公开(公告)号：US20080215188A1

公开(公告)日：2008-09-04

申请号：US11721066

申请日：2004-12-08

申请人： Kikukatsu Ito ,  Takanori Ito ,  Hiroshi Osada ,  Shigeki Chiba

发明人： Kikukatsu Ito ,  Takanori Ito ,  Hiroshi Osada ,  Shigeki Chiba

IPC分类号： G05D23/00

CPC分类号： G05D23/19

摘要： The temperature of a predetermined object is controlled by feedback control that uses the temperature control algorithm of a homeothermic plant.

摘要翻译： 预定对象的温度由使用温度控制装置的温度控制算法的反馈控制来控制。

公开(公告)号：US08150558B2

公开(公告)日：2012-04-03

申请号：US11721066

申请日：2004-12-08

申请人： Kikukatsu Ito ,  Takanori Ito ,  Hiroshi Osada ,  Shigeki Chiba

发明人： Kikukatsu Ito ,  Takanori Ito ,  Hiroshi Osada ,  Shigeki Chiba

IPC分类号： G05D23/00

CPC分类号： G05D23/19

摘要： The temperature of an object is controlled by a feedback control algorithm based on the temperature control characteristics of a homeothermic plant.

摘要翻译： 物体的温度由基于温度控制特性的反馈控制算法控制。

公开(公告)号：US08526189B2

公开(公告)日：2013-09-03

申请号：US13074675

申请日：2011-03-29

申请人： Gentaro Yamanaka ,  Hiroshi Osada ,  Yasushi Yamada ,  Naoto Kikuchi ,  Norifumi Furuta ,  Takashi Ueno

发明人： Gentaro Yamanaka ,  Hiroshi Osada ,  Yasushi Yamada ,  Naoto Kikuchi ,  Norifumi Furuta ,  Takashi Ueno

IPC分类号： H05K5/00

CPC分类号： H05K7/1432 ,  H02M7/003

摘要： A power module includes a semiconductor device having a first and second arms, and gate driving circuit board. The first arm includes a first extending electrode, a first gate electrode of a first power device extending in a direction different from the first extending electrode, and a first output electrode extending in the different direction from the first gate electrode. The second arm stacked on the first arm includes a second extending electrode extending in the first extending electrode extending direction in an insulating state, a second gate electrode of a second power device, extending in the first gate electrode extending direction, and a second output electrode extending in the first output electrode extending direction with electrical connection thereto. The gate driving circuit board is disposed at the first and second gate electrodes extending side so as to face the semiconductor device.

摘要翻译： 功率模块包括具有第一和第二臂的半导体器件和栅极驱动电路板。 第一臂包括第一延伸电极，沿与第一延伸电极不同的方向延伸的第一功率器件的第一栅电极和沿与第一栅电极不同的方向延伸的第一输出电极。 堆叠在第一臂上的第二臂包括在绝缘状态下沿第一延伸电极延伸方向延伸的第二延伸电极，在第一栅电极延伸方向上延伸的第二功率器件的第二栅电极和第二输出电极 在与第一输出电极延伸方向电连接的状态下延伸。 栅极驱动电路板设置在第一和第二栅电极延伸侧以面对半导体器件。

公开(公告)号：US08503181B2

公开(公告)日：2013-08-06

申请号：US13059664

申请日：2009-08-27

申请人： Kiyofumi Nakajima ,  Hiroshi Osada ,  Yukio Miyachi

发明人： Kiyofumi Nakajima ,  Hiroshi Osada ,  Yukio Miyachi

IPC分类号： H05K7/20 ,  H01L23/48

CPC分类号： H01L23/473 ,  H01L23/3735 ,  H01L23/467 ,  H01L25/071 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00

摘要： A semiconductor apparatus 10 includes a radiator 30 on which plural semiconductor modules 20 that include semiconductor elements 21 are mounted, the semiconductor apparatus 10 characterized by the radiator 30 including a first main surface 30B and a second main surface 30C configured to be located on the opposite side of the first main surface 30B. Semiconductor module mount-surfaces 30B1, 30B2, 30C1, 30C2 are arranged in the first main surface 30B and the second main surface 30C in a zigzag pattern in cross-sectional view; and the semiconductor modules 20 are mounted onto some or all of the semiconductor module mount-surfaces 30B1, 30B2, 30C1, 30C2.

摘要翻译： 半导体装置10包括：散热器30，其上安装有包括半导体元件21的多个半导体模块20，半导体装置10的特征在于散热器30包括第一主表面30B和第二主表面30C，第二主表面30C被配置为位于相对的 侧的第一主表面30B。 半导体模块安装面30B1,30B2,30C1,30C2以剖视图的Z字形图案布置在第一主表面30B和第二主表面30C中; 并且半导体模块20安装在半导体模块安装表面30B1,30B2,30C1,30C2的一些或全部上。

公开(公告)号：US08291967B2

公开(公告)日：2012-10-23

申请号：US12304891

申请日：2007-06-12

申请人： Tadafumi Yoshida ,  Hiroshi Osada ,  Yutaka Yokoi

发明人： Tadafumi Yoshida ,  Hiroshi Osada ,  Yutaka Yokoi

IPC分类号： F28F7/00 ,  F28D15/00 ,  H05K7/20

CPC分类号： H01L23/473 ,  F28F3/02 ,  F28F3/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink includes a plurality of fins. The fins are formed to serve as partition walls of flow paths of a coolant. The fins are formed such that the coolant flows along a surface thereof. A merge space is formed to allow the coolant in the flow paths separated by the fins to merge. The merge space is formed in the flow paths formed by the fins.

摘要翻译： 散热器包括多个翅片。 翅片形成为用作冷却剂流动路径的分隔壁。 翅片形成为使得冷却剂沿其表面流动。 形成合并空间以允许由翅片分开的流动路径中的冷却剂合流。 在由翅片形成的流路中形成合并空间。

公开(公告)号：US08251131B2

公开(公告)日：2012-08-28

申请号：US12307493

申请日：2007-07-10

申请人： Tadafumi Yoshida ,  Yutaka Yokoi ,  Hiroshi Osada

发明人： Tadafumi Yoshida ,  Yutaka Yokoi ,  Hiroshi Osada

IPC分类号： B60H1/00 ,  F28D11/06 ,  F28D15/00 ,  H01L23/34 ,  H05K7/20

CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H05K7/20927 ,  H01L2924/00

摘要： A cooling device including a heat absorbing unit, provided with an inflow port of a coolant medium and a discharge port for discharging the coolant medium, sealing the coolant medium in parts other than the inflow port and the discharge port, wherein the heat absorbing unit includes an upper member having an installation surface where semiconductor elements serving as an object to be cooled are installed and a cooling surface serving as a back surface of installation surface, and a lower member forming a chamber having cooling surface as a part of a inner wall surface together with upper member. Injection ports communicating with inflow port for injecting the coolant medium toward cooling surface are provided and the discharge port is provided at a position lower than opening positions of injection ports in lower member.

摘要翻译： 一种冷却装置，包括设有冷却剂介质的流入口的吸热单元和用于排出冷却剂介质的排出口，将冷却介质密封在流入口和排出口以外的部分，其中，吸热单元包括 安装具有用作待冷却物体的半导体元件的安装表面的上部构件和用作安装表面的后表面的冷却表面，以及形成具有作为内壁表面的一部分的冷却表面的室的下部构件 与上层成员一起。 设置与流入口连通以将冷却剂介质朝向冷却表面喷射的喷射口，并且排出口设置在低于下部构件中的喷射口的打开位置的位置。

公开(公告)号：US08213179B2

公开(公告)日：2012-07-03

申请号：US12664572

申请日：2008-06-10

申请人： Tadafumi Yoshida ,  Hiroshi Osada ,  Yutaka Yokoi ,  Yasushi Yamada

发明人： Tadafumi Yoshida ,  Hiroshi Osada ,  Yutaka Yokoi ,  Yasushi Yamada

IPC分类号： H05K7/20

CPC分类号： H05K7/20927 ,  H01L23/473 ,  H01L25/072 ,  H01L2924/0002 ,  H02M7/003 ,  H05K7/20254 ,  H01L2924/00

摘要： A semiconductor element cooling structure includes a plurality of semiconductor elements, and electrode structure, which has cooling medium channels therein and is electrically connected to the plurality of semiconductor elements. The electrode structure includes an alternating current electrode having the semiconductor elements on each of opposite surfaces, and a plurality of direct current electrodes holding therebetween the alternating current electrode and the semiconductor elements respectively mounted on the opposite surfaces of the alternating current electrode. Each of the alternating current electrode and the direct current electrodes has the cooling medium channels therein.

摘要翻译： 半导体元件冷却结构包括多个半导体元件和在其中具有冷却介质通道并与多个半导体元件电连接的电极结构。 电极结构包括在相对表面各自具有半导体元件的交流电极和分别安装在交流电极的相对表面上的交流电极和半导体元件之间的多个直流电极。 每个交流电极和直流电极都具有冷却介质通道。

公开(公告)号：US08125078B2

公开(公告)日：2012-02-28

申请号：US12521225

申请日：2008-01-09

申请人： Tadafumi Yoshida ,  Hiroshi Osada ,  Yutaka Yokoi

发明人： Tadafumi Yoshida ,  Hiroshi Osada ,  Yutaka Yokoi

IPC分类号： H01L23/34

CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor element cooling structure includes first and second semiconductor elements; a heat sink having a mounting surface on which the semiconductor elements are mounted and a cooling medium channel formed inside, through which a cooling medium for cooling the semiconductor elements flows; and a protruded portion provided at a position opposite to the mounting surface of the heat sink, extending in a direction intersecting flow direction of the cooling medium (direction of arrow DR1) and protruding from a bottom surface of the cooling medium channel to the inside of cooling medium channel. The semiconductor elements are arranged side by side in the direction of arrow DR1, such that the first semiconductor element is positioned upstream side than the second semiconductor element. A protruded portion for the second semiconductor element is provided to be positioned on the downstream side of first semiconductor element and upstream side than the center of second semiconductor element in the direction of arrow DR1.

摘要翻译： 半导体元件冷却结构包括第一和第二半导体元件; 具有安装有半导体元件的安装面的散热器和内部形成的冷却介质通道，用于冷却半导体元件的冷却介质流过该散热器; 以及突出部，其设置在与所述散热器的安装面相反的位置，在与所述冷却介质的流动方向（箭头DR1的方向）相交的方向上延伸并且从所述冷却介质通道的底面突出到所述冷却介质的内部 冷却介质通道。 半导体元件沿箭头DR1的方向并排布置，使得第一半导体元件位于比第二半导体元件的上游侧。 第二半导体元件的突出部分设置成位于第一半导体元件的下游侧并且比箭头DR1的方向上的第二半导体元件的中心更靠上游侧。

公开(公告)号：US5795118A

公开(公告)日：1998-08-18

申请号：US811631

申请日：1997-03-05

申请人： Hiroshi Osada ,  Hiroyuki Nakaya

发明人： Hiroshi Osada ,  Hiroyuki Nakaya

IPC分类号： F16B11/00 ,  B29C65/06 ,  C04B35/52 ,  F16B5/04 ,  F16B5/06 ,  F16B19/10 ,  F16B21/06 ,  F16B37/06

CPC分类号： B29C65/0672 ,  B29C66/1122 ,  B29C66/30221 ,  B29C66/30223 ,  B29C66/474 ,  C04B35/52 ,  F16B11/004 ,  F16B19/1081 ,  F16B5/065 ,  F16B5/0657 ,  F16B5/0664 ,  B29C66/71 ,  B29C66/727 ,  B29C66/8322 ,  B29L2031/727 ,  B29L2031/7282 ,  F16B5/04 ,  Y10S411/908

摘要： A tacking device for tacking a first member to a second member comprises a tacking member having a fusible plate and a pin having a bulged tip and projecting from the lower surface of the fusible plate; and a retaining member having a substantially cylindrical body provided with a plurality of catches on its outer circumference. The tacking member is rotated at a high rotating speed or vibrated with the fusible plate pressed against the first member so that the upper surface of the fusible plate is fused by frictional heat to weld the tacking member to the first member, the pin is inserted in the central hollow of the retaining member so that the expanded tip of the pin is caught by the retaining member to combine the tacking member and the retaining member, and the retaining member is forced into a hole formed in the second member so that the catches engage with the edge of the hole to tack the first member to the second member.

摘要翻译： 用于将第一构件固定到第二构件的固定装置包括具有可熔板和具有凸出尖端并且从熔丝板的下表面突出的销的固定构件; 以及保持构件，其具有在其外周上设置有多个卡扣的大致圆筒体。 固定构件以高转速旋转或与可熔板压靠在第一构件上振动，使得可熔融板的上表面通过摩擦热熔合，以将定位构件焊接到第一构件，将销插入 所述保持构件的中心中空部分，使得所述销的所述膨胀尖端被所述保持构件卡合以将所述固定构件与所述保持构件结合，并且所述保持构件被迫进入形成在所述第二构件中的孔中，使得所述卡扣接合 孔的边缘将第一构件固定到第二构件。

公开(公告)号：US4884657A

公开(公告)日：1989-12-05

申请号：US311248

申请日：1989-02-16

申请人： Hiroshi Osada

发明人： Hiroshi Osada

IPC分类号： F01N1/10 ,  F01N1/08 ,  F01N13/18

CPC分类号： F01N13/1805 ,  F01N1/082

摘要： A muffler includes a cylindrical body, a gas passage pipe insertedly mounted within the cylindrical body, and a sound absorber mounted upon the gas passage pipe in an encircling manner. Gas is discharged from the gas passage pipe through the cylindrical body and sound absorber. The cylindrical body has a disk-like partitioning wall axially dividing the interior space thereof. The gas passage pipe has an outer flange and a plurality of pawls cooperating with the flange so as to clamp the partitioning wall therebetween.

摘要翻译： 消音器包括圆柱体，插入安装在圆柱体内的气体通道管，以及以环绕方式安装在气体通道管上的吸声器。 气体从气体通道管通过圆柱体和吸声器排出。 圆柱体具有轴向分隔其内部空间的盘状分隔壁。 气体通道管具有外凸缘和与凸缘配合的多个棘爪，以便将分隔壁夹在其间。