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1.发明授权公开(公告)号：US07679915B2
公开(公告)日：2010-03-16
申请号：US11663191
申请日：2005-08-22
CPC分类号： H02M7/003 , H01L2924/0002 , H05K7/209 , Y10T29/49002 , H01L2924/00
摘要： There is provided a motor control apparatus in which a size of the apparatus can easily be reduced, a work for aligning a power semiconductor module with a substrate can be eliminated and an assembling property can be enhanced.In a motor control apparatus in which a power semiconductor module adhering to a heat sink is mounted on a first substrate, a spacer is provided between the heat sink and the substrate and the power semiconductor module is disposed in the spacer. Moreover, an edge part of a hole has such a structure as to block a space between a terminal protruded from a side portion of the power semiconductor module and the heat sink.
摘要翻译： 提供了一种电动机控制装置，其中可以容易地减小装置的尺寸，可以消除用于对准功率半导体模块与衬底的工作，并且可以提高组装性能。 在其中将附着在散热片上的功率半导体模块安装在第一基板上的电动机控制装置中，在散热片和基板之间设置间隔件，功率半导体模块设置在间隔件中。 此外，孔的边缘部分具有阻挡从功率半导体模块的侧部突出的端子与散热器之间的空间的结构。
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公开(公告)号：USD561095S1
公开(公告)日：2008-02-05
申请号：US29278750
申请日：2007-04-09
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公开(公告)号：USD455399S1
公开(公告)日：2002-04-09
申请号：US29133167
申请日：2000-11-22
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公开(公告)号：US07898806B2
公开(公告)日：2011-03-01
申请号：US12439767
申请日：2007-08-24
申请人： Kenji Isomoto
发明人： Kenji Isomoto
IPC分类号： H05K7/20
CPC分类号： H02M7/003 , H05K7/20918
摘要： There is provided a motor controller that can easily reduce the size and manufacturing cost of a motor controller by reducing the size of a heat sink without increasing the number of parts much.The motor controller includes a heat sink, a plurality of power semiconductor modules that is in close contact with the heat sink, a substrate (6) that is electrically connected to the plurality of power semiconductor modules, and a fan (8) that generates the flow of external air and supplies cooling air to the heat sink. The heat sink is formed by the combination of two kinds of heat sinks that include a first heat sink (9) and a second heat sink (10), and at least one of the power semiconductor modules is in close contact with each of the first and second heat sinks (9) and (10).
摘要翻译： 提供了一种电动机控制器，其可以通过减少散热器的尺寸而不增加零件数量而容易地减小电动机控制器的尺寸和制造成本。 马达控制器包括散热器，与散热器紧密接触的多个功率半导体模块，电连接到多个功率半导体模块的基板（6）和产生该多个功率半导体模块的风扇（8） 外部空气流动，并向散热片提供冷却空气。 散热器由包括第一散热器（9）和第二散热器（10）的两种散热器的组合形成，并且功率半导体模块中的至少一个与第一散热器（9）和第二散热器 和第二散热器（9）和（10）。
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公开(公告)号：US20070258194A1
公开(公告)日：2007-11-08
申请号：US11630414
申请日：2005-06-02
申请人： Hideharu Okayama , Kenji Isomoto , Shuhei Nohara , Toshio Omata
发明人： Hideharu Okayama , Kenji Isomoto , Shuhei Nohara , Toshio Omata
IPC分类号： H02B1/00
CPC分类号： H02M7/003 , H01L25/162 , H01L2924/0002 , H05K1/0203 , H05K1/144 , H05K7/209 , H05K2201/1056 , H05K2201/2018 , H05K2201/2036 , H01L2924/00
摘要： There is provided a motor controller which eliminates a positioning operation between a power semiconductor element and a base plate to improve assemblability. A motor controller has a power semiconductor element (3) closely contacted with a heatsink (1) and mounted in a first base plate (4), wherein a spacer (2) having an engaging section (2e) formed therein as a hole for the power semiconductor element (3) is interposed between the heatsink (1) and the base plate (4), and the power semiconductor element (3) is positioned in the spacer (2). Further, the peripheral wall of the hole is arranged so as to shut off a space between a terminal projecting from the side of the power semiconductor element (3) and the heatsink (1).
摘要翻译： 提供了一种电动机控制器，其消除功率半导体元件和基板之间的定位操作，以改善组装性。 电动机控制器具有与散热器（1）紧密接触并安装在第一基板（4）中的功率半导体元件（3），其中具有形成在其中的接合部分（2e）作为孔的间隔件（2） 功率半导体元件（3）插入在散热器（1）和基板（4）之间，功率半导体元件（3）位于间隔物（2）中。 此外，孔的周壁布置成切断从功率半导体元件（3）的侧面突出的端子与散热器（1）之间的空间。
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公开(公告)号：US5930656A
公开(公告)日：1999-07-27
申请号：US953639
申请日：1997-10-17
IPC分类号： C30B25/02 , H01L21/205 , H01L33/00 , H01L33/44 , H01L21/31
CPC分类号： H01L33/44 , C30B25/02 , C30B29/403 , C30B29/406 , H01L21/02381 , H01L21/0242 , H01L21/02458 , H01L21/02505 , H01L21/0254 , H01L21/02576 , H01L21/02579 , H01L21/0262 , H01L33/007 , Y10S438/913 , Y10S438/93 , Y10S438/958
摘要： A substrate for forming a compound semiconductor device is placed in a reaction chamber. An MOCVD method or a GS-MBE method is used to grow compound semiconductor layers on the substrate. The grown layers include, for example, a GaN buffer layer, an n-GaN layer, an InGaN active layer, a p-AlGaN layer, and a p.sup.+ -GaN contact layer. After the growth of the layers, the substrate is kept in the reaction chamber, and a passivation film of, for example, SiNx, SiO2, or SiON is formed on top of the grown layers according to a CVD or GS-MBE method. Since the top of the grown layers is not exposed to air outside the reaction chamber, no oxidization or contamination occurs on the top of the grown layers. The compound semiconductor device is manufactured through simpler processes compared with a prior art that needs separate apparatuses for growing and forming the layers and passivation film.
摘要翻译： 将用于形成化合物半导体器件的衬底放置在反应室中。 使用MOCVD方法或GS-MBE方法来在衬底上生长化合物半导体层。 生长层包括例如GaN缓冲层，n-GaN层，InGaN有源层，p-AlGaN层和p + -GaN接触层。 在层的生长之后，将基板保持在反应室中，并且根据CVD或GS-MBE方法在生长层的顶部上形成例如SiN x，SiO 2或SiON的钝化膜。 由于生长层的顶部不暴露于反应室外部的空气，因此在生长层的顶部不发生氧化或污染。 与现有技术相比，通过更简单的工艺制造复合半导体器件，其需要用于生长和形成层和钝化膜的单独的装置。
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公开(公告)号：USD562233S1
公开(公告)日：2008-02-19
申请号：US29278747
申请日：2007-04-09
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8.发明申请公开(公告)号：US20080007919A1
公开(公告)日：2008-01-10
申请号：US11663191
申请日：2005-08-22
CPC分类号： H02M7/003 , H01L2924/0002 , H05K7/209 , Y10T29/49002 , H01L2924/00
摘要： There is provided a motor control apparatus in which a size of the apparatus can easily be reduced, a work for aligning a power semiconductor module with a substrate can be eliminated and an assembling property can be enhanced. In a motor control apparatus in which a power semiconductor module adhering to a heat sink is mounted on a first substrate, a spacer is provided between the heat sink and the substrate and the power semiconductor module is disposed in the spacer. Moreover, an edge part of a hole has such a structure as to block a space between a terminal protruded from a side portion of the power semiconductor module and the heat sink.
摘要翻译： 提供了一种电动机控制装置，其中可以容易地减小装置的尺寸，可以消除用于对准功率半导体模块与衬底的工作，并且可以提高组装性能。 在其中将附着在散热片上的功率半导体模块安装在第一基板上的电动机控制装置中，在散热片和基板之间设置间隔件，功率半导体模块设置在间隔件中。 此外，孔的边缘部分具有阻挡从功率半导体模块的侧部突出的端子与散热器之间的空间的结构。
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公开(公告)号：US06921328B1
公开(公告)日：2005-07-26
申请号：US09700957
申请日：1999-05-24
申请人： Shuhei Nohara , Hiromi Imamura , Masayuki Ono , Kenji Isomoto
发明人： Shuhei Nohara , Hiromi Imamura , Masayuki Ono , Kenji Isomoto
CPC分类号： H05K7/20172
摘要： A cooling device for an electric equipment which is excellent in cooling efficiency and low in noise and permits easy mounting of a cooling fan and a fan guard, comprising a heat sink (1) having a U-shaped frame (4) consisting of a flat part (2) and side parts (3) disposed on the opposite sides of the flat part (2), fins (5) formed on the frame (4) and fan guard mounting holes (6) formed in the side parts (3) of the frame (4); a cooling fan (7) having an engaging recess (8) in the side thereof; and a U-shaped fan guard (9) consisting of a fan guard body (10) and side plates (11) disposed on the opposite ends of the fan guard body (10); wherein a lattice body (12) is provided on the fan guard body (10), an air guide (17) at the tip end of each side plate (11), a fan mounting engaging projection (13) on the inner side surface of each side plate for clamping and retaining by engaging the cooling fan (7) and a projection support (15), having an engaging projection (14) for mounting the fan guard (9) to the heat sink (1), on the outer side surface of each side plate.
摘要翻译： 一种电气设备的冷却装置，其冷却效率优异，噪音低，并且容易安装冷却风扇和风扇防护装置，其包括具有U形框架（4）的散热器（1），所述U形框架（4）由平面 设置在平坦部分（2）的相对侧上的部分（2）和侧部（3），形成在框架（4）上的翅片（5）和形成在侧面部分（3）中的风扇防护装置安装孔 的框架（4）; 冷却风扇（7），其侧面具有接合凹部（8）; 以及由风扇防护体（10）和设置在风扇防护体（10）的相对端上的侧板（11）组成的U形风扇防护罩（9）。 其特征在于，在所述风扇防护体（10）上设有格子体（12），在所述侧板（11）的前端设有空气引导部（17），在所述风扇安装接合突起（13）的内侧面 每个侧板通过接合冷却风扇（7）和突出支撑件（15）夹紧和保持，其具有用于将风扇防护件（9）安装到散热器（1）的外侧的接合突起（14） 每个侧板的表面。
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公开(公告)号：US07957143B2
公开(公告)日：2011-06-07
申请号：US12440059
申请日：2007-08-24
申请人： Kenji Isomoto
发明人： Kenji Isomoto
IPC分类号： H05K7/20
CPC分类号： H02M7/003 , H05K7/20918
摘要： A motor controller, which is inexpensive and has small size, is provided by reducing the size of a heat sink used in the motor controller and the number of all parts of the motor controller, wherein said motor controller includes a heat sink, a power semiconductor modules that is in close contact with the heat sink, a substrate (4) that is electrically connected to the power semiconductor module, and a fan (6) that generates the flow of external air and supplies cooling air to the heat sink, wherein said heat sink is formed by combining two kinds of heat sinks, which include a first heat sink (7) and a second heat sink (8), so as to conduct heat therebetween, and, wherein said power semiconductor module is in close contact with the second heat sink (8).
摘要翻译： 通过减小马达控制器中使用的散热器的尺寸和马达控制器的所有部件的数量来提供廉价并且具有小尺寸的马达控制器，其中所述马达控制器包括散热器，功率半导体 与散热器紧密接触的模块，电连接到功率半导体模块的基板（4）和产生外部空气流并向散热器供应冷却空气的风扇（6），其中所述 通过组合包括第一散热器（7）和第二散热器（8）的两种散热器以在其间传导热而形成散热器，并且其中所述功率半导体模块与 第二散热器（8）。
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