Environment-resistant module, micropackage and methods of manufacturing same
    1.
    发明授权
    Environment-resistant module, micropackage and methods of manufacturing same 有权
    环保模块,微包装及其制造方法

    公开(公告)号:US08049326B2

    公开(公告)日:2011-11-01

    申请号:US12135532

    申请日:2008-06-09

    IPC分类号: H01L21/50 H01L23/538

    摘要: An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.

    摘要翻译: 公开了一种为封装的微加工或MEMS器件提供热隔离和隔振的环境保护模块。 用于微平台的微平台和支撑结构提供热隔离和隔振。 该封装兼具密封性和真空性,并提供信号传输的垂直馈通。 还公开了微加工或MEMS器件转移方法,其可以以混合或集成的方式处理各种各样的微机械加工或MEMS管芯或晶片。 该模块同时提供使用微平台和支撑结构的MEMS器件的热隔离和隔振,该支撑结构可以由图案化以形成螃蟹腿形悬挂系绳或梁的薄玻璃晶片制造。

    ENVIRONMENT-RESISTANT MODULE, MICROPACKAGE AND METHODS OF MANUFACTURING SAME
    2.
    发明申请
    ENVIRONMENT-RESISTANT MODULE, MICROPACKAGE AND METHODS OF MANUFACTURING SAME 有权
    环保型模块,微型封装及其制造方法

    公开(公告)号:US20120032346A1

    公开(公告)日:2012-02-09

    申请号:US13273402

    申请日:2011-10-14

    IPC分类号: H01L23/48 H01L21/60 H01L21/58

    摘要: An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.

    摘要翻译: 公开了一种为封装的微加工或MEMS器件提供热隔离和隔振的环境保护模块。 用于微平台的微平台和支撑结构提供热隔离和隔振。 该封装兼具密封性和真空性,并提供信号传输的垂直馈通。 还公开了微加工或MEMS器件转移方法,其可以以混合或集成的方式处理各种各样的微机械加工或MEMS管芯或晶片。 该模块同时提供使用微平台和支撑结构的MEMS器件的热隔离和隔振,该支撑结构可以由图案化以形成螃蟹腿形悬挂系绳或梁的薄玻璃晶片制造。

    Environment-resistant module, micropackage and methods of manufacturing same
    3.
    发明授权
    Environment-resistant module, micropackage and methods of manufacturing same 有权
    环保模块,微包装及其制造方法

    公开(公告)号:US08476737B2

    公开(公告)日:2013-07-02

    申请号:US13273402

    申请日:2011-10-14

    IPC分类号: H01L23/48 H01L21/58 H01L21/60

    摘要: An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.

    摘要翻译: 公开了一种为封装的微加工或MEMS器件提供热隔离和隔振的环境保护模块。 用于微平台的微平台和支撑结构提供热隔离和隔振。 该封装兼具密封性和真空性,并提供信号传输的垂直馈通。 还公开了微加工或MEMS器件转移方法,其可以以混合或集成的方式处理各种各样的微机械加工或MEMS管芯或晶片。 该模块同时提供使用微平台和支撑结构的MEMS器件的热隔离和隔振,该支撑结构可以由图案化以形成螃蟹腿形悬挂系绳或梁的薄玻璃晶片制造。

    Environment-Resistant Module, Micropackage And Methods Of Manufacturing Same
    4.
    发明申请
    Environment-Resistant Module, Micropackage And Methods Of Manufacturing Same 有权
    耐环境模块,微型封装和制造方法相同

    公开(公告)号:US20090085191A1

    公开(公告)日:2009-04-02

    申请号:US12135532

    申请日:2008-06-09

    IPC分类号: H01L23/538 H01L21/50

    摘要: An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.

    摘要翻译: 公开了一种为封装的微加工或MEMS器件提供热隔离和隔振的环境保护模块。 用于微平台的微平台和支撑结构提供热隔离和隔振。 该封装兼具密封性和真空性,并提供信号传输的垂直馈通。 还公开了微加工或MEMS器件转移方法,其可以以混合或集成的方式处理各种各样的微机械加工或MEMS管芯或晶片。 该模块同时提供使用微平台和支撑结构的MEMS器件的热隔离和隔振,该支撑结构可以由图案化以形成螃蟹腿形悬挂系绳或梁的薄玻璃晶片制造。

    Demodulator, chip and method for digitally demodulating an FSK signal
    5.
    发明授权
    Demodulator, chip and method for digitally demodulating an FSK signal 有权
    用于数字解调FSK信号的解调器,芯片和方法

    公开(公告)号:US07881409B2

    公开(公告)日:2011-02-01

    申请号:US10597392

    申请日:2005-01-21

    IPC分类号: H04L27/14

    CPC分类号: H03D3/006

    摘要: A demodulator, chip and method for digitally demodulating an FSK signal utilizing a digital data transfer protocol and a digital demodulator circuit have been developed. The data-rate approaches the carrier-frequency. The one application for this technique is in the magnetically powered wireless systems such as biomedical implants and radio frequency identification (RFID) tags with high data rates above 1 Mbps. The demodulator circuit extracts the serial data bit-stream and a constant-frequency clock from an FSK carrier signal in the 1˜20 MHZ range, which can power the wireless system as well. The digital demodulator circuit is implemented entirely with digital circuitry and is called a digital-FSK (DFSK) demodulator.

    摘要翻译: 已经开发了使用数字数据传输协议和数字解调器电路对FSK信号进行数字解调的解调器,芯片和方法。 数据速率接近载波频率。 该技术的一个应用是在具有高于1Mbps的高数据速率的诸如生物医学植入物和射频识别(RFID)标签的磁力无线系统中。 解调器电路从1〜20MHz范围内的FSK载波信号中提取串行数据比特流和恒定频率时钟,这也可为无线系统供电。 数字解调器电路完全由数字电路实现,称为数字FSK(DFSK)解调器。

    LIQUID-GAP ELECTROSTATIC HYDRAULIC MICRO ACTUATORS
    6.
    发明申请
    LIQUID-GAP ELECTROSTATIC HYDRAULIC MICRO ACTUATORS 审中-公开
    液体静电液压微型致动器

    公开(公告)号:US20090115285A1

    公开(公告)日:2009-05-07

    申请号:US12247574

    申请日:2008-10-08

    IPC分类号: H02N11/00 F16K31/02 H04R17/00

    CPC分类号: F15B7/00 F15B15/10 Y10T29/42

    摘要: A liquid-gap electrostatic hydraulic micro actuator is provided that produces higher displacement (in and out of plane) and larger force than typical electrostatic actuators by utilizing a non-conducting liquid as its dielectric material. This new class of actuators utilizes the liquid dielectric for hydraulic amplification and force transfer. The liquid electrostatic actuator consists of two chambers each forming a parallel-plate capacitor, filled with a non-conducting incompressible liquid. One chamber is compressed by pulling down a flexible membrane using electrostatic actuation, thus forcing the liquid under it to transfer into the other chamber. Such movement causes the other chamber's membrane to expand out of plane.

    摘要翻译: 提供了一种液隙静电液压微型致动器,其通过利用非导电液体作为其介电材料而产生比典型的静电致动器更高的位移(平面内和向外)以及更大的力。 这种新型致动器采用液体电介质进行液压放大和力传递。 液体静电致动器由两个室构成,每个室形成平行板电容器,填充有非导电不可压缩液体。 通过使用静电致动拉下柔性膜来压缩一个室,从而迫使其下面的液体转移到另一个室中。 这种运动导致另一个室的膜膨胀离开平面。

    Method of fabricating a package with substantially vertical feedthroughs for micromachined or MEMS devices
    7.
    发明授权
    Method of fabricating a package with substantially vertical feedthroughs for micromachined or MEMS devices 有权
    制造具有用于微加工或MEMS器件的基本垂直馈通的封装的方法

    公开(公告)号:US07098117B2

    公开(公告)日:2006-08-29

    申请号:US10688417

    申请日:2003-10-17

    IPC分类号: H01L21/46

    摘要: A vacuum or hermetic packaged micromachined or MEMS device and methods for manufacturing the device so that the device has at least one substantially vertical feedthrough are provided. In a first embodiment, the method includes: providing a MEMS device fabricated on a first side of a substrate and located within a vacuum or hermetic cavity; forming at least one hole completely through the substrate between first and second sides of the substrate after the step of providing; and forming a path of electrically conductive material connecting the MEMS device and the second side of the substrate through the at least one hole to form the at least one substantially vertical feedthrough.

    摘要翻译: 提供真空或密封式微加工或MEMS装置以及用于制造该装置的方法,使得装置具有至少一个基本垂直的馈通。 在第一实施例中,该方法包括:提供在衬底的第一侧上制造并位于真空或密封腔内的MEMS器件; 在提供步骤之后,在基板的第一和第二面之间,通过基板完全形成至少一个孔; 以及形成通过所述至少一个孔连接所述MEMS器件和所述衬底的所述第二侧的导电材料的路径,以形成所述至少一个基本垂直的馈通。

    Shatter-resistant microprobes
    8.
    发明申请
    Shatter-resistant microprobes 审中-公开
    防破碎的微型工具

    公开(公告)号:US20050107742A1

    公开(公告)日:2005-05-19

    申请号:US10941554

    申请日:2004-09-15

    IPC分类号: A61M37/00 G01N23/00

    CPC分类号: A61M37/0015

    摘要: In some embodiments, without limitation, the invention comprises a micromachined probe with one or more buried flow microchannels, where at least one of the microchannels is filled with an organic polymer. In some additional embodiments, the invention comprises a micromachined probe having at least a portion of one external surface coated with an organic polymer. The internally or externally applied organic polymer increases the buckling strength of the micromachined probe and decreases the risk of fracture of the probe, or movement or migration of broken fragments, during insertion, use, or removal from biological tissues.

    摘要翻译: 在一些实施方案中,但不限于,本发明包括具有一个或多个掩埋流微通道的微加工探针,其中至少一个微通道填充有机聚合物。 在一些另外的实施方案中,本发明包括具有涂覆有机聚合物的一个外表面的至少一部分的微加工探针。 内部或外部施加的有机聚合物增加微加工探针的屈曲强度,并降低探针断裂的风险,或在插入,使用或从生物组织中移除或破碎碎片的移动或迁移。

    Single-side microelectromechanical capacitive accelerometer and method of making same
    9.
    发明授权
    Single-side microelectromechanical capacitive accelerometer and method of making same 失效
    单侧微机电电容式加速度计及其制作方法

    公开(公告)号:US06167757A

    公开(公告)日:2001-01-02

    申请号:US09386656

    申请日:1999-08-31

    IPC分类号: G01P15125

    摘要: A high sensitivity, Z-axis, capacitive microaccelerometer having stiff sense/feedback electrodes and a method of its manufacture on a single-side of a semiconductor wafer are provided. The microaccelerometer is manufactured out of a single silicon wafer and has a silicon-wafer-thick proof mass, small and controllable damping, large capacitance variation and can be operated in a force-rebalanced control loop. One of the electrodes moves with the proof mass relative to the other electrode which is fixed. The multiple, stiffened electrodes have embedded therein damping holes to facilitate force-rebalanced operation of the device and to control the damping factor. Using the whole silicon wafer to form the thick large proof mass and using thin sacrificial layers to form narrow uniform capacitor air gaps over large areas provide large capacitance sensitivity. The manufacturing process is simple and thus results in low cost and high yield manufacturing. In one preferred embodiment, the fixed electrode includes a plurality of co-planar, electrically-isolated, conductive electrodes formed by thin polysilicon deposition with embedded vertical stiffeners. The vertical stiffeners are formed by refilling vertical trenches in the proof mass and are used to make the fixed electrode stiff in the sense direction (i.e. Z or input axis). The moving electrode is dimensioned and supported for movement on the proof mass so as to be stiff in the sense direction. In another embodiment both of the electrodes are electroplated. In yet another embodiment four support beams support the proof mass at an upper portion thereof and four support beams support the proof mass at a lower portion thereof.

    摘要翻译: 提供具有刚性感测/反馈电极的高灵敏度Z轴电容式微加速度计及其制造在半导体晶片的单面上的方法。 微加速度计由单个硅晶片制成,具有硅晶片厚度可靠的质量,小且可控的阻尼,大的电容变化,并且可以在力 - 重新平衡的控制回路中运行。 其中一个电极与检测质量相对于固定的另一个电极移动。 多个加强电极已经嵌入阻尼孔,以便于装置的力 - 再平衡操作并且控制阻尼因子。 使用整个硅晶片形成厚的大型检验质量块,并使用薄的牺牲层在大面积上形成窄均匀的电容器气隙,提供较大的电容灵敏度。 制造工艺简单,从而导致低成本和高产量制造。 在一个优选实施例中,固定电极包括通过具有嵌入式垂直加强件的薄多晶硅沉积形成的多个共平面,电隔离的导电电极。 垂直扶强材是通过重新填充检验质量块中的垂直沟槽而形成的,并用于使固定电极在感测方向(即Z或输入轴)上变硬。 移动电极的尺寸和尺寸被确定并被支撑以在检测质量块上移动,以便在感测方向上变硬。 在另一个实施例中,两个电极都被电镀。 在另一个实施例中,四个支撑梁在其上部支撑检测质量块,并且四个支撑梁在其下部支撑检验质量块。

    INCREASED FREQUENCY POWER GENERATION USING LOW-FREQUENCY AMBIENT VIBRATIONS
    10.
    发明申请
    INCREASED FREQUENCY POWER GENERATION USING LOW-FREQUENCY AMBIENT VIBRATIONS 有权
    使用低频环境振动增加频率发电

    公开(公告)号:US20110140577A1

    公开(公告)日:2011-06-16

    申请号:US12818716

    申请日:2010-06-18

    IPC分类号: H02K35/00 H02N2/18 H02N1/08

    摘要: An increased frequency power generator that includes a pair of transducers located on opposite sides of a suspended inertial mass. Magnetic attraction is used to couple the mass to each of the two transducers in alternating fashion in response to vibration and other movement externally imparted on the generator. Each transducer includes a suspended magnetic element that couples and decouples to the inertial mass as it reciprocates in the housing due to the applied external moving force. As the inertial mass decouples from one transducer on its way to magnetically connecting to the other transducer, the decoupled suspended magnetic element oscillates at a frequency greater than the imparting force, thereby generating electrical power.

    摘要翻译: 一种增加频率发电机,其包括位于悬挂的惯性质量的相对侧上的一对换能器。 磁吸引用于响应于外部施加在发电机上的振动和其它运动以交替方式将质量耦合到两个换能器中的每一个。 每个换能器包括悬挂的磁性元件,其由于所施加的外部移动力而在惯性质量体在壳体中往复运动时耦合和解耦。 由于惯性质量在一个换能器到磁性连接到另一个换能器的途中脱离,所以解耦的悬挂磁性元件以大于施加力的频率振荡,从而产生电力。