公开(公告)号：US20110180305A1

公开(公告)日：2011-07-28

申请号：US12691924

申请日：2010-01-22

申请人： Angelique Johnson ,  Kensall Wise

发明人： Angelique Johnson ,  Kensall Wise

IPC分类号： H05K1/00 ,  H01B13/00

CPC分类号： A61N1/0541 ,  Y10T29/49155 ,  Y10T428/31681

摘要： An electrode array, having application as a cochlear implant, includes a tube formed of Parylene defining a hollow channel. A substrate formed primarily of Parylene is supported by the tube. In turn, a plurality of metallic electrodes and feed lines are supported by the substrate. Numerous voids are defined by the tube which opens into the hollow channel. The size and spacing of the voids regulate stiffness and curl of the tube to provide excellent fit within the cochlea.

摘要翻译： 具有作为耳蜗植入物的应用的电极阵列包括由限定中空通道的聚对二甲苯形成的管。 主要由聚对二甲苯形成的基材由管支撑。 反过来，多个金属电极和馈电线由衬底支撑。 多个空隙由通向中空通道的管定义。 空隙的尺寸和间距调节管的刚度和卷曲以在耳蜗内提供优良的配合。

公开(公告)号：US20050107742A1

公开(公告)日：2005-05-19

申请号：US10941554

申请日：2004-09-15

申请人： Maysam Ghovanloo ,  Khalil Najafi ,  Kensall Wise

发明人： Maysam Ghovanloo ,  Khalil Najafi ,  Kensall Wise

IPC分类号： A61M37/00 ,  G01N23/00

CPC分类号： A61M37/0015

摘要： In some embodiments, without limitation, the invention comprises a micromachined probe with one or more buried flow microchannels, where at least one of the microchannels is filled with an organic polymer. In some additional embodiments, the invention comprises a micromachined probe having at least a portion of one external surface coated with an organic polymer. The internally or externally applied organic polymer increases the buckling strength of the micromachined probe and decreases the risk of fracture of the probe, or movement or migration of broken fragments, during insertion, use, or removal from biological tissues.

摘要翻译： 在一些实施方案中，但不限于，本发明包括具有一个或多个掩埋流微通道的微加工探针，其中至少一个微通道填充有机聚合物。 在一些另外的实施方案中，本发明包括具有涂覆有机聚合物的一个外表面的至少一部分的微加工探针。 内部或外部施加的有机聚合物增加微加工探针的屈曲强度，并降低探针断裂的风险，或在插入，使用或从生物组织中移除或破碎碎片的移动或迁移。

公开(公告)号：US20050080346A1

公开(公告)日：2005-04-14

申请号：US10939684

申请日：2004-09-13

申请人： Yogesh Gianchandani ,  Kenichi Takahata ,  Kensall Wise ,  Andrew DeHennis

发明人： Yogesh Gianchandani ,  Kenichi Takahata ,  Kensall Wise ,  Andrew DeHennis

IPC分类号： A61F2/06 ,  A61F2/90 ,  B23H9/00 ,  A61B5/02

CPC分类号： B23H9/00 ,  A61F2/91

摘要： Disclosed herein is a stent device useful for maintaining the patency of a lumen while monitoring an intraluminal characteristic. The device includes a structure having a set of extendible bands that are capable of plastic deformation to form a scaffolding having an inductance, and further includes a capacitance coupled to the set of extendible bands and responsive to the intraluminal characteristic. The capacitance and the inductance form a tank circuit after the plastic deformation of the set of extendible bands to enable wireless transmission of an indication of the intraluminal characteristic.

摘要翻译： 本文公开了一种支架装置，用于在监测管腔内特征的同时维持管腔通畅。 该装置包括具有能够塑性变形以形成具有电感的脚手架的一组可延伸带的结构，并且还包括耦合到该组可延伸带并响应于管腔内特征的电容。 电容和电感在一组可扩展带的塑性变形之后形成储能电路，以使得能够无线传输管腔内特征的指示。

公开(公告)号：US08927876B2

公开(公告)日：2015-01-06

申请号：US13597970

申请日：2012-08-29

申请人： Angelique Johnson ,  Kensall Wise

发明人： Angelique Johnson ,  Kensall Wise

IPC分类号： H05K1/03 ,  A61N1/05

CPC分类号： A61N1/0541 ,  Y10T29/49155 ,  Y10T428/31681

摘要： An electrode array, having application as a cochlear implant, includes a tube formed of Parylene defining a hollow channel. A substrate formed primarily of Parylene is supported by the tube. In turn, a plurality of metallic electrodes and feed lines are supported by the substrate. Numerous voids are defined by the tube which opens into the hollow channel. The size and spacing of the voids regulate stiffness and curl of the tube to provide excellent fit within the cochlea.

摘要翻译： 具有作为耳蜗植入物的应用的电极阵列包括由限定中空通道的聚对二甲苯形成的管。 主要由聚对二甲苯形成的基材由管支撑。 反过来，多个金属电极和馈电线由衬底支撑。 许多空隙由通向中空通道的管定义。 空隙的尺寸和间距调节管的刚度和卷曲以在耳蜗内提供优良的配合。

公开(公告)号：US08283569B2

公开(公告)日：2012-10-09

申请号：US12691924

申请日：2010-01-22

申请人： Angelique Johnson ,  Kensall Wise

发明人： Angelique Johnson ,  Kensall Wise

IPC分类号： H05K1/03

CPC分类号： A61N1/0541 ,  Y10T29/49155 ,  Y10T428/31681

摘要： An electrode array, having application as a cochlear implant, includes a tube formed of Parylene defining a hollow channel. A substrate formed primarily of Parylene is supported by the tube. In turn, a plurality of metallic electrodes and feed lines are supported by the substrate. Numerous voids are defined by the tube which opens into the hollow channel. The size and spacing of the voids regulate stiffness and curl of the tube to provide excellent fit within the cochlea.

摘要翻译： 具有作为耳蜗植入物的应用的电极阵列包括由限定中空通道的聚对二甲苯形成的管。 主要由聚对二甲苯形成的基材由管支撑。 反过来，多个金属电极和馈电线由衬底支撑。 多个空隙由通向中空通道的管定义。 空隙的尺寸和间距调节管的刚度和卷曲以在耳蜗内提供优良的配合。

公开(公告)号：US08707734B2

公开(公告)日：2014-04-29

申请号：US12581695

申请日：2009-10-19

申请人： Razi-ul Haque ,  Kensall Wise

发明人： Razi-ul Haque ,  Kensall Wise

IPC分类号： C03C27/04

CPC分类号： C03C19/00 ,  B81B2201/036 ,  B81B2201/058 ,  B81C1/00095 ,  F04B19/006 ,  Y10T428/24479

摘要： A method of embedding material in a glass substrate is provided. The method includes providing a glass composition and a mold substrate having a patterned surface defining a recess therein. The mold substrate is formed from a material having a higher reflow temperature than the glass composition. A surface wettability of the patterned surface is increased relative to the glass composition. At least a portion of the glass composition is flowed into the recess defined by the patterned surface of the mold substrate, followed by solidifying the glass composition to form a solidified glass layer. Material is removed from the solidified glass layer until a portion of the underlying patterned surface of the mold substrate is exposed with at least a portion of the mold substrate embedded in the solidified glass layer to thereby form the glass substrate having the material embedded therein.

摘要翻译： 提供了将材料嵌入玻璃基板中的方法。 该方法包括提供玻璃组合物和具有在其中限定凹部的图案化表面的模具基底。 模具基材由具有比玻璃组合物更高的回流温度的材料形成。 图案化表面的表面润湿性相对于玻璃组合物增加。 玻璃组合物的至少一部分流入由模具基材的图案化表面限定的凹部中，然后固化玻璃组合物以形成固化的玻璃层。 将材料从凝固的玻璃层移除，直到模具基板的下面的图案化表面的一部分暴露于模具基底的至少一部分嵌入固化的玻璃层中，从而形成具有嵌入其中的材料的玻璃基板。

公开(公告)号：US20110301434A1

公开(公告)日：2011-12-08

申请号：US13154291

申请日：2011-06-06

申请人： Razi-ul Haque ,  Kensall Wise ,  Paul R. Lichter

发明人： Razi-ul Haque ,  Kensall Wise ,  Paul R. Lichter

IPC分类号： A61B5/00

CPC分类号： A61B5/6882 ,  A61F2/14 ,  A61F2220/0008

摘要： An implantable device is provided, along with a surgical technique for implanting the implantable device. The implantable device includes a body, at least two fingers, and a diagnostic tool. The body presents a generally flat configuration. The at least two fingers extend from opposite sides of the body along a common plane with the flat configuration of the body. For the surgical technique, the implantable device is positioned above flexible and elastic tissue at a target location. The finger on one side of the body is slid under a portion of the flexible and elastic tissue without penetrating the flexible and elastic tissue. The finger on the opposing side of the body is slid under another portion of the flexible and elastic tissue without penetrating the flexible and elastic tissue. The flexible and elastic tissue exerts force perpendicular to the body and fingers to fixate the implantable device.

摘要翻译： 提供了可植入装置，以及用于植入可植入装置的外科技术。 可植入装置包括主体，至少两个手指和诊断工具。 身体呈现大致平坦的配置。 所述至少两个指状物沿着身体的平坦构型沿着共同的平面从身体的相对侧延伸。 对于外科技术，可植入装置位于目标位置的柔性和弹性组织之上。 身体的一侧上的手指在柔性弹性组织的一部分下滑动而不穿透柔性和弹性组织。 身体相对侧上的手指在柔性和弹性组织的另一部分下滑动，而不会穿透柔性和弹性组织。 柔性和弹性组织施加垂直于身体和手指的力来固定可植入装置。

公开(公告)号：US20110091687A1

公开(公告)日：2011-04-21

申请号：US12581695

申请日：2009-10-19

申请人： Razi-ul Haque ,  Kensall Wise

发明人： Razi-ul Haque ,  Kensall Wise

IPC分类号： C03C14/00 ,  C03C19/00 ,  B32B3/00

CPC分类号： C03C19/00 ,  B81B2201/036 ,  B81B2201/058 ,  B81C1/00095 ,  F04B19/006 ,  Y10T428/24479

摘要： A method of embedding material in a glass substrate is provided. The method includes providing a glass composition and a mold substrate having a patterned surface defining a recess therein. The mold substrate is formed from a material having a higher reflow temperature than the glass composition. A surface wettability of the patterned surface is increased relative to the glass composition. At least a portion of the glass composition is flowed into the recess defined by the patterned surface of the mold substrate, followed by solidifying the glass composition to form a solidified glass layer. Material is removed from the solidified glass layer until a portion of the underlying patterned surface of the mold substrate is exposed with at least a portion of the mold substrate embedded in the solidified glass layer to thereby form the glass substrate having the material embedded therein.

摘要翻译： 提供了将材料嵌入玻璃基板中的方法。 该方法包括提供玻璃组合物和具有在其中限定凹部的图案化表面的模具基底。 模具基材由具有比玻璃组合物更高的回流温度的材料形成。 图案化表面的表面润湿性相对于玻璃组合物增加。 玻璃组合物的至少一部分流入由模具基材的图案化表面限定的凹部中，然后固化玻璃组合物以形成固化的玻璃层。 将材料从凝固的玻璃层移除，直到模具基板的下面的图案化表面的一部分暴露于模具基底的至少一部分嵌入固化的玻璃层中，从而形成具有嵌入其中的材料的玻璃基板。

公开(公告)号：US20070007240A1

公开(公告)日：2007-01-11

申请号：US11440983

申请日：2006-05-25

申请人： Kensall Wise ,  Mayurachat Gulari ,  Ying Yao

发明人： Kensall Wise ,  Mayurachat Gulari ,  Ying Yao

IPC分类号： H01B13/00 ,  B44C1/22 ,  C03C25/68 ,  C03C15/00

CPC分类号： H01L23/5387 ,  A61N1/0541 ,  A61N1/37205 ,  H01L21/4846 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24137 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/00

摘要： Disclosed herein is a method of fabricating a device having a microstructure. The method includes forming a connector on a semiconductor substrate, coating the connector with a polymer layer, and immersing the semiconductor substrate and the coated connector in an etchant solution to form the microstructure from the semiconductor substrate and to release the coated connector and the microstructure from the semiconductor substrate such that the microstructure remains coupled to a further element of the device via the coated connector. In some cases, the microstructure is defined by forming an etch stop in the semiconductor substrate, and the microstructure and the semiconductor substrate are coated with a polymer layer, which may then be selectively patterned. The microstructure may then be released from the semiconductor substrate in accordance with the etch stop.

摘要翻译： 本文公开了一种制造具有微结构的器件的方法。 该方法包括在半导体衬底上形成连接器，用聚合物层涂覆连接器，并将半导体衬底和涂覆的连接器浸入蚀刻液中以形成来自半导体衬底的微观结构，并将涂覆的连接器和微结构从 所述半导体衬底使得所述微结构经由所述涂覆的连接器保持与所述器件的另一元件耦合。 在一些情况下，微结构通过在半导体衬底中形成蚀刻停止来限定，并且微结构和半导体衬底被涂覆有聚合物层，然后可以选择性地构图。 然后可以根据蚀刻停止从半导体衬底释放微结构。

公开(公告)号：US20050001182A1

公开(公告)日：2005-01-06

申请号：US10842665

申请日：2004-05-10

申请人： Kensall Wise ,  Joseph Potkay

发明人： Kensall Wise ,  Joseph Potkay

IPC分类号： F15C5/00 ,  F16K99/00 ,  F16K31/02

CPC分类号： F16K99/0001 ,  F15C5/00 ,  F16K99/0009 ,  F16K99/0044 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/008

摘要： A microvalve device includes a semiconductor-based valve housing that defines a flow passage, and a valve face disposed within the valve housing and in fluid communication with the flow passage. The microvalve device further includes a thermal expansion actuator that drives movement of the valve face from a first position to a second position relative to the flow passage, and a capacitor that holds the valve face in the second position. The microvalve may also include an insulating layer disposed on portions of the semiconductor-based valve housing, and a capacitance sensor for monitoring a capacitance level to determine when the valve face reaches the second position. Once the sensor indicates that the second position has been reached, power is no longer applied to the thermal expansion actuator such that power is only substantially consumed during the transition from the first position to the second position. The thermal expansion actuator may include a heating element and a thermal expansion substance for thermopneumatic displacement of the valve face.

摘要翻译： 微型阀装置包括限定流路的基于半导体的阀壳体和设置在阀壳体内并与流动通道流体连通的阀面。 微型阀装置还包括热膨胀致动器，该热膨胀致动器驱动阀面从第一位置相对于流路的第二位置的运动，以及将阀面保持在第二位置的电容器。 微型阀还可以包括设置在基于半导体的阀壳体的部分上的绝缘层，以及用于监测电容水平以确定阀面何时到达第二位置的电容传感器。 一旦传感器指示已经达到第二位置，则不再向热膨胀致动器施加电力，使得仅在从第一位置到第二位置的转变期间仅基本消耗功率。 热膨胀致动器可以包括用于阀面的热气动位移的加热元件和热膨胀物质。