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    Multiple internal seal ring micro-electro-mechanical system vacuum packaging method
    1.
    发明授权
    Multiple internal seal ring micro-electro-mechanical system vacuum packaging method 有权
    多内密封环微机电系统真空包装方法

    公开(公告)号：US07396478B2

    公开(公告)日：2008-07-08

    申请号：US11850458

    申请日：2007-09-05

    申请人： Ken J. Hayworth ,  Karl Y. Yee ,  Kirill V. Shcheglov ,  Youngsam Bae ,  Dean V. Wiberg ,  A. Dorian Challoner ,  Chris S. Peay

    发明人： Ken J. Hayworth ,  Karl Y. Yee ,  Kirill V. Shcheglov ,  Youngsam Bae ,  Dean V. Wiberg ,  A. Dorian Challoner ,  Chris S. Peay

    IPC分类号： B44C1/22 ,  H01L21/00

    CPC分类号： G01C19/5719 ,  B81B7/007

    摘要： A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum packaging method that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings to a base plate having metal seal rings by wafer bonding the capping plate wafer to the base plate wafer. Bulk electrodes may be used to provide conductive paths between the seal rings on the base plate and the capping plate. All seals are made using only metal-to-metal seal rings deposited on the polished surfaces of the base plate and capping plate wafers. However, multiple electrical feed-through metal traces are provided by fabricating via holes through the capping plate for electrical connection from the outside of the package through the via-holes to the inside of the package. Each metal seal ring serves the dual purposes of hermetic sealing and providing the electrical feed-through metal trace.

    摘要翻译： 使用MISR密封MEMS器件的多内密封环（MISR）微机电系统（MEMS）真空包装方法。 该方法通过将封盖板晶片与基板晶片结合，将具有金属密封环的封盖板与具有金属密封环的基板结合。 散装电极可用于在基板和封盖板上的密封环之间提供导电路径。 所有密封件仅使用沉积在基板和封盖板晶片的抛光表面上的金属对金属密封环制成。 然而，通过制造通过盖板的通孔来提供多个电馈通金属迹线，用于从封装的外部通过通孔到封装的内部进行电连接。 每个金属密封环都用于气密密封的双重目的，并提供电气馈通金属痕迹。

    Integral resonator gyroscope
    2.
    发明授权
    Integral resonator gyroscope 有权
    积分谐振陀螺仪

    公开(公告)号：US07347095B2

    公开(公告)日：2008-03-25

    申请号：US11199004

    申请日：2005-08-08

    申请人： Kirill V. Shcheglov ,  A. Dorian Challoner ,  Ken J. Hayworth ,  Dean V. Wiberg ,  Karl Y. Yee

    发明人： Kirill V. Shcheglov ,  A. Dorian Challoner ,  Ken J. Hayworth ,  Dean V. Wiberg ,  Karl Y. Yee

    IPC分类号： G01P9/04

    CPC分类号： B81C3/001 ,  G01C19/5684 ,  Y10T29/49002 ,  Y10T29/49007 ,  Y10T29/4902

    摘要： The present invention discloses an inertial sensor having an integral resonator. A typical sensor comprises a planar mechanical resonator for sensing motion of the inertial sensor and a case for housing the resonator. The resonator and a wall of the case are defined through an etching process. A typical method of producing the resonator includes etching a baseplate, bonding a wafer to the etched baseplate, through etching the wafer to form a planar mechanical resonator and the wall of the case and bonding an end cap wafer to the wall to complete the case.

    摘要翻译： 本发明公开了一种具有整体式谐振器的惯性传感器。 典型的传感器包括用于感测惯性传感器的运动的平面机械谐振器和用于容纳谐振器的壳体。 谐振器和壳体的壁通过蚀刻工艺来定义。 制造谐振器的典型方法包括蚀刻基板，将晶片接合到蚀刻的基板上，通过蚀刻晶片以形成平面机械谐振器和壳体的壁并将端盖晶片结合到壁上以完成壳体。

    Multiple internal seal right micro-electro-mechanical system vacuum package
    3.
    发明授权
    Multiple internal seal right micro-electro-mechanical system vacuum package 有权
    多内密封右微电机系统真空包装

    公开(公告)号：US07285844B2

    公开(公告)日：2007-10-23

    申请号：US10865344

    申请日：2004-06-10

    申请人： Ken J. Hayworth ,  Karl Y. Yee ,  Kirill V. Shcheglov ,  Youngsam Bae ,  Dean V. Wiberg ,  A. Dorian Challoner ,  Chris S. Peay

    发明人： Ken J. Hayworth ,  Karl Y. Yee ,  Kirill V. Shcheglov ,  Youngsam Bae ,  Dean V. Wiberg ,  A. Dorian Challoner ,  Chris S. Peay

    IPC分类号： H01L23/552

    CPC分类号： G01C19/5719 ,  B81B7/007

    摘要： A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum package that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings to a base plate having metal seal rings by wafer bonding the capping plate wafer to the base plate wafer. Bulk electrodes may be used to provide conductive paths between the seal rings on the base plate and the capping plate. All seals are made using only metal-to-metal seal rings deposited on the polished surfaces of the base plate and capping plate wafers. However, multiple electrical feed-through metal traces are provided by fabricating via holes through the capping plate for electrical connection from the outside of the package through the via-holes to the inside of the package. Each metal seal ring serves the dual purposes of hermetic sealing and providing the electrical feed-through metal trace.

    摘要翻译： 使用MISR密封MEMS器件的多重内密封环（MISR）微机电系统（MEMS）真空封装。 该方法通过将封盖板晶片与基板晶片结合，将具有金属密封环的封盖板与具有金属密封环的基板结合。 散装电极可用于在基板和封盖板上的密封环之间提供导电路径。 所有密封件仅使用沉积在基板和封盖板晶片的抛光表面上的金属对金属密封环制成。 然而，通过制造通过盖板的通孔来提供多个电馈通金属迹线，用于从封装的外部通过通孔到封装的内部进行电连接。 每个金属密封环都用于气密密封的双重目的，并提供电气馈通金属痕迹。

    Method of producing an integral resonator sensor and case
    4.
    发明授权
    Method of producing an integral resonator sensor and case 有权
    一种积分谐振器传感器和壳体的制造方法

    公开(公告)号：US06944931B2

    公开(公告)日：2005-09-20

    申请号：US10639135

    申请日：2003-08-12

    申请人： Kirill V. Shcheglov ,  A. Dorian Challoner ,  Ken J. Hayworth ,  Dean V. Wiberg ,  Karl Y. Yee

    发明人： Kirill V. Shcheglov ,  A. Dorian Challoner ,  Ken J. Hayworth ,  Dean V. Wiberg ,  Karl Y. Yee

    IPC分类号： B81C3/00 ,  G01C19/5684 ,  G01R3/00

    CPC分类号： B81C3/001 ,  G01C19/5684 ,  Y10T29/49002 ,  Y10T29/49007 ,  Y10T29/4902

    摘要： The present invention discloses an inertial sensor having an integral resonator. A typical sensor comprises a planar mechanical resonator for sensing motion of the inertial sensor and a case for housing the resonator. The resonator and a wall of the case are defined through an etching process. A typical method of producing the resonator includes etching a baseplate, bonding a wafer to the etched baseplate, through etching the wafer to form a planar mechanical resonator and the wall of the case and bonding an end cap wafer to the wall to complete the case.

    摘要翻译： 本发明公开了一种具有整体式谐振器的惯性传感器。 典型的传感器包括用于感测惯性传感器的运动的平面机械谐振器和用于容纳谐振器的壳体。 谐振器和壳体的壁通过蚀刻工艺来定义。 制造谐振器的典型方法包括蚀刻基板，将晶片接合到蚀刻的基板上，通过蚀刻晶片以形成平面机械谐振器和壳体的壁并将端盖晶片结合到壁上以完成壳体。

    Miniature micromachined quadrupole mass spectrometer array and method of making the same
    5.
    发明授权
    Miniature micromachined quadrupole mass spectrometer array and method of making the same 失效
    微型微加工四极杆质谱仪阵列及其制作方法

    公开(公告)号：US06469299B2

    公开(公告)日：2002-10-22

    申请号：US09892313

    申请日：2001-06-26

    申请人： Ara Chutjian ,  Stephen D. Fuerstenau ,  Otto J. Orient ,  Karl Y. Yee ,  John T. Rice

    发明人： Ara Chutjian ,  Stephen D. Fuerstenau ,  Otto J. Orient ,  Karl Y. Yee ,  John T. Rice

    IPC分类号： H01J4942

    CPC分类号： H01J49/4215 ,  H01J49/0018 ,  H01J49/009 ,  Y10S977/773 ,  Y10S977/891

    摘要： The present invention provides a quadrupole mass spectrometer and an ion filter, or pole array, for use in the quadrupole mass spectrometer. The ion filter includes a thin patterned layer including a two-dimensional array of poles forming one or more quadrupoles. The patterned layer design permits the use of very short poles and with a very dense spacing of the poles, so that the ion filter may be made very small. Also provided is a method for making the ion filter and the quadrupole mass spectrometer. The method involves forming the patterned layer of the ion filter in such a way that as the poles of the patterned layer are formed, they have the relative positioning and alignment for use in a final quadrupole mass spectrometer device.

    摘要翻译： 本发明提供了用于四极质谱仪中的四极质谱仪和离子过滤器或极阵列。 离子过滤器包括薄的图案层，其包括形成一个或多个四极的二维阵列阵列。 图案层设计允许使用非常短的极点和极的非常密集的间隔，使得离子过滤器可以非常小。 还提供了制造离子过滤器和四极质谱仪的方法。 该方法包括以这样的方式形成离子过滤器的图案化层，使得当形成图案化层的极时，它们具有用于最终四极杆质谱仪装置中的相对定位和对准。