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28 条记录 (耗时 0.026 秒)

    Fluid ejector head having a planar passivation layer
    1.
    发明授权
    Fluid ejector head having a planar passivation layer 有权
    具有平面钝化层的流体喷射头

    公开(公告)号：US06834942B2

    公开(公告)日：2004-12-28

    申请号：US10852894

    申请日：2004-05-24

    申请人： Kenneth E Trueba ,  Ronnie J. Yenchik ,  Ronald A. Hellekson

    发明人： Kenneth E Trueba ,  Ronnie J. Yenchik ,  Ronald A. Hellekson

    IPC分类号： B41J205

    CPC分类号： B41J2/1629 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1625 ,  B41J2/1628 ,  B41J2/1632 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1645 ,  B41J2/1646

    摘要： A fluid ejector head, includes a fluid definition layer defining a chamber, the fluid definition layer having a substantially planar passivation surface. In addition, the fluid ejector head includes a sacrificial material filling the chamber that is planarized to the plane formed by the passivation surface. Further, the fluid ejector head includes a passivation layer, having substantially planar opposed major surfaces, formed on the planar passivation surface; and a resistive layer having substantially planar opposed major surfaces in contact with the passivation layer.

    摘要翻译： 流体喷射头包括限定腔室的流体限定层，流体限定层具有基本平坦的钝化表面。 此外，流体喷射头包括填充室的牺牲材料，其平坦化到由钝化表面形成的平面。 此外，流体喷射头包括形成在平面钝化表面上的钝化层，其具有基本平坦的相对主表面; 以及电阻层，其具有与钝化层接触的具有大致平坦的相对主表面。

    Method of forming a through-substrate interconnect
    3.
    发明授权
    Method of forming a through-substrate interconnect 有权
    形成贯通基板互连的方法

    公开(公告)号：US06716737B2

    公开(公告)日：2004-04-06

    申请号：US10208363

    申请日：2002-07-29

    申请人： Hubert Vander Plas ,  Barry C. Snyder ,  Ronald A. Hellekson ,  Ronnie J. Yenchik ,  Diane Lai ,  Samson Berhane

    发明人： Hubert Vander Plas ,  Barry C. Snyder ,  Ronald A. Hellekson ,  Ronnie J. Yenchik ,  Diane Lai ,  Samson Berhane

    IPC分类号： H01L2144

    CPC分类号： H01L21/76898 ,  H01L23/481

    摘要： A method of forming a through-substrate interconnect for a circuit element in a microelectronics device is provided. The device is formed on a substrate having a frontside and a backside, and includes a circuit element formed on the frontside of the substrate connected to a contact pad formed on the backside of the substrate by the through-substrate interconnect. The method includes forming a first interconnect structure extending into the substrate from the frontside of the substrate, at least partially forming the circuit element such that the circuit element is in electrical communication with the first interconnect structure, and forming a second interconnect structure extending into the substrate from the backside of the substrate after forming the first interconnect structure such that the second interconnect structure is in electrical communication with the first interconnect structure.

    摘要翻译： 提供了一种在微电子器件中形成用于电路元件的贯通衬底互连的方法。 该器件形成在具有前侧和背面的衬底上，并且包括形成在衬底的前侧的电路元件，该电路元件通过贯穿衬底互连连接到形成在衬底的背面上的接触焊盘。 该方法包括形成从衬底的前侧延伸到衬底中的第一互连结构，至少部分地形成电路元件，使得电路元件与第一互连结构电连通，以及形成延伸到 在形成第一互连结构之后，从衬底的背面起第二互连结构与第一互连结构电连通的衬底。

    System and method for calculating a shift value between pattern instances
    9.
    发明授权
    System and method for calculating a shift value between pattern instances 有权
    用于计算模式实例之间的移位值的系统和方法

    公开(公告)号：US07289868B2

    公开(公告)日：2007-10-30

    申请号：US11209134

    申请日：2005-08-22

    申请人： Carl E. Picciotto ,  Jun Gao ,  Ronald A. Hellekson ,  Judson M. Leiser

    发明人： Carl E. Picciotto ,  Jun Gao ,  Ronald A. Hellekson ,  Judson M. Leiser

    IPC分类号： G06F19/00

    CPC分类号： G03F9/7003 ,  G03F7/70616 ,  G03F7/70725 ,  Y10S438/975

    摘要： A method comprising adjusting a first relative position between a substrate and a fabrication unit by a first shift value, forming a first pattern relative to a first pattern instance on the substrate subsequent to adjusting the first relative position by the first shift value, and calculating a second shift value using a first displacement between the first pattern and the first pattern instance and a second displacement between a second relative position of the first pattern instance with respect to a second pattern instance is provided.

    摘要翻译： 一种方法，包括通过第一移位值来调整基板和制造单元之间的第一相对位置，在将第一相对位置调整第一移位值之后，相对于基板上的第一图案实例形成第一图案，并且计算 提供使用第一图案和第一图案实例之间的第一位移的第二移位值，以及第一图案实例相对于第二图案实例的第二相对位置之间的第二位移。

    Trifocal lens for a laser instrument
    10.
    发明授权
    Trifocal lens for a laser instrument 失效
    用于激光仪器的三焦镜头

    公开(公告)号：US4678288A

    公开(公告)日：1987-07-07

    申请号：US604916

    申请日：1984-04-27

    申请人： Randall J. Lonsdale ,  Ronald A. Hellekson

    发明人： Randall J. Lonsdale ,  Ronald A. Hellekson

    IPC分类号： G06K7/10

    CPC分类号： G06K7/10811 ,  G06K7/10702 ,  G06K2207/1013

    摘要： A laser instrument of the kind used to read or to detect light reflected from a target which is spaced from the laser instrument comprises a laser for generating a laser beam for transmission to the target, and a detector for detecting light reflected from the target and a trifocal, composite, single piece lens system. The trifocal lens system receives the laser beam from the laser at an angle which is off the optical axis of the lens system, routes the received laser beam onto the optical axis for transmission through the lens system and toward the target, collects light reflected from the target and images and transmits the collected light along the optical axis to the detector means. In a specific embodiment of the invention the trifocal, composite, single piece lens system is a plastic molded structure.

    摘要翻译： 用于读取或检测与激光仪器间隔开的目标反射的光的激光仪器包括用于产生用于传输到目标的激光束的激光器和用于检测从目标物反射的光的检测器和 三焦，复合，单片透镜系统。 三焦透镜系统以与透镜系统的光轴相离的角度接收来自激光器的激光束，将接收的激光束路由到光轴上，以透射透镜系统并朝向目标，收集从 目标和图像，并将收集的光沿着光轴传输到检测器装置。 在本发明的具体实施例中，三焦点复合单片透镜系统是塑料模制结构。