摘要:
An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.
摘要:
An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.
摘要:
An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.
摘要:
An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.
摘要:
A demodulator, chip and method for digitally demodulating an FSK signal utilizing a digital data transfer protocol and a digital demodulator circuit have been developed. The data-rate approaches the carrier-frequency. The one application for this technique is in the magnetically powered wireless systems such as biomedical implants and radio frequency identification (RFID) tags with high data rates above 1 Mbps. The demodulator circuit extracts the serial data bit-stream and a constant-frequency clock from an FSK carrier signal in the 1˜20 MHZ range, which can power the wireless system as well. The digital demodulator circuit is implemented entirely with digital circuitry and is called a digital-FSK (DFSK) demodulator.
摘要:
A liquid-gap electrostatic hydraulic micro actuator is provided that produces higher displacement (in and out of plane) and larger force than typical electrostatic actuators by utilizing a non-conducting liquid as its dielectric material. This new class of actuators utilizes the liquid dielectric for hydraulic amplification and force transfer. The liquid electrostatic actuator consists of two chambers each forming a parallel-plate capacitor, filled with a non-conducting incompressible liquid. One chamber is compressed by pulling down a flexible membrane using electrostatic actuation, thus forcing the liquid under it to transfer into the other chamber. Such movement causes the other chamber's membrane to expand out of plane.
摘要:
A vacuum or hermetic packaged micromachined or MEMS device and methods for manufacturing the device so that the device has at least one substantially vertical feedthrough are provided. In a first embodiment, the method includes: providing a MEMS device fabricated on a first side of a substrate and located within a vacuum or hermetic cavity; forming at least one hole completely through the substrate between first and second sides of the substrate after the step of providing; and forming a path of electrically conductive material connecting the MEMS device and the second side of the substrate through the at least one hole to form the at least one substantially vertical feedthrough.
摘要:
In some embodiments, without limitation, the invention comprises a micromachined probe with one or more buried flow microchannels, where at least one of the microchannels is filled with an organic polymer. In some additional embodiments, the invention comprises a micromachined probe having at least a portion of one external surface coated with an organic polymer. The internally or externally applied organic polymer increases the buckling strength of the micromachined probe and decreases the risk of fracture of the probe, or movement or migration of broken fragments, during insertion, use, or removal from biological tissues.
摘要:
A high sensitivity, Z-axis, capacitive microaccelerometer having stiff sense/feedback electrodes and a method of its manufacture on a single-side of a semiconductor wafer are provided. The microaccelerometer is manufactured out of a single silicon wafer and has a silicon-wafer-thick proof mass, small and controllable damping, large capacitance variation and can be operated in a force-rebalanced control loop. One of the electrodes moves with the proof mass relative to the other electrode which is fixed. The multiple, stiffened electrodes have embedded therein damping holes to facilitate force-rebalanced operation of the device and to control the damping factor. Using the whole silicon wafer to form the thick large proof mass and using thin sacrificial layers to form narrow uniform capacitor air gaps over large areas provide large capacitance sensitivity. The manufacturing process is simple and thus results in low cost and high yield manufacturing. In one preferred embodiment, the fixed electrode includes a plurality of co-planar, electrically-isolated, conductive electrodes formed by thin polysilicon deposition with embedded vertical stiffeners. The vertical stiffeners are formed by refilling vertical trenches in the proof mass and are used to make the fixed electrode stiff in the sense direction (i.e. Z or input axis). The moving electrode is dimensioned and supported for movement on the proof mass so as to be stiff in the sense direction. In another embodiment both of the electrodes are electroplated. In yet another embodiment four support beams support the proof mass at an upper portion thereof and four support beams support the proof mass at a lower portion thereof.
摘要:
An increased frequency power generator that includes a pair of transducers located on opposite sides of a suspended inertial mass. Magnetic attraction is used to couple the mass to each of the two transducers in alternating fashion in response to vibration and other movement externally imparted on the generator. Each transducer includes a suspended magnetic element that couples and decouples to the inertial mass as it reciprocates in the housing due to the applied external moving force. As the inertial mass decouples from one transducer on its way to magnetically connecting to the other transducer, the decoupled suspended magnetic element oscillates at a frequency greater than the imparting force, thereby generating electrical power.