A thermally conductive silicone grease composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a kinetic viscosity of 5,000 to 100,000 mm2/s at 25° C.; (B) a hydrolyzable methylpolysiloxane having a trifunctional termination at one end and represented by the following general formula (2): wherein R2 represents an alkyl group having 1 to 6 carbon atoms and b is an integer of 5 to 100; (C) a thermally conductive filler having a thermal conductivity of at least 10 W/m·° C.; (D) an organohydrogenpolysiloxane containing from 2 to 5 hydrogen atoms in one molecule directly bound to silicon atoms (Si—H groups); (E) a bonding aid having a triazine ring and at least one alkenyl group in one molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.
摘要:
In an infrared radiation source containing hot-pressed molybdenum disilicide reinforced with silicon carbide whiskers as the illuminant thereof, terminal portions of the illuminant having a protective dense silica film of 5 to 20 .mu.m in thickness formed on the surface thereof which portions are to be heated at a temperature of 400 to 800.degree. C. are either set to have a current density of at most 12 A/mm.sup.2 or disposed in dry air having a relative humidity at 25.degree. C. of at most 30% (absolute humidity: 0.00588). As a result, the low-temperature oxidation phenomenon that would otherwise be developed in the terminal portions of the illuminant is suppressed. Thus, there can be obtained an infrared radiation source containing an illuminant made of molybdenum disilicide reinforced with silicon carbide whiskers and having a long serviceable life span.
摘要:
The present invention provides a thermally conductive grease composition which scarcely increases in hardness during high-temperature heating and has a minimized reduction in growth, containing: (A) an organopolysiloxane including at least two alkenyl groups per molecule, the 25° C. kinetic viscosity being 5,000 to 100,000 mm2/s; (B) a hydrolysable methyl polysiloxane, trifunctional at one terminus, represented by general formula (1) (R1 is a C1-6 alkyl group, and a is an integer 5 to 100); (C) a thermally conductive filler having a thermal conductivity of 10 W/m·° C. or greater; (D) an organohydrogenpolysiloxane containing two to five hydrogen atoms directly bonded to a silicon atom (Si—H group) per molecule; (E) an adhesion promoter having a triazine ring and at least one alkenyl group per molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.
摘要:
A ceramic heating element includes a heat-generating portion 1 formed of a ceramic composite material with 3 to 40 vol. % of silicon carbide (SiC) whiskers and the balance substantially of molybdenum disilicide (MoSi.sub.2), and electrode portions 2a and 2b provided on both ends of the heat-generating portion 1.