公开(公告)号：US5644107A

公开(公告)日：1997-07-01

申请号：US438339

申请日：1995-05-10

申请人： Kenji Kubota ,  Norio Sakai ,  Shoichi Kawabata

发明人： Kenji Kubota ,  Norio Sakai ,  Shoichi Kawabata

IPC分类号： H01G2/06 ,  H01G4/232 ,  H01L21/66 ,  H01L23/10 ,  H01L23/498 ,  H01L23/58 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H05K1/02

CPC分类号： H01G4/232 ,  H01G2/065 ,  H01L22/20 ,  H01L22/32 ,  H01L23/10 ,  H01L23/49805 ,  H05K3/403 ,  H01L2924/014 ,  H01L2924/16152 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/09181 ,  H05K2201/09563 ,  H05K2201/09845 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  Y10T29/435 ,  Y10T29/49004 ,  Y10T29/4902 ,  Y10T29/49165 ,  Y10T29/49169

摘要： In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.

摘要翻译： 为了提供能够减小外部电极的配置间距的多层电子部件，在母层叠体中设置有填充有导电材料的通孔，该母层叠体通过在分开的位置层叠多个具有导体膜的绝缘片而获得 通过切割。 导电材料限定通过切割母层压板而获得的各个多层电子部件的外部电极。 不需要形成外部电极的特定步骤，并且可以在母体层叠体的状态下有效地测量每个多层电子部件的特性。

公开(公告)号：US5604328A

公开(公告)日：1997-02-18

申请号：US445918

申请日：1995-05-22

申请人： Kenji Kubota ,  Norio Sakai ,  Shoichi Kawabata

发明人： Kenji Kubota ,  Norio Sakai ,  Shoichi Kawabata

IPC分类号： H01G2/06 ,  H01G4/232 ,  H01L21/66 ,  H01L23/10 ,  H01L23/498 ,  H01L23/58 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H02G3/08 ,  H01L23/02 ,  H01R29/00 ,  H05K7/00

CPC分类号： H01G4/232 ,  H01G2/065 ,  H01L22/20 ,  H01L22/32 ,  H01L23/10 ,  H01L23/49805 ,  H05K3/403 ,  H01L2924/014 ,  H01L2924/16152 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/09181 ,  H05K2201/09563 ,  H05K2201/09845 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  Y10T29/435 ,  Y10T29/49004 ,  Y10T29/4902 ,  Y10T29/49165 ,  Y10T29/49169

摘要： In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.

公开(公告)号：US5625935A

公开(公告)日：1997-05-06

申请号：US227022

申请日：1994-04-13

申请人： Kenji Kubota ,  Norio Sakai ,  Shoichi Kawabata

发明人： Kenji Kubota ,  Norio Sakai ,  Shoichi Kawabata

IPC分类号： H01G2/06 ,  H01G4/232 ,  H01L21/66 ,  H01L23/10 ,  H01L23/498 ,  H01L23/58 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H01R43/00

CPC分类号： H01G4/232 ,  H01G2/065 ,  H01L22/20 ,  H01L22/32 ,  H01L23/10 ,  H01L23/49805 ,  H05K3/403 ,  H01L2924/014 ,  H01L2924/16152 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/09181 ,  H05K2201/09563 ,  H05K2201/09845 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  Y10T29/435 ,  Y10T29/49004 ,  Y10T29/4902 ,  Y10T29/49165 ,  Y10T29/49169

摘要： In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.

公开(公告)号：US5488765A

公开(公告)日：1996-02-06

申请号：US226935

申请日：1994-04-13

申请人： Kenji Kubota ,  Norio Sakai ,  Shoichi Kawabata

发明人： Kenji Kubota ,  Norio Sakai ,  Shoichi Kawabata

IPC分类号： H01G2/06 ,  H01G4/232 ,  H01L21/66 ,  H01L23/10 ,  H01L23/498 ,  H01L23/58 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H01R43/00

CPC分类号： H01G4/232 ,  H01G2/065 ,  H01L22/20 ,  H01L22/32 ,  H01L23/10 ,  H01L23/49805 ,  H05K3/403 ,  H01L2924/014 ,  H01L2924/16152 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/09181 ,  H05K2201/09563 ,  H05K2201/09845 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  Y10T29/435 ,  Y10T29/49004 ,  Y10T29/4902 ,  Y10T29/49165 ,  Y10T29/49169

摘要： In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.

摘要翻译： 为了提供能够减小外部电极的配置间距的多层电子部件，在母层叠体中设置有填充有导电材料的通孔，该母层叠体通过在分开的位置层叠多个具有导体膜的绝缘片而获得 通过切割。 导电材料限定通过切割母层压板而获得的各个多层电子部件的外部电极。 不需要形成外部电极的特定步骤，并且可以在母体层叠体的状态下有效地测量每个多层电子部件的特性。

公开(公告)号：US5635670A

公开(公告)日：1997-06-03

申请号：US589534

申请日：1996-01-05

申请人： Kenji Kubota ,  Norio Sakai ,  Shoichi Kawabata

发明人： Kenji Kubota ,  Norio Sakai ,  Shoichi Kawabata

IPC分类号： H01G2/06 ,  H01G4/232 ,  H01L21/66 ,  H01L23/10 ,  H01L23/498 ,  H01L23/58 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H02G3/08 ,  H01L23/02 ,  H01R29/00 ,  H05K7/00

CPC分类号： H01G4/232 ,  H01G2/065 ,  H01L22/20 ,  H01L22/32 ,  H01L23/10 ,  H01L23/49805 ,  H05K3/403 ,  H01L2924/014 ,  H01L2924/16152 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/09181 ,  H05K2201/09563 ,  H05K2201/09845 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  Y10T29/435 ,  Y10T29/49004 ,  Y10T29/4902 ,  Y10T29/49165 ,  Y10T29/49169

摘要： In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.

摘要翻译： 为了提供一种可以减少外部电极的布置间距的多层电子部件，在母层叠体中设置填充有导电材料的通孔，该母层叠体通过在分开的位置层叠多个绝缘片而插入导体膜而获得 通过切割。 导电材料限定通过切割母层压板而获得的各个多层电子部件的外部电极。 不需要形成外部电极的特定步骤，并且可以在母体层叠体的状态下有效地测量每个多层电子部件的特性。

公开(公告)号：US5635669A

公开(公告)日：1997-06-03

申请号：US483799

申请日：1995-06-07

申请人： Kenji Kubota ,  Norio Sakai ,  Shoichi Kawabata

发明人： Kenji Kubota ,  Norio Sakai ,  Shoichi Kawabata

IPC分类号： H01G2/06 ,  H01G4/232 ,  H01L21/66 ,  H01L23/498 ,  H01L23/58 ,  H05K1/09 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H02G3/08 ,  H01L23/02 ,  H01R29/00 ,  H05K7/00

CPC分类号： H01G4/232 ,  H01G2/065 ,  H01L22/20 ,  H01L22/32 ,  H01L23/49805 ,  H01L2924/0002 ,  H01L2924/014 ,  H05K1/092 ,  H05K2201/09181 ,  H05K2201/09563 ,  H05K2201/09845 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061

摘要： A multilayer electronic component having reduced arrangement pitches for external electrodes is formed by providing via holes in a mother laminate with conductive materials. The mother laminate is obtained by stacking a plurality of insulating sheets with interposition of conductor films in positions that are parted by cutting. The conductive materials define external electrodes for individual multilayer electronic components which are obtained by cutting the mother laminate. A specific step for forming the external electrodes is not required, and characteristics of each multilayer electronic component can be efficiently measured while each multilayer electronic component is still part of the mother laminate.

摘要翻译： 通过在母层叠体中提供导电材料的通孔来形成具有减小的用于外部电极的布置间距的多层电子部件。 通过将多个绝缘片层叠在通过切割分割的位置中的导体膜上而获得母层压体。 导电材料限定通过切割母层压板而获得的单个多层电子部件的外部电极。 不需要形成外部电极的特定步骤，并且可以在每个多层电子部件仍然是母体层叠体的一部分的同时有效地测量每个多层电子部件的特性。

公开(公告)号：US06861588B2

公开(公告)日：2005-03-01

申请号：US10620096

申请日：2003-07-15

申请人： Norio Sakai ,  Mitsuyoshi Nishide ,  Masaaki Mizushiro ,  Kenji Kubota ,  Nobuyuki Suzuki

发明人： Norio Sakai ,  Mitsuyoshi Nishide ,  Masaaki Mizushiro ,  Kenji Kubota ,  Nobuyuki Suzuki

IPC分类号： H01L23/498 ,  H05K1/03 ,  H05K3/40 ,  H05K3/46 ,  H01L23/02

CPC分类号： H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4007 ,  H05K3/4611 ,  H05K3/4629 ,  H01L2924/00

摘要： A laminated ceramic electronic component includes an embedded portion formed in the periphery of an external terminal electrode so as to extend and be embedded in a component main member defined by ceramic layers, whereby affects of a small edge angle are eliminated.

摘要翻译： 层叠陶瓷电子部件包括形成在外部端子电极的周围的嵌入部分，以便延伸并嵌入由陶瓷层限定的部件主要部件中，从而消除了小的边缘角度的影响。

公开(公告)号：US5493769A

公开(公告)日：1996-02-27

申请号：US284150

申请日：1994-08-02

申请人： Norio Sakai ,  Kenji Kubota

发明人： Norio Sakai ,  Kenji Kubota

IPC分类号： H01F17/00 ,  H01C1/14 ,  H01G4/232 ,  H01G4/30 ,  H01L23/498 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46 ,  H01R43/00

CPC分类号： H01G4/232 ,  H01C1/14 ,  H01L23/49805 ,  H01L23/49822 ,  H05K3/403 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/0919 ,  H05K3/0052 ,  Y10T29/435 ,  Y10T29/49004 ,  Y10T29/4902 ,  Y10T29/49169

摘要： A method of manufacturing a multilayer electronic component having one major surface which can be completely used as a mounting surface for another electronic component to form a composite component includes the steps of forming a groove in the mother laminate along a cutting line, forming external electrodes on side surfaces of the groove and then dividing the mother laminate along the cutting line to divide the groove thereby forming a plurality of multilayer electronic components that are independent of each other. The method of forming the electronic components allows for measuring electrical characteristics of the individual multilayer electronic components while the components are still part of the mother laminate.

摘要翻译： 一种具有一个主表面的多层电子部件的制造方法，其可以完全用作另一电子部件的安装面以形成复合部件，包括以下步骤：沿着切割线在母体层叠体中形成凹槽，形成外部电极 然后沿着切割线分割母体层叠体以分割凹槽，从而形成彼此独立的多个多层电子部件。 形成电子部件的方法允许测量各个多层电子部件的电特性，同时部件仍然是母层压板的一部分。

公开(公告)号：US09616639B2

公开(公告)日：2017-04-11

申请号：US14236711

申请日：2012-08-10

申请人： Yuki Taninouchi ,  Naoki Kato ,  Kenji Kubota

发明人： Yuki Taninouchi ,  Naoki Kato ,  Kenji Kubota

IPC分类号： B32B15/01 ,  C25D3/38 ,  C25D3/30 ,  C25D5/10 ,  C25D5/50 ,  H01B1/02 ,  C25D7/06

CPC分类号： B32B15/01 ,  C25D3/30 ,  C25D3/38 ,  C25D5/10 ,  C25D5/505 ,  C25D7/0614 ,  H01B1/026 ,  Y10T428/12715

摘要： Tin-plated copper-alloy material for terminal in which: a Sn-based surface layer is formed on a surface of a substrate made of Cu alloy, and a Cu—Sn alloy layer is formed between the Sn-based surface layer and the substrate; the Cu—Sn alloy layer is an alloy layer containing Cu6Sn5 as a major proportion and having a compound in which a part of Cu in the Cu6Sn5 is substituted by Ni and Si in the vicinity of a boundary face at the substrate side; an average thickness of the Sn-based surface layer is 0.2 μm or more and 0.6 μm or less; an oil-sump depth Rvk of the Cu—Sn alloy layer is 0.2 μm or more; an area rate of the Cu—Sn alloy layer exposed at a surface of the Sn-based surface layer is 10% or more and 40% or less; and dynamic friction coefficient is 0.3 or less.

公开(公告)号：US08976171B2

公开(公告)日：2015-03-10

申请号：US13615911

申请日：2012-09-14

申请人： Shingo Kida ,  Kenji Kubota

发明人： Shingo Kida ,  Kenji Kubota

IPC分类号： G06T15/00 ,  G06T7/00 ,  H04N13/02

CPC分类号： G06T7/0051 ,  G06T7/50 ,  H04N13/261

摘要： An RB rate calculator calculates an RB rate based on an R signal and a B signal. A starting point changing unit changes a starting point based on the RB rate. An offset calculating unit calculates an offset value to adjust for selection of a basic depth model type based on a bottom high frequency component evaluation value. An adding unit adds a signal from the starting point changing unit and an offset. Another adding unit adds an offset-added signal from the adding unit and a basic depth model-composed image signal supplied from a composing unit, and generates depth estimation data wherein a degree of superimposition of object information is changed according to a composition of a composed image of basic depth models selected to be composed.

摘要翻译： RB速率计算器基于R信号和B信号计算RB速率。 起点改变单元基于RB速率改变起始点。 偏移计算单元基于底部高频分量评估值来计算偏移值以进行基本深度模型类型的选择的调整。 添加单元添加来自起点更改单元的信号和偏移量。 另一个添加单元添加来自加法单元的偏移相加信号和从合成单元提供的基本深度模型合成图像信号，并生成深度估计数据，其中对象信息的叠加程度根据组合的组成而变化 选择组成的基本深度模型的图像。