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公开(公告)号:US08267040B2
公开(公告)日:2012-09-18
申请号:US10589272
申请日:2005-02-15
申请人: Kiyotaka Ishibashi , Junichi Kitagawa , Singo Furui , Cai Zhong Tian , Jun Yamashita , Nobuhiko Yamamoto , Tetsuya Nishizuka , Toshihisa Nozawa , Shinya Nishimoto , Tamaki Yuasa
发明人: Kiyotaka Ishibashi , Junichi Kitagawa , Singo Furui , Cai Zhong Tian , Jun Yamashita , Nobuhiko Yamamoto , Tetsuya Nishizuka , Toshihisa Nozawa , Shinya Nishimoto , Tamaki Yuasa
IPC分类号: C23C16/00 , C23F1/00 , H01L21/306
CPC分类号: H01J37/32192 , H01J37/32238
摘要: In a plasma processing apparatus that processes a wafer in a process vessel by plasma generated by the supply of a microwave, a transmissive window has, in a center area of its lower surface, a hanging portion made of the same material as a material of the transmissive window. Between an outer peripheral surface of the hanging portion and a sidewall inner surface continuing from a support part, a gap is formed, the gap having a gap length of 0.5 to 10 mm, more preferably 0.5 to 5 mm. The generation of a strong electric field and plasma at a contact point is inhibited and an amount of sputtered particles, radicals, or the like reaching the wafer is also reduced.
摘要翻译: 在通过供给微波产生的等离子体处理处理容器中的晶片的等离子体处理装置中,透光窗口在其下表面的中心区域具有由与材料相同的材料制成的悬挂部分 透光窗。 在悬挂部的外周面与从支撑部延续的侧壁内表面之间形成有间隙,间隙长度为0.5〜10mm,更优选为0.5〜5mm。 在接触点处产生强电场和等离子体被抑制,并且溅射的颗粒,自由基等到达晶片的量也减少。
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公开(公告)号:US20070264441A1
公开(公告)日:2007-11-15
申请号:US10589272
申请日:2005-02-15
申请人: Kiyotaka Ishibashi , Junichi Kitagawa , Singo Furui , Cai Tian , Jun Yamashita , Nobuhiko Yamamoto , Tetsuya Nishizuka , Toshihisa Nozawa , Shinya Nishimoto , Tamaki Yuasa
发明人: Kiyotaka Ishibashi , Junichi Kitagawa , Singo Furui , Cai Tian , Jun Yamashita , Nobuhiko Yamamoto , Tetsuya Nishizuka , Toshihisa Nozawa , Shinya Nishimoto , Tamaki Yuasa
CPC分类号: H01J37/32192 , H01J37/32238
摘要: To improve processing quality by inhibiting the generation of a strong electric field and high-density plasma, near a contact point between a support part supporting a transmissive window and the transmissive window in a plasma processing apparatus utilizing a microwave. In a plasma processing apparatus that processes a wafer W in a process vessel 2 by plasma generated by the supply of a microwave, a transmissive window 20 has, in a center area of its lower surface, a hanging portion 21 made of the same material as a material of the transmissive window 20. Between an outer peripheral surface 21a of the hanging portion 21 and a sidewall inner surface 5a continuing from a support part 6, a gap d is formed, the gap d having a gap length of 0.5 to 10 mm, more preferably 0.5 to 5 mm. The generation of a strong electric field and plasma at the contact point C is inhibited and an amount of sputtered particles, radicals, or the like reaching the wafer W is also reduced.
摘要翻译: 通过在利用微波的等离子体处理装置中,在支撑透射窗口的支撑部件与透射窗口之间的接触点附近抑制强电场和高密度等离子体的产生来提高处理质量。 在通过由微波供给产生的等离子体处理处理容器2中的晶片W的等离子体处理装置中,透光窗20在其下表面的中心区域具有由与 透气窗20的材料。在悬挂部分21的外周表面21a和从支撑部分6延伸的侧壁内表面5a之间形成间隙d,间隙d的间隙长度为0.5至 10mm,更优选为0.5〜5mm。 在接触点C处产生强电场和等离子体被抑制,并且溅射的颗粒,自由基等到达晶片W的量也减少。
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