摘要:
A method for manufacturing a light emitting device, includes: preparing a first substrate by slicing a single crystal ingot pulled in a pulling direction tilted with respect to a first plane orientation, the slicing being in a direction substantially perpendicular to the pulling direction; preparing a second substrate including a major surface having a plane orientation substantially parallel to a plane orientation of a major surface of the first substrate; growing a stacked unit as a crystal on the major surface of the second substrate, the stacked unit including a light emitting layer; and removing the second substrate after bonding the stacked unit and the major surface of the first substrate by heating them in a joined state. A plane orientation of the major surface of the first substrate and a plane orientation of the major surface of the second substrate are one or another selected from a plane tilted from a (100) plane toward a [011] direction and a plane tilted from a (−100) plane toward a [0-1-1] direction, respectively.
摘要:
A method for manufacturing a light emitting device, includes: preparing a first substrate by slicing a single crystal ingot pulled in a pulling direction tilted with respect to a first plane orientation, the slicing being in a direction substantially perpendicular to the pulling direction; preparing a second substrate including a major surface having a plane orientation substantially parallel to a plane orientation of a major surface of the first substrate; growing a stacked unit as a crystal on the major surface of the second substrate, the stacked unit including a light emitting layer; and removing the second substrate after bonding the stacked unit and the major surface of the first substrate by heating them in a joined state. A plane orientation of the major surface of the first substrate and a plane orientation of the major surface of the second substrate are one or another selected from a plane tilted from a (100) plane toward a [011] direction and a plane tilted from a (−100) plane toward a [0-1-1] direction, respectively.
摘要:
A light emitting device has an N-type gallium nitride system compound semiconductor layer provided on a substrate; and a P-type gallium nitride system compound semiconductor layer provided on said N-type gallium nitride system compound semiconductor layer. The N-type gallium nitride compound semiconductor layer has such an area that an impurity concentration increases corresponding to a layer thickness from the side of said substrate.
摘要:
After p-type gallium nitride compound semiconductor layers, to which p-type impurity is added, are formed by virtue of chemical vapor deposition, the p-type gallium nitride compound semiconductor layers are thermally annealed at more than 400.degree. C. or more than 700.degree. C. while supplying a flow of an inert gas in parallel to a substrate surface at a predetermined flow rate or more. Otherwise, the p-type gallium nitride compound semiconductor layers are thermally annealed at more than 400.degree. C. or more than 700.degree. C. in an inert gas atmosphere having a predetermined pressure or more. According to the annealing process, the p-type impurity can be more effectively activated, so that p-type gallium nitride compound semiconductor layers which have fewer crystal defects, etc. and have lower resistivity can be formed.
摘要:
There is provided a motor control apparatus in which a size of the apparatus can easily be reduced, a work for aligning a power semiconductor module with a substrate can be eliminated and an assembling property can be enhanced. In a motor control apparatus in which a power semiconductor module adhering to a heat sink is mounted on a first substrate, a spacer is provided between the heat sink and the substrate and the power semiconductor module is disposed in the spacer. Moreover, an edge part of a hole has such a structure as to block a space between a terminal protruded from a side portion of the power semiconductor module and the heat sink.
摘要:
A cooling device for an electric equipment which is excellent in cooling efficiency and low in noise and permits easy mounting of a cooling fan and a fan guard, comprising a heat sink (1) having a U-shaped frame (4) consisting of a flat part (2) and side parts (3) disposed on the opposite sides of the flat part (2), fins (5) formed on the frame (4) and fan guard mounting holes (6) formed in the side parts (3) of the frame (4); a cooling fan (7) having an engaging recess (8) in the side thereof; and a U-shaped fan guard (9) consisting of a fan guard body (10) and side plates (11) disposed on the opposite ends of the fan guard body (10); wherein a lattice body (12) is provided on the fan guard body (10), an air guide (17) at the tip end of each side plate (11), a fan mounting engaging projection (13) on the inner side surface of each side plate for clamping and retaining by engaging the cooling fan (7) and a projection support (15), having an engaging projection (14) for mounting the fan guard (9) to the heat sink (1), on the outer side surface of each side plate.
摘要:
There is provided a motor controller that can easily reduce the size and manufacturing cost of a motor controller by reducing the size of a heat sink without increasing the number of parts much.The motor controller includes a heat sink, a plurality of power semiconductor modules that is in close contact with the heat sink, a substrate (6) that is electrically connected to the plurality of power semiconductor modules, and a fan (8) that generates the flow of external air and supplies cooling air to the heat sink. The heat sink is formed by the combination of two kinds of heat sinks that include a first heat sink (9) and a second heat sink (10), and at least one of the power semiconductor modules is in close contact with each of the first and second heat sinks (9) and (10).
摘要:
There is provided a motor controller which eliminates a positioning operation between a power semiconductor element and a base plate to improve assemblability. A motor controller has a power semiconductor element (3) closely contacted with a heatsink (1) and mounted in a first base plate (4), wherein a spacer (2) having an engaging section (2e) formed therein as a hole for the power semiconductor element (3) is interposed between the heatsink (1) and the base plate (4), and the power semiconductor element (3) is positioned in the spacer (2). Further, the peripheral wall of the hole is arranged so as to shut off a space between a terminal projecting from the side of the power semiconductor element (3) and the heatsink (1).