摘要:
A process for the production of a bifunctional phenylene ether oligomer compound having no amine adduct represented by the formula (1), which process comprises oxidatively polymerizing a bivalent phenol and a monovalent phenol in the presence of a copper-containing catalyst and a tertiary amine, a secondary amine having a secondary alkyl group, a tertiary alkyl group or an aryl group, or a mixture of both, [Chemical Formula 1] wherein R1, R2, R3, R7, R8, R9 and R10 are the same or different and represent a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, R4, R5, R6, R11 and R12 are the same or different and represent a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and each of m and n is an integer of from 0 to 25, provided that at least one of a and b is not 0.
摘要翻译:一种制备不具有由式(1)表示的胺加合物的双官能亚苯基醚低聚物化合物的方法,该方法包括在含铜催化剂和叔胺的存在下使二价苯酚和一价酚氧化聚合, 具有仲烷基,叔烷基或芳基的仲胺或两者的混合物,[化学式1]其中R 1,R 2,R 2, R 3,R 7,R 8,R 9和R 10均为 相同或不同,表示卤素原子,碳原子数6以下的烷基或苯基,R 4,R 5,R 6, R 11,R 12和R 12相同或不同,表示氢原子,卤素原子,碳原子数6以下的烷基或苯基 基团,m和n各自为0至25的整数,条件是a和b中的至少一个不为0。
摘要:
A process for producing 2,2′,3,3′,5,5′-hexamethyl-[1,1′-biphenyl]-4,4′-diol, which process comprises, while setting a pH of a reaction liquid containing an alkaline aqueous solution, a surfactant, a copper catalyst and 2,3,6-trimethylphenol during a reaction in the range of from 8 to 14 and controlling the variation range of the pH of the reaction liquid within ±1, oxidatively coupling the 2,3,6-trimethylphenol with an oxygen-containing gas, and a process for producing a bifunctional phenylene ether oligomer compound having a controlled average molecular weight, comprising carrying out oxidation polymerization under a proper oxygen concentration.
摘要:
The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
摘要:
The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
摘要:
The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
摘要:
The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
摘要:
The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
摘要:
The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
摘要:
The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
摘要:
The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.