-
公开(公告)号：US08349196B2
公开(公告)日：2013-01-08
申请号：US12329462
申请日：2008-12-05
申请人： Kevin P. Fairbairn , Michael S. Barnes , Terry Bluck , Ren Xu , Charles Liu , Ralph Kerns
发明人： Kevin P. Fairbairn , Michael S. Barnes , Terry Bluck , Ren Xu , Charles Liu , Ralph Kerns
IPC分类号： B44C1/22
CPC分类号： G11B5/84 , G11B5/855 , H01J37/3438
摘要： A system is provided for etching patterned media disks for hard drive. The modular system may be tailored to perform specific processes sequences so that a patterned media disk is fabricated without removing the disk from vacuum environment. In some sequence the magnetic stack is etched while in other the etch is performed prior to forming the magnetic stack. In a further sequence ion implantation is used without etching steps. For etching a movable non-contact electrode is utilized to perform sputter etch. The cathode moves to near contact distance to, but not contacting, the substrate so as to couple RF energy to the disk. The substrate is held vertically in a carrier and both sides are etched serially. That is, one side is etched in one chamber and then in the next chamber the second side is etched.
摘要翻译： 提供了用于蚀刻用于硬盘驱动器的图案化介质盘的系统。 模块化系统可以被定制以执行特定的处理顺序，使得图案化的介质盘被制造而不从真空环境中移除盘。 在一些顺序中，磁性堆叠被蚀刻，而另一些蚀刻则在形成磁性堆叠之前进行。 在另外的序列中，使用离子注入而没有蚀刻步骤。 为了蚀刻可移动的非接触电极用于进行溅射蚀刻。 阴极移动到与衬底接近但不接触的接近距离，以将RF能量耦合到盘。 衬底垂直地保持在载体中，并且两侧被连续蚀刻。 也就是说，在一个室中蚀刻一面，然后在下一个室中蚀刻第二面。
-
公开(公告)号：US20090145879A1
公开(公告)日：2009-06-11
申请号：US12329462
申请日：2008-12-05
申请人： Kevin P. Fairbairn , Michael S. Barnes , Terry Bluck , Ren Xu , Charles Liu , Ralph Kerns
发明人： Kevin P. Fairbairn , Michael S. Barnes , Terry Bluck , Ren Xu , Charles Liu , Ralph Kerns
IPC分类号： C23F1/00
CPC分类号： G11B5/84 , G11B5/855 , H01J37/3438
摘要： A system is provided for etching patterned media disks for hard drive. The modular system may be tailored to perform specific processes sequences so that a patterned media disk is fabricated without removing the disk from vacuum environment. In some sequence the magnetic stack is etched while in other the etch is performed prior to forming the magnetic stack. In a further sequence ion implantation is used without etching steps. For etching a movable non-contact electrode is utilized to perform sputter etch. The cathode moves to near contact distance to, but not contacting, the substrate so as to couple RF energy to the disk. The substrate is held vertically in a carrier and both sides are etched serially. That is, one side is etched in one chamber and then in the next chamber the second side is etched.
摘要翻译： 提供了用于蚀刻用于硬盘驱动器的图案化介质盘的系统。 模块化系统可以被定制以执行特定的处理顺序，使得图案化的介质盘被制造而不从真空环境中移除盘。 在一些顺序中，磁性堆叠被蚀刻，而另一些蚀刻则在形成磁性堆叠之前进行。 在另外的序列中，使用离子注入而没有蚀刻步骤。 为了蚀刻可移动的非接触电极用于进行溅射蚀刻。 阴极移动到与衬底接近但不接触的接近距离，以将RF能量耦合到盘。 衬底垂直地保持在载体中，并且两侧被连续蚀刻。 也就是说，在一个室中蚀刻一面，然后在下一个室中蚀刻第二面。
-
公开(公告)号：US20120090992A1
公开(公告)日：2012-04-19
申请号：US13338182
申请日：2011-12-27
申请人： Kevin P. Fairbairn , Michael S. Barnes , Terry Bluck , Ren Xu , Charles Liu , Ralph Kerns
发明人： Kevin P. Fairbairn , Michael S. Barnes , Terry Bluck , Ren Xu , Charles Liu , Ralph Kerns
IPC分类号： C23C14/34
CPC分类号： G11B5/84 , G11B5/855 , H01J37/3438
摘要： A system is provided for etching patterned media disks for hard drive. The modular system may be tailored to perform specific processes sequences so that a patterned media disk is fabricated without removing the disk from vacuum environment. In some sequence the magnetic stack is etched while in other the etch is performed prior to forming the magnetic stack. In a further sequence ion implantation is used without etching steps. For etching a movable non-contact electrode is utilized to perform sputter etch. The cathode moves to near contact distance to, but not contacting, the substrate so as to couple RF energy to the disk. The substrate is held vertically in a carrier and both sides are etched serially. That is, one side is etched in one chamber and then in the next chamber the second side is etched.
摘要翻译： 提供了用于蚀刻用于硬盘驱动器的图案化介质盘的系统。 模块化系统可以被定制以执行特定的处理序列，使得图案化的介质盘被制造而不从真空环境中移除盘。 在一些顺序中，磁性堆叠被蚀刻，而另一些蚀刻则在形成磁性堆叠之前进行。 在另外的序列中，使用离子注入而没有蚀刻步骤。 为了蚀刻可移动的非接触电极用于进行溅射蚀刻。 阴极移动到与衬底接近但不接触的接近距离，以将RF能量耦合到盘。 衬底垂直地保持在载体中，并且两侧被连续蚀刻。 也就是说，在一个室中蚀刻一面，然后在下一个室中蚀刻第二面。
-
公开(公告)号：US20080066678A1
公开(公告)日：2008-03-20
申请号：US11523101
申请日：2006-09-19
IPC分类号： C23C16/00
CPC分类号： H01L21/67184 , H01L21/67173 , H01L21/67196 , H01L21/67201 , H01L21/67745
摘要： There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.
摘要翻译： 描述了与目前使用的系统相比，用于运输和处理包括晶片的基板以便以合理的成本有效地生产提高的生产量的装置和方法。 关键要素是沿着处理室的侧面使用传送室，用于通过装载锁定将基板输送到受控气氛中，然后沿着传送室作为到达处理室的方式，然后在受控气氛中进行处理 处理室。
-
公开(公告)号：US09524896B2
公开(公告)日：2016-12-20
申请号：US12368241
申请日：2009-02-09
IPC分类号： H01L21/677 , C23C14/56 , C23C16/54 , H01L21/67
CPC分类号： H01L21/67745 , C23C14/568 , C23C16/54 , C23C16/545 , H01L21/67167 , H01L21/67173 , H01L21/67184 , H01L21/67196 , H01L21/67201 , H01L21/67709
摘要： There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A linear transport chamber includes linear tracks and robot arms riding on the linear tracks to linearly transfer substrates along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers.
摘要翻译： 描述了与目前使用的系统相比，用于运输和处理包括晶片的基板以便以合理的成本有效地生产提高的生产量的装置和方法。 线性传送室包括线性轨道和机器人手臂，该线性轨道和机器人臂骑在线性轨道上，以沿着处理室的侧面线性地传送衬底，用于通过负载锁定将衬底馈送到受控气氛中，然后沿着运送室作为到达处理室的方式。
-
公开(公告)号：US08303764B2
公开(公告)日：2012-11-06
申请号：US13042407
申请日：2011-03-07
IPC分类号： C23F1/00 , H01L21/306 , H01L21/677 , C23C16/00 , C23C14/00
CPC分类号： H01L21/67184 , H01L21/67173 , H01L21/67196 , H01L21/67201 , H01L21/67745
摘要： There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.
-
公开(公告)号：US07901539B2
公开(公告)日：2011-03-08
申请号：US11523101
申请日：2006-09-19
IPC分类号： C23F1/00 , H01L21/306 , C23C16/00 , C23C14/00
CPC分类号： H01L21/67184 , H01L21/67173 , H01L21/67196 , H01L21/67201 , H01L21/67745
摘要： There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.
摘要翻译： 描述了与目前使用的系统相比，用于运输和处理包括晶片的基板以便以合理的成本有效地生产提高的生产量的装置和方法。 关键要素是沿着处理室的侧面使用传送室，用于通过装载锁定将基板输送到受控气氛中，然后沿着传送室作为到达处理室的方式，然后在受控气氛中进行处理 处理室。
-
公开(公告)号：US20090191030A1
公开(公告)日：2009-07-30
申请号：US12368241
申请日：2009-02-09
IPC分类号： H01L21/677
CPC分类号： H01L21/67745 , C23C14/568 , C23C16/54 , C23C16/545 , H01L21/67167 , H01L21/67173 , H01L21/67184 , H01L21/67196 , H01L21/67201 , H01L21/67709
摘要： There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A linear transport chamber includes linear tracks and robot arms riding on the linear tracks to linearly transfer substrates along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers.
摘要翻译： 描述了与目前使用的系统相比，用于运输和处理包括晶片的基板以便以合理的成本有效地生产提高的生产量的装置和方法。 线性传送室包括线性轨道和机器人手臂，该线性轨道和机器人臂骑在线性轨道上，以沿着处理室的侧面线性地传送衬底，用于通过负载锁定将衬底馈送到受控气氛中，然后沿着运送室作为到达处理室的方式。
-
公开(公告)号：US20090078374A1
公开(公告)日：2009-03-26
申请号：US12325993
申请日：2008-12-01
CPC分类号： H01L21/67745 , H01L21/67173 , H01L21/67184 , H01L21/67201
摘要： There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.
摘要翻译： 描述了与目前使用的系统相比，用于运输和处理包括晶片的基板以便以合理的成本有效地生产提高的生产量的装置和方法。 关键要素是沿着处理室的侧面使用传送室，用于通过装载锁定将基板输送到受控气氛中，然后沿着传送室作为到达处理室的方式，然后在受控气氛中进行处理 处理室。
-
公开(公告)号：US08293066B2
公开(公告)日：2012-10-23
申请号：US12325993
申请日：2008-12-01
IPC分类号： C23F1/00 , H01L21/306 , H01L21/677 , C23C16/00 , C23C14/00
CPC分类号： H01L21/67745 , H01L21/67173 , H01L21/67184 , H01L21/67201
摘要： There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.
摘要翻译： 描述了与目前使用的系统相比，用于运输和处理包括晶片的基板以便以合理的成本有效地生产提高的生产量的装置和方法。 关键要素是沿着处理室的侧面使用传送室，用于通过装载锁定将基板输送到受控气氛中，然后沿着传送室作为到达处理室的方式，然后在受控气氛中进行处理 处理室。
-
-
-
-
-
-
-
-
-
搜索结果
80 条记录 (耗时 0.039 秒)
