Abstract:
Bonded composites, absorbent articles comprising such bonded composites, and processes for bonding thin-section elements. The bonded composite has first and second thin-section elements bonded to each other, at least in part by bond elements and at least in part by adherent material. The adherent material is disposed between the first and second thin-section elements proximate and about the bond elements. The adherent material, at least in part, bonds the thin-section elements to each other at loci of the adherent material. The bond patterns are arranged and configured to preferentially direct stresses imposed on the bond pattern, inwardly into the interior of the bond pattern for distribution, dissipation, and termination
Abstract:
A method for reducing adhesive build-up on ultrasonic bonding surfaces of ultrasonic bonding systems is disclosed. The method includes providing an ultrasonic bonding surface. A pad is provided proximate to, and in fluid contact with, the ultrasonic bonding system. A fluid is conducted to the pad such that the fluid is applied is intermittently or continuously applied to at least a portion of the ultrasonic bonding surface.
Abstract:
Bonded composites, absorbent articles comprising such bonded composites, and processes for bonding thin-section elements. The bonded composite has first and second thin-section elements bonded to each other, at least in part by bond elements and at least in part by adherent material. The adherent material is disposed between the first and second thin-section elements proximate and about the bond elements. The adherent material, at least in part, bonds the thin-section elements to each other at loci of the adherent material. The bond patterns are arranged and configured to preferentially direct stresses imposed on the bond pattern, inwardly into the interior of the bond pattern for distribution, dissipation, and termination.
Abstract:
Bonded composites, absorbent articles comprising such bonded composites, and processes for bonding thin-section elements. The bonded composite has first and second thin-section elements bonded to each other, at least in part by bond elements and at least in part by adherent material. The adherent material is disposed between the first and second thin-section elements proximate and about the bond elements. The adherent material, at least in part, bonds the thin-section elements to each other at loci of the adherent material. The bond patterns are arranged and configured to preferentially direct stresses imposed on the bond pattern, inwardly into the interior of the bond pattern for distribution, dissipation, and termination.
Abstract:
A method of wetting a web of material is described, which in general provides for applying a wetting solution to the web, and passing the web of material between a set of press rolls. The wetting solution may be applied at an add-on greater than 25%, and the web may travel at a speed of at least 60 meters per minute.