公开(公告)号：US08907406B2

公开(公告)日：2014-12-09

申请号：US13729959

申请日：2012-12-28

申请人： Kensuke Ota ,  Toshinori Numata ,  Masumi Saitoh ,  Chika Tanaka ,  Yusuke Higashi

发明人： Kensuke Ota ,  Toshinori Numata ,  Masumi Saitoh ,  Chika Tanaka ,  Yusuke Higashi

IPC分类号： H01L29/66 ,  H01L29/786 ,  H01L29/06 ,  H01L29/32 ,  B82Y40/00 ,  H01L29/775 ,  H01L29/78 ,  B82Y10/00

CPC分类号： H01L29/32 ,  B82Y10/00 ,  B82Y40/00 ,  H01L29/0673 ,  H01L29/66439 ,  H01L29/66795 ,  H01L29/775 ,  H01L29/785 ,  H01L29/78603 ,  H01L29/78696

摘要： A semiconductor device according to embodiments includes a semiconductor substrate, a buried insulating layer which is formed on the semiconductor substrate, a semiconductor layer which is formed on the buried insulating layer and includes a narrow portion and two wide portions which are larger than the narrow portion in width and are respectively connected to one end and the other end of the narrow portion, a gate insulating film which is formed on a side surface of the narrow portion, and a gate electrode formed on the gate insulating film. The impurity concentration of the semiconductor substrate directly below the narrow portion is higher than the impurity concentration of the narrow portion, and the impurity concentration of the semiconductor substrate directly below the narrow portion is higher than the impurity concentration of the semiconductor substrate directly below the wide portion.

摘要翻译： 根据实施例的半导体器件包括半导体衬底，形成在半导体衬底上的掩埋绝缘层，形成在掩埋绝缘层上并且包括狭窄部分和比窄部分大的两个宽部分的半导体层 并且分别连接到窄部分的一端和另一端，形成在窄部分的侧表面上的栅极绝缘膜和形成在栅极绝缘膜上的栅电极。 直接在窄部下方的半导体衬底的杂质浓度高于窄部分的杂质浓度，并且直接在窄部下方的半导体衬底的杂质浓度高于直接在宽度以下的半导体衬底的杂质浓度 一部分。

公开(公告)号：US08999801B2

公开(公告)日：2015-04-07

申请号：US13236199

申请日：2011-09-19

申请人： Kensuke Ota ,  Masumi Saitoh ,  Toshinori Numata

发明人： Kensuke Ota ,  Masumi Saitoh ,  Toshinori Numata

IPC分类号： H01L21/336 ,  H01L29/10 ,  H01L29/06 ,  H01L29/66 ,  H01L29/78 ,  H01L21/265

CPC分类号： H01L29/0673 ,  H01L21/26506 ,  H01L21/26586 ,  H01L29/42392 ,  H01L29/66742 ,  H01L29/66803 ,  H01L29/785 ,  H01L29/78696

摘要： A semiconductor device according to an embodiment includes: a polycrystalline semiconductor layer formed on an insulating film, the polycrystalline semiconductor layer including a first region and second and third regions each having a greater width than the first region, one of the second and third regions being connected to the first region; a gate insulating film formed at least on side faces of the first region of the polycrystalline semiconductor layer; a gate electrode formed on the gate insulating film; and gate sidewalls made of an insulating material, the gate sidewalls being formed on side faces of the gate electrode on sides of the second and third regions. Content of an impurity per unit volume in the first region is larger than content of the impurity per unit volume in the second and third regions.

摘要翻译： 根据实施例的半导体器件包括：形成在绝缘膜上的多晶半导体层，所述多晶半导体层包括第一区域和第二和第三区域，所述第二区域和第三区域各自具有比所述第一区域更大的宽度，所述第二和第三区域中的一个是 连接到第一区域; 形成在所述多晶半导体层的所述第一区域的至少一侧面上的栅极绝缘膜; 形成在栅极绝缘膜上的栅电极; 以及由绝缘材料制成的栅极侧壁，所述栅极侧壁形成在所述第二和第三区域侧面上的所述栅电极的侧面上。 第一区域中每单位体积杂质的含量大于第二和第三区域中每单位体积杂质的含量。

公开(公告)号：US08518769B2

公开(公告)日：2013-08-27

申请号：US13415592

申请日：2012-03-08

申请人： Kensuke Ota ,  Toshinori Numata ,  Masumi Saitoh ,  Chika Tanaka

发明人： Kensuke Ota ,  Toshinori Numata ,  Masumi Saitoh ,  Chika Tanaka

IPC分类号： H01L29/78 ,  H01L21/336

CPC分类号： H01L29/786 ,  H01L29/00 ,  H01L29/785 ,  H01L29/78696

摘要： A semiconductor device of an embodiment includes: an insulating film including: a first region extending in a first direction; second and third regions arranged at a distance from each other; and fourth and fifth regions each having a concave shape, the fourth and fifth regions each having a smaller film thickness than a film thickness of each of the first through third regions; a semiconductor layer formed in a direction from the fourth region toward the fifth region, the semiconductor layer having a smaller width than a width of each of source and drain regions, the semiconductor layer being connected to the source and drain regions; a gate electrode placed on the opposite side of a gate insulating film from the semiconductor layer on the first region; and a gate sidewall formed on a side face of the gate electrode.

摘要翻译： 实施例的半导体器件包括：绝缘膜，包括：沿第一方向延伸的第一区域; 第二和第三区域彼此相隔一定距离; 第四和第五区域各自具有凹形形状，第四和第五区域各自具有比每个第一至第三区域的膜厚度更薄的膜厚度; 在从第四区域朝向第五区域的方向上形成的半导体层，所述半导体层的宽度小于源极和漏极区域的宽度，所述半导体层连接到所述源极和漏极区域; 栅极电极，位于栅极绝缘膜的与第一区域上的半导体层相反的一侧; 以及形成在栅电极的侧面上的栅极侧壁。

公开(公告)号：US20120146053A1

公开(公告)日：2012-06-14

申请号：US13237697

申请日：2011-09-20

申请人： Masumi SAITOH ,  Toshinori Numata ,  Yukio Nakabayashi ,  Kensuke Ota

发明人： Masumi SAITOH ,  Toshinori Numata ,  Yukio Nakabayashi ,  Kensuke Ota

IPC分类号： H01L29/161 ,  H01L21/336 ,  H01L29/78

CPC分类号： H01L29/785 ,  H01L29/66795 ,  H01L29/7843

摘要： A semiconductor device according to an embodiment includes a semiconductor substrate, a gate insulating film formed on the semiconductor substrate, a gate electrode formed on the gate insulating film, first gate sidewalls formed on both sides of the gate electrode, and a source/drain semiconductor layer formed on the semiconductor substrate to sandwich the first gate sidewalls with the gate electrode. Further, second gate sidewalls are provided on the first gate sidewalls and the source/drain semiconductor layer at both sides of the gate electrode, wherein the boundary of each of the second gate sidewalls with each of the first gate sidewalls is terminated at the side surface of the gate electrode, and each of the second gate sidewalls has a smaller Young's modulus and a lower dielectric constant than each of the first gate sidewalls.

摘要翻译： 根据实施例的半导体器件包括半导体衬底，形成在半导体衬底上的栅极绝缘膜，形成在栅极绝缘膜上的栅电极，形成在栅电极两侧的第一栅极侧壁和源极/漏极半导体 层，形成在半导体衬底上，以与栅电极夹住第一栅极侧壁。 此外，第二栅极侧壁设置在栅电极两侧的第一栅极侧壁和源极/漏极半导体层上，其中每个第二栅极侧壁与每个第一栅极侧壁的边界在侧表面终止 并且每个第二栅极侧壁具有比每个第一栅极侧壁更小的杨氏模量和更低的介电常数。