摘要:
A microstrip antenna has feed element 102 and parasitic elements 104, 106 on the front surface of substrate 1. Microwave electrical power is applied to feed element 102. Parasitic elements 104, 106 are connected via through hole type leads passing through substrate 1, to switches upon the rear surface of substrate 1, respectively. By actuating the switches individually, parasitic elements 104, 106 are individually switched between a grounded state and a float state. The direction of the radio beam emitted from the microstrip antenna is varied by selecting which of parasitic elements 104, 106 is grounded and floated. A microwave signal source connects to feed element 102 via an feed line 108 very much shorter than the wavelength, accordingly the transmission losses being low and the efficiency being excellent.
摘要:
A microstrip antenna has feed element 102 and parasitic elements 104, 106 on the front surface of substrate 1. Microwave electrical power is applied to feed element 102. Parasitic elements 104, 106 are connected via through hole type leads passing through substrate 1, to switches upon the rear surface of substrate 1, respectively. By actuating the switches individually, parasitic elements 104, 106 are individually switched between a grounded state and a float state. The direction of the radio beam emitted from the microstrip antenna is varied by selecting which of parasitic elements 104, 106 is grounded and floated. A microwave signal source connects to feed element 102 via an feed line 108 very much shorter than the wavelength, accordingly the transmission losses being low and the efficiency being excellent.
摘要:
A plurality of antenna electrodes 11, 12, 13, 14 on a substrate 1 can be connected to a ground electrode on the substrate 1 via connectors at spots 11A-11C, 12A-12C, 13A-13C, and 14A-14C. Each connector can be opened/closed by a switch; or provided with a impedance varying device. Any one of the antenna electrodes may be connected to the ground electrode by the switch or the impedance varying device. The radio wave beam outputted from this antenna electrode shifts in phase from the radio wave beams outputted from the other antenna electrodes, whereby the direction of the integrated radio wave beam is inclined. Connecting one or another of the spots 11A-11C, 12A-12C, 13A-13C, and 14A-14C to the ground electrode changes the direction and the magnitude of the integrated radio wave beam.
摘要:
A plurality of antenna electrodes 11, 12, 13, 14 on a substrate 1 can be connected to a ground electrode on the substrate 1 via connectors at spots 11A-11C, 12A-12C, 13A-13C, and 14A-14C. Each connector can be opened/closed by a switch; or provided with a impedance varying device. Any one of the antenna electrodes may be connected to the ground electrode by the switch or the impedance varying device. The radio wave beam outputted from this antenna electrode shifts in phase from the radio wave beams outputted from the other antenna electrodes, whereby the direction of the integrated radio wave beam is inclined. Connecting one or another of the spots 11A-11C, 12A-12C, 13A-13C, and 14A-14C to the ground electrode changes the direction and the magnitude of the integrated radio wave beam.
摘要:
The object of the present invention is to provide a low power consumption, compact radio wave sensor capable of accurately detecting the presence and mobile status of a detected object present within a detection area, and having a superior S/N ratio. The radio wave sensor comprising: an oscillator circuit 1 for producing a high-frequency signal; a ground electrode 3 formed on one surface of a substrate 2 formed of a dielectric body or on approximately the entire surface of the interior thereof, acting as ground to a high-frequency signal; an antenna electrode 6 formed on the other surface of the substrate, for radiating a high-frequency signal as a radio beam and receiving a radio beam which collides with a detected object and is reflected back from the object; and a wave detecting element 7 for detecting a high-frequency signal received by the antenna electrode 6; wherein one of the terminals of the wave detecting element 7 is connected to the antenna electrode 6 via a frequency adjustment line 12 for adjusting the frequency of the antenna electrode 6, and the other terminal is connected to the ground electrode 3; and the frequency adjustment line 12 is connected to the antenna electrode 6 at a position different from that of an electrical feeding point (in Fig., a position of a conducting hole 13a) provided on the antenna electrode 6 to supply electricity to the antenna electrode 6 with the high-frequency signal produced by the oscillator circuit 1.
摘要:
A vehicular wiper device includes a wiper motor secured to a crank arm, a first pivot holder rotatably supporting a wiper arm and a first pivot lever, a second pivot holder rotatably supporting a wiper arm and a second pivot lever, and a link structure connected to the crank arm. Rotation power of the wiper motor is transmitted to the first pivot lever and the second pivot lever via the crank arm and the link structure. The wiper motor is secured to a rear face of a motor bracket portion of the first pivot holder on an opposite side as the wiper arm with respect to the motor bracket portion. The crank arm is arranged on the opposite side as the wiper motor with respect to the motor bracket portion. A dimension between the rear face of the motor bracket portion and the first pivot lever is set to be greater than a dimension between the rear face of the motor bracket portion and the crank arm.
摘要:
A vehicular wiper device includes a wiper motor secured to a crank arm, a first pivot holder rotatably supporting a wiper arm and a first pivot lever, a second pivot holder rotatably supporting a wiper arm and a second pivot lever, and a link structure connected to the crank arm. Rotation power of the wiper motor is transmitted to the first pivot lever and the second pivot lever via the crank arm and the link structure. The wiper motor is secured to a rear face of a motor bracket portion of the first pivot holder on an opposite side as the wiper arm with respect to the motor bracket portion. The crank arm is arranged on the opposite side as the wiper motor with respect to the motor bracket portion. A dimension between the rear face of the motor bracket portion and the first pivot lever is set to be greater than a dimension between the rear face of the motor bracket portion and the crank arm.
摘要:
The present invention provides a solder ball that has solved the problem of micro-adhesion and, moreover, has solved both of the problems of micro-adhesion and wetting properties, and a method for preventing the micro-adhesion of solder balls. That is, the present invention provides a solder ball obtained by solidification and spheroidization in a gas phase and having metal soap molecules, preferably a metal soap molecules film of 3 nm or less in thickness, adsorbed on its surface. As the metal soap, there can be used, for example, calcium stearate, magnesium stearate or barium stearate. The present invention is preferably applied to solder balls with a diameter of 400 μm or less. The present invention also provides a method for preventing the micro-adhesion of solder balls which comprises immersing solder balls obtained by solidification and spheroidization in a gas phase, in a solution containing a metal soap dispersed therein, preferably, a solution containing a metal soap dispersed therein to a concentration of less than 5 ppm; taking out the solder balls from the solution; vaporizing the solvent on the surfaces of the solder balls; and then drying the surfaces. The drying is preferably conducted in an atmosphere having a relative humidity RH≦40%.
摘要:
The present invention provides a solder ball that has solved the problem of micro-adhesion and, moreover, has solved both of the problems of micro-adhesion and wetting properties, and a method for preventing the micro-adhesion of solder balls. That is, the present invention provides a solder ball obtained by solidification and spheroidization in a gas phase and having metal soap molecules, preferably a metal soap molecules film of 3 nm or less in thickness, adsorbed on its surface. As the metal soap, there can be used, for example, calcium stearate, magnesium stearate or barium stearate. The present invention is preferably applied to solder balls with a diameter of 400 μm or less. The present invention also provides a method for preventing the micro-adhesion of solder balls which comprises immersing solder balls obtained by solidification and spheroidization in a gas phase, in a solution containing a metal soap dispersed therein, preferably, a solution containing a metal soap dispersed therein to a concentration of less than 5 ppm; taking out the solder balls from the solution; vaporizing the solvent on the surfaces of the solder balls; and then drying the surfaces. The drying is preferably conducted in an atmosphere having a relative humidity RH≦40%.