公开(公告)号：US06800533B1

公开(公告)日：2004-10-05

申请号：US09519427

申请日：2000-03-06

申请人： Kiat Seng Yeo ,  Hai Peng Tan ,  Jian Guo Ma ,  Manh Anh Do ,  Kok Wai Johnny Chew

发明人： Kiat Seng Yeo ,  Hai Peng Tan ,  Jian Guo Ma ,  Manh Anh Do ,  Kok Wai Johnny Chew

IPC分类号： H01L2120

CPC分类号： H01L23/645 ,  H01F17/0013 ,  H01F41/041 ,  H01L23/5227 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A new structure is provided for the creation of an inductor on the surface of a silicon semiconductor substrate. The inductor is of spiral design and perpendicular to the plane of the underlying substrate. Conductor line width can be selected as narrow or wide, ferromagnetic material can be used to fill the spaces between the conductors of the spiral inductor. The spiral inductor of the invention can further by used in series or in series with conventional horizontal inductors.

摘要翻译： 提供了一种新的结构，用于在硅半导体衬底的表面上产生电感器。 电感器具有螺旋设计并且垂直于下面的衬底的平面。 导体线宽可以选择为窄或宽，铁磁材料可用于填充螺旋电感器导体之间的空间。 本发明的螺旋电感器还可以与传统的水平电感器串联或串联使用。

公开(公告)号：US06803848B2

公开(公告)日：2004-10-12

申请号：US10271006

申请日：2002-10-15

申请人： Kiat Seng Yeo ,  Hai Peng Tan ,  Jian Guo Ma ,  Manh Anh Do ,  Kok Wai Johnny Chew

发明人： Kiat Seng Yeo ,  Hai Peng Tan ,  Jian Guo Ma ,  Manh Anh Do ,  Kok Wai Johnny Chew

IPC分类号： H01F500

CPC分类号： H01L28/10 ,  H01L27/08

摘要： A new structure and method is provided for the creation of an inductor on the surface of a silicon semiconductor substrate. The inductor is of a helix coil design having upper level and lower level conductors further having an axis whereby the axis of the helix coil of the inductor is parallel to the plane of the underlying substrate. Under the first embodiment of the invention, the height of the helix coil that is created on the surface of a silicon substrate is uniform. Under the second embodiment of the invention the height of the helix coil of the inductor of the invention is uniform while a ferromagnetic core is inserted between the upper and the lower level conductors of the helix coil. Under the third embodiment of the invention, the height of the helix coil that is created on the surface of a silicon substrate is non-uniform. Under the fourth embodiment of the invention the height of the helix coil of the inductor of the invention is non-uniform while a ferromagnetic core is inserted between the upper and the lower level conductors of the helix coil.

摘要翻译： 提供了一种新的结构和方法，用于在硅半导体衬底的表面上形成电感器。 电感器具有螺旋线圈设计，其具有上层和下层导体，其还具有轴线，由此电感器的螺旋线圈的轴线平行于下层衬底的平面。 在本发明的第一实施例中，在硅衬底的表面上产生的螺旋线圈的高度是均匀的。 在本发明的第二实施例中，本发明的电感器的螺旋线圈的高度是均匀的，而铁磁芯插入在螺旋线圈的上层和下层导体之间。 在本发明的第三实施例中，在硅衬底的表面上产生的螺旋线圈的高度是不均匀的。 在本发明的第四实施例中，本发明的电感器的螺旋线圈的高度是不均匀的，而铁磁芯被插入螺旋线圈的上层和下层导体之间。

公开(公告)号：US06535098B1

公开(公告)日：2003-03-18

申请号：US09519866

申请日：2000-03-06

申请人： Kiat Seng Yeo ,  Hai Peng Tan ,  Jian Guo Ma ,  Manh Anh Do ,  Kok Wai Johnny Chew

发明人： Kiat Seng Yeo ,  Hai Peng Tan ,  Jian Guo Ma ,  Manh Anh Do ,  Kok Wai Johnny Chew

IPC分类号： H01F500

CPC分类号： H01L28/10 ,  H01L27/08

摘要： A new structure and method is provided for the creation of an inductor on the surface of a silicon semiconductor substrate. The inductor is of a helix coil design having upper level and lower level conductors further having an axis whereby the axis of the helix coil of the inductor is parallel to the plane of the underlying substrate. Under the first embodiment of the invention, the height of the helix coil that is created on the surface of a silicon substrate is uniform. Under the second embodiment of the invention the height of the helix coil of the inductor of the invention is uniform while a ferromagnetic core is inserted between the upper and the lower level conductors of the helix coil. Under the third embodiment of the invention, the height of the helix coil that is created on the surface of a silicon substrate is non-uniform. Under the fourth embodiment of the invention the height of the helix coil of the inductor of the invention is non-uniform while a ferromagnetic core is inserted between the upper and the lower level conductors of the helix coil.

公开(公告)号：US06586309B1

公开(公告)日：2003-07-01

申请号：US09556423

申请日：2000-04-24

申请人： Kiat Seng Yeo ,  Hai Peng Tan ,  Jianguo Ma ,  Manh Anh Do ,  Kok Wai Johnny Chew

发明人： Kiat Seng Yeo ,  Hai Peng Tan ,  Jianguo Ma ,  Manh Anh Do ,  Kok Wai Johnny Chew

IPC分类号： H01L2120

CPC分类号： H01L24/48 ,  H01F17/0006 ,  H01F17/0033 ,  H01F41/041 ,  H01L23/5227 ,  H01L23/645 ,  H01L24/45 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/49176 ,  H01L2224/49431 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A method of fabricating an inductor using bonding techniques in the manufacture of integrated circuits is described. Bonding pads are provided over a semiconductor substrate. Input/output connections are made to at least two of the bonding pads. A plurality of wire bond loops are made between each two of the bonding pads wherein the plurality of wire bond loops forms the inductor.

公开(公告)号：US07023315B2

公开(公告)日：2006-04-04

申请号：US10448882

申请日：2003-05-29

申请人： Kiat Seng Yeo ,  Hai Peng Tan ,  Jianguo Ma ,  Manh Anh Do ,  Kok Wai Johnny Chew

发明人： Kiat Seng Yeo ,  Hai Peng Tan ,  Jianguo Ma ,  Manh Anh Do ,  Kok Wai Johnny Chew

IPC分类号： H01F5/00

CPC分类号： H01L24/48 ,  H01F17/0006 ,  H01F17/0033 ,  H01F41/041 ,  H01L23/5227 ,  H01L23/645 ,  H01L24/45 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/49176 ,  H01L2224/49431 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A method of fabricating an inductor using bonding techniques in the manufacture of integrated circuits is described. Bonding pads are provided over a semiconductor substrate. Input/output connections are made to at least two of the bonding pads. A plurality of wire bond loops are made between each two of the bonding pads wherein the plurality of wire bond loops forms the inductor.