公开(公告)号：US08526189B2

公开(公告)日：2013-09-03

申请号：US13074675

申请日：2011-03-29

申请人： Gentaro Yamanaka ,  Hiroshi Osada ,  Yasushi Yamada ,  Naoto Kikuchi ,  Norifumi Furuta ,  Takashi Ueno

发明人： Gentaro Yamanaka ,  Hiroshi Osada ,  Yasushi Yamada ,  Naoto Kikuchi ,  Norifumi Furuta ,  Takashi Ueno

IPC分类号： H05K5/00

CPC分类号： H05K7/1432 ,  H02M7/003

摘要： A power module includes a semiconductor device having a first and second arms, and gate driving circuit board. The first arm includes a first extending electrode, a first gate electrode of a first power device extending in a direction different from the first extending electrode, and a first output electrode extending in the different direction from the first gate electrode. The second arm stacked on the first arm includes a second extending electrode extending in the first extending electrode extending direction in an insulating state, a second gate electrode of a second power device, extending in the first gate electrode extending direction, and a second output electrode extending in the first output electrode extending direction with electrical connection thereto. The gate driving circuit board is disposed at the first and second gate electrodes extending side so as to face the semiconductor device.

摘要翻译： 功率模块包括具有第一和第二臂的半导体器件和栅极驱动电路板。 第一臂包括第一延伸电极，沿与第一延伸电极不同的方向延伸的第一功率器件的第一栅电极和沿与第一栅电极不同的方向延伸的第一输出电极。 堆叠在第一臂上的第二臂包括在绝缘状态下沿第一延伸电极延伸方向延伸的第二延伸电极，在第一栅电极延伸方向上延伸的第二功率器件的第二栅电极和第二输出电极 在与第一输出电极延伸方向电连接的状态下延伸。 栅极驱动电路板设置在第一和第二栅电极延伸侧以面对半导体器件。

公开(公告)号：US08294272B2

公开(公告)日：2012-10-23

申请号：US12728442

申请日：2010-03-22

申请人： Yasushi Yamada ,  Hiroshi Osada ,  Gentaro Yamanaka ,  Norifumi Furuta ,  Akio Kitami ,  Tadafumi Yoshida ,  Hiromichi Kuno

发明人： Yasushi Yamada ,  Hiroshi Osada ,  Gentaro Yamanaka ,  Norifumi Furuta ,  Akio Kitami ,  Tadafumi Yoshida ,  Hiromichi Kuno

IPC分类号： H01L23/36 ,  H01L23/38 ,  H01L23/34 ,  H01L25/07 ,  H01L23/48 ,  H01L25/16 ,  H01L35/28

CPC分类号： H01L23/38 ,  H01L23/427 ,  H01L23/62 ,  H01L23/642 ,  H01L24/29 ,  H01L24/32 ,  H01L25/074 ,  H01L25/16 ,  H01L2224/73253 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/30107

摘要： A power module includes a pair of power devices that are stacked with a plate-shaped output electrode arranged therebetween, and an N-electrode and a P-electrode that are stacked with the pair of power devices arranged therebetween. The output electrode is anisotropic such that the thermal conductivity in a direction orthogonal to the stacking direction is greater than the thermal conductivity in the stacking direction. Also, the output electrode extends in the orthogonal direction from a stacked area where the pair of power devices are stacked. The N-electrode and the P-electrode extend in the orthogonal direction while maintaining an opposing positional relationship.

摘要翻译： 功率模块包括堆叠有布置在其间的板状输出电极的一对功率器件，以及配置在其间的一对功率器件堆叠的N电极和P电极。 输出电极是各向异性的，使得与层叠方向正交的方向的导热率大于层叠方向的导热率。 此外，输出电极从堆叠的一对功率器件的堆叠区域沿正交方向延伸。 N电极和P电极在正交方向上延伸，同时保持相对的位置关系。

公开(公告)号：US08471386B2

公开(公告)日：2013-06-25

申请号：US13148150

申请日：2010-02-02

申请人： Yasushi Yamada ,  Hiroshi Osada ,  Yuji Yagi ,  Tadafumi Yoshida

发明人： Yasushi Yamada ,  Hiroshi Osada ,  Yuji Yagi ,  Tadafumi Yoshida

IPC分类号： H01L23/48

CPC分类号： B23K35/007 ,  B22F7/006 ,  B22F7/08 ,  B23K35/262 ,  B23K35/28 ,  B23K35/30 ,  B32B15/01 ,  C22C9/02 ,  C22C13/00 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/0135 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/351 ,  H01L2924/05432 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/00014

摘要： A junction body has a first member and a second member each of which is provided with a joining surface whose main component is copper. A solder member containing, in a tin-base solder material, a three-dimensional web structure whose main component is copper is provided between the first member and the second member. A copper-tin alloy whose average thickness is 2 μm or more but 20 μm or less is provided between the joining surfaces and the three-dimensional web structure.

摘要翻译： 接合体具有第一构件和第二构件，每个构件具有主要成分为铜的接合表面。 在锡基焊料中含有主要成分为铜的三维网状结构的焊料构件设置在第一构件和第二构件之间。 平均厚度为2μm以上且20μm以下的铜锡合金设置在接合面和三维网状结构体之间。

公开(公告)号：US20100182747A1

公开(公告)日：2010-07-22

申请号：US12664572

申请日：2008-06-10

申请人： Tadafumi Yoshida ,  Hiroshi Osada ,  Yutaka Yokoi ,  Yasushi Yamada

发明人： Tadafumi Yoshida ,  Hiroshi Osada ,  Yutaka Yokoi ,  Yasushi Yamada

IPC分类号： H05K7/20

CPC分类号： H05K7/20927 ,  H01L23/473 ,  H01L25/072 ,  H01L2924/0002 ,  H02M7/003 ,  H05K7/20254 ,  H01L2924/00

摘要： A semiconductor element cooling structure includes a plurality of semiconductor elements, and electrode structure, which has cooling medium channels therein and is electrically connected to the plurality of semiconductor elements. The electrode structure includes an alternating current electrode having the semiconductor elements on each of opposite surfaces, and a plurality of direct current electrodes holding therebetween the alternating current electrode and the semiconductor elements respectively mounted on the opposite surfaces of the alternating current electrode. Each of the alternating current electrode and the direct current electrodes has the cooling medium channels therein.

摘要翻译： 半导体元件冷却结构包括多个半导体元件和在其中具有冷却介质通道并与多个半导体元件电连接的电极结构。 电极结构包括在相对表面各自具有半导体元件的交流电极和分别安装在交流电极的相对表面上的交流电极和半导体元件之间的多个直流电极。 每个交流电极和直流电极都具有冷却介质通道。

公开(公告)号：US20110291282A1

公开(公告)日：2011-12-01

申请号：US13148150

申请日：2010-02-02

申请人： Yasushi Yamada ,  Hiroshi Osada ,  Yuji Yagi ,  Tadafumi Yoshida

发明人： Yasushi Yamada ,  Hiroshi Osada ,  Yuji Yagi ,  Tadafumi Yoshida

IPC分类号： H01L23/14 ,  B23K1/20 ,  H01B5/00

CPC分类号： B23K35/007 ,  B22F7/006 ,  B22F7/08 ,  B23K35/262 ,  B23K35/28 ,  B23K35/30 ,  B32B15/01 ,  C22C9/02 ,  C22C13/00 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/0135 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/351 ,  H01L2924/05432 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/00014

摘要： A junction body has a first member and a second member each of which is provided with a joining surface whose main component is copper. A solder member containing, in a tin-base solder material, a three-dimensional web structure whose main component is copper is provided between the first member and the second member. A copper-tin alloy whose average thickness is 2 μm or more but 20 μm or less is provided between the joining surfaces and the three-dimensional web structure.

摘要翻译： 接合体具有第一构件和第二构件，每个构件具有主要成分为铜的接合表面。 在锡基焊料中含有主要成分为铜的三维网状结构的焊料构件设置在第一构件和第二构件之间。 平均厚度为2μm以上且20μm以下的铜锡合金设置在接合面和三维网状结构体之间。

公开(公告)号：US08213179B2

公开(公告)日：2012-07-03

申请号：US12664572

申请日：2008-06-10

申请人： Tadafumi Yoshida ,  Hiroshi Osada ,  Yutaka Yokoi ,  Yasushi Yamada

发明人： Tadafumi Yoshida ,  Hiroshi Osada ,  Yutaka Yokoi ,  Yasushi Yamada

IPC分类号： H05K7/20

CPC分类号： H05K7/20927 ,  H01L23/473 ,  H01L25/072 ,  H01L2924/0002 ,  H02M7/003 ,  H05K7/20254 ,  H01L2924/00

摘要： A semiconductor element cooling structure includes a plurality of semiconductor elements, and electrode structure, which has cooling medium channels therein and is electrically connected to the plurality of semiconductor elements. The electrode structure includes an alternating current electrode having the semiconductor elements on each of opposite surfaces, and a plurality of direct current electrodes holding therebetween the alternating current electrode and the semiconductor elements respectively mounted on the opposite surfaces of the alternating current electrode. Each of the alternating current electrode and the direct current electrodes has the cooling medium channels therein.

摘要翻译： 半导体元件冷却结构包括多个半导体元件和在其中具有冷却介质通道并与多个半导体元件电连接的电极结构。 电极结构包括在相对表面各自具有半导体元件的交流电极和分别安装在交流电极的相对表面上的交流电极和半导体元件之间的多个直流电极。 每个交流电极和直流电极都具有冷却介质通道。

公开(公告)号：US20130085270A1

公开(公告)日：2013-04-04

申请号：US13703220

申请日：2011-06-08

申请人： Yasushi Yamada ,  Keigo Hanaki ,  Toshiteru Komatsu

发明人： Yasushi Yamada ,  Keigo Hanaki ,  Toshiteru Komatsu

IPC分类号： C07H17/07

CPC分类号： C07H17/07 ,  A61K31/05 ,  A61K31/192 ,  A61K31/366 ,  A61K31/7048 ,  Y02P20/582

摘要： A method for producing a polyphenol composition including a step of subjecting (A) a hardly water-soluble polyphenol and (B) one or more selected from cathechins, chlorogenic acids and methylated compounds of hardly water-soluble polyphenols to a heat treatment at from 100 to 180° C. in the presence of an aqueous medium.

公开(公告)号：US20110091689A1

公开(公告)日：2011-04-21

申请号：US12997878

申请日：2009-06-23

申请人： Fuminori Horio ,  Yasushi Yamada

发明人： Fuminori Horio ,  Yasushi Yamada

IPC分类号： B32B3/12

CPC分类号： C08G18/4837 ,  C08G18/165 ,  C08G18/18 ,  C08G18/2027 ,  C08G18/246 ,  C08G18/4018 ,  C08G18/4072 ,  C08G18/4261 ,  C08G18/48 ,  C08G18/632 ,  C08G2101/00 ,  C08G2101/0083 ,  Y10T428/24512 ,  Y10T428/249953

摘要： The object of the present invention is to provide a polyurethane foam for flame lamination which has an excellent balance between adhesiveness to a fabric comprising synthetic fibers or natural fibers, a leather or the like and residual compression strain and has an excellent wet-heat resistance, and a laminated body including a foamed material layer consisting of the polyurethane foam. The polyurethane foam for flame lamination is characterized by being produced using a foam raw material containing a polyol such as a polyether polyol, a polyisocyanate, a foaming agent, a foam control agent, an amine-based catalyst and a urea compound such as urea and azodicarbonamide.

摘要翻译： 本发明的目的是提供一种用于火焰层压的聚氨酯泡沫，其在与包含合成纤维或天然纤维的织物的粘合性，皮革等之间和残余压缩应变之间具有优异的平衡，并且具有优异的耐湿热性， 以及包含由聚氨酯泡沫构成的发泡材料层的层叠体。 用于火焰层压的聚氨酯泡沫的特征在于使用含有多元醇的泡沫原料，例如聚醚多元醇，多异氰酸酯，发泡剂，泡沫控制剂，胺类催化剂和尿素化合物如尿素和 偶氮二甲酰胺。

公开(公告)号：US20100109016A1

公开(公告)日：2010-05-06

申请号：US12596382

申请日：2008-04-17

申请人： Yuji Yagi ,  Yasushi Yamada ,  Ikuo Nakagawa ,  Takashi Atsumi ,  Mikio Shirai ,  Ikuo Ohnuma ,  Kiyohito Ishida ,  Yoshikazu Takaku

发明人： Yuji Yagi ,  Yasushi Yamada ,  Ikuo Nakagawa ,  Takashi Atsumi ,  Mikio Shirai ,  Ikuo Ohnuma ,  Kiyohito Ishida ,  Yoshikazu Takaku

IPC分类号： H01L23/488 ,  H01L29/12

CPC分类号： H01L23/3735 ,  H01L23/473 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83447 ,  H01L2224/838 ,  H01L2224/83805 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/1579 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/83205

摘要： Provided is a power semiconductor module in which two components are bonded by a Bi based solder material. A Cu layer is provided on the surfaces thereof to be bonded by the Bi based solder material on the two-component. Two components, i.e., the components to be bonded, are a combination of a semiconductor element and an insulating part, or a combination of an insulating part and a radiator plate. The insulating part is composed of a Cu/SiNx/Cu laminated body.

摘要翻译： 提供了一种功率半导体模块，其中两个部件通过Bi基焊料材料接合。 在其表面上设置有Cu层，以通过Bi基焊料材料粘接在双组分上。 两个部件，即待接合的部件，是半导体元件和绝缘部件的组合，或绝缘部件和散热器板的组合。 绝缘部由Cu / SiNx / Cu层叠体构成。

公开(公告)号：US20090138728A1

公开(公告)日：2009-05-28

申请号：US12081889

申请日：2008-04-23

申请人： Makoto Fujiwara ,  Yusuke Nemoto ,  Junichi Yasui ,  Takuji Maeda ,  Takayuki Ito ,  Yasushi Yamada ,  Shinji Inoue

发明人： Makoto Fujiwara ,  Yusuke Nemoto ,  Junichi Yasui ,  Takuji Maeda ,  Takayuki Ito ,  Yasushi Yamada ,  Shinji Inoue

IPC分类号： G06F12/14

CPC分类号： G06F21/123 ,  G06F21/572 ,  G06F21/72

摘要： A system including a secure LSI 1 establishes a communication path to/from a server 3 (UD1), and receives a common key-encrypted program generated by encryption with a common key and transmitted from the server 3 (UD6 and UD7). The received common key-encrypted program is decrypted to generate a raw program, and the raw program is re-encrypted with an inherent key to newly generate an inherent key-encrypted program, which is stored in an external memory.