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公开(公告)号：US11104571B2
公开(公告)日：2021-08-31
申请号：US16312324
申请日：2017-06-09
摘要： Systems and apparatuses for a microelectromechanical system (MEMS) device. The MEMS device includes a housing, a transducer, and a sensor. The housing includes a substrate defining a port and a cover. The substrate and the cover cooperatively form an internal cavity. The port fluidly couples the internal cavity to an external environment. The transducer is disposed within the internal cavity and positioned to receive acoustic energy through the port. The transducer is configured to convert the acoustic energy into an electrical signal. The sensor is disposed within the internal cavity and positioned to receive a gas through the port. The sensor is configured to facilitate detecting at least one of an offensive odor, smoke, a volatile organic compound, carbon monoxide, carbon dioxide, a nitrogen oxide, methane, and ozone.
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公开(公告)号：US10149031B2
公开(公告)日：2018-12-04
申请号：US15604414
申请日：2017-05-24
IPC分类号： H04R3/00 , H04R1/02 , B81B7/02 , H04R1/04 , H04R19/00 , H04R19/04 , B81B7/00 , B81C1/00 , G01L23/12 , G01L27/00
摘要： A microphone device comprises a microphone die including a first microphone motor and a second microphone motor, an acoustic integrated circuit structured to process signals produced by the first microphone motor and the second microphone motor, and a sensor die stacked on top of the acoustic integrated circuit, wherein the sensor die comprises a pressure sensor. Another microphone comprises a microphone die including a first microphone motor and a second microphone motor and an integrated circuit die. The integrated circuit die comprises an acoustic integrated circuit structured to process signals produced by the first microphone motor and the second microphone motor, a pressure sensor, and a pressure integrated circuit structured to press signals produced by the pressure sensor.
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公开(公告)号：US10887712B2
公开(公告)日：2021-01-05
申请号：US16626596
申请日：2018-06-26
发明人： Kim Spetzler Berthelsen , Michael Kuntzman , Claus Furst , Sung Bok Lee , Mohammad Shajaan , Venkataraman Chandrasekaran
摘要： A microphone assembly includes an acoustic transducer and an audio signal electrical circuit configured to receive an output signal from the acoustic transducer. The output signal includes an audio signal component and a tracking signal component. The audio signal component is representative of an acoustic signal detected by the acoustic transducer and the tracking signal component is based on an input tracking signal applied to the acoustic transducer. The audio signal electrical circuit includes an analog to digital converter configured to convert the output signal into a digital signal, an extraction circuit configured to separate the tracking signal component and the audio signal component from the digital signal, an envelope estimation circuit configured to estimate a tracking signal envelope from the tracking signal component, and a signal correction circuit configured to reduce distortion in the audio signal component using the tracking signal envelope.
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公开(公告)号：US20200245053A1
公开(公告)日：2020-07-30
申请号：US16844831
申请日：2020-04-09
摘要： A MEMS vibration sensor die can include a substrate having a top portion, a mounting surface, and an aperture extending at least partially through the substrate. The die can include a first electrode coupled to the top portion of the substrate and positioned over the aperture. The die can include a second electrode disposed between the substrate and the first electrode. The second electrode can be spaced apart from the first electrode. The die can include a proof mass that can have a first portion coupled to the first electrode or the second electrode. The proof mass can have a second end opposite the first portion. The second end can be recessed within the aperture relative to the mounting surface of the substrate. The proof mass can be suspended freely within the aperture. The proof mass can move the first electrode or the second electrode from which it is suspended in response to vibration.
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公开(公告)号：US20200329324A1
公开(公告)日：2020-10-15
申请号：US16913799
申请日：2020-06-26
发明人： Peter V. Loeppert , Venkataraman Chandrasekaran , Daryl Barry , Michael Pedersen , Dean Badillo
摘要： A micro-electromechanical system (MEMS) transducer assembly includes a transducer including a condenser microphone, an integrated circuit electrically connected to the transducer to receive an output voltage from the transducer, wherein the integrated circuit comprises a test signal generator configured to induce a test acoustic response in the transducer, and an evaluation circuit configured to compare the test acoustic response to a baseline acoustic response to identify a fault in the transducer.
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公开(公告)号：US20190104351A1
公开(公告)日：2019-04-04
申请号：US16206916
申请日：2018-11-30
IPC分类号： H04R1/02 , B81B7/02 , H04R1/04 , H04R19/00 , H04R19/04 , H04R3/00 , B81B7/00 , B81C1/00 , G01L27/00 , G01L23/12
CPC分类号： H04R1/028 , B81B7/0061 , B81B7/02 , B81B2201/012 , B81B2201/0257 , B81B2201/0264 , B81B2207/012 , B81C1/00238 , G01L23/125 , G01L27/005 , H01L2224/48091 , H01L2924/15151 , H01L2924/16152 , H04R1/04 , H04R3/005 , H04R19/005 , H04R19/04 , H04R2201/003 , H04R2430/21 , H01L2924/00014
摘要： A microphone device comprises a microphone die including a microphone motor, an acoustic integrated circuit structured to process signals produced by the microphone motor, and a sensor die stacked on top of the acoustic integrated circuit, wherein the sensor die comprises a pressure sensor. Another microphone comprises a microphone die including a microphone motor and an integrated circuit die. The integrated circuit die comprises an acoustic integrated circuit structured to process signals produced by the microphone motor, a pressure sensor, and a pressure integrated circuit structured to press signals produced by the pressure sensor.
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公开(公告)号：US11297406B2
公开(公告)日：2022-04-05
申请号：US17127794
申请日：2020-12-18
摘要： Acoustic transducers for generating electrical signals in response to acoustic signals are disclosed. In some embodiments, an acoustic transducer includes an at least partially evacuated hermetically sealed cavity defined in part by a first diaphragm. The acoustic transducer also includes a backplate disposed at least partially within the cavity. The cavity having a pressure lower than atmospheric pressure. The acoustic transducer further includes a pressure sensor coupled to the backplate and configured to sense the pressure in the cavity.
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公开(公告)号：US11142451B2
公开(公告)日：2021-10-12
申请号：US16466606
申请日：2017-11-30
摘要： A microelectromechanical system (MEMS) device includes at least one substrate, a lid, a MEMS component, a sensor, and a power supply. The lid is coupled to the substrate so that the substrate and the lid cooperatively define an interior cavity. The MEMS component is disposed within the interior cavity. The sensor is disposed within the interior cavity and is arranged to detect a parameter of the interior cavity. The power supply provides current to the sensor. The power supply is configured to control current during a ramp-up transition of the current and a ramp-down transition of the current such that the ramp-up transition and the ramp-down transition have attenuated high-frequency components.
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公开(公告)号：US20210204048A1
公开(公告)日：2021-07-01
申请号：US17127794
申请日：2020-12-18
摘要： Acoustic transducers for generating electrical signals in response to acoustic signals are disclosed. In some embodiments, an acoustic transducer includes an at least partially evacuated hermetically sealed cavity defined in part by a first diaphragm. The acoustic transducer also includes a backplate disposed at least partially within the cavity. The cavity having a pressure lower than atmospheric pressure. The acoustic transducer further includes a pressure sensor coupled to the backplate and configured to sense the pressure in the cavity.
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公开(公告)号：US10405078B2
公开(公告)日：2019-09-03
申请号：US16206916
申请日：2018-11-30
IPC分类号： H04R1/02 , B81B7/02 , H04R1/04 , H04R19/00 , H04R19/04 , H04R3/00 , B81B7/00 , B81C1/00 , G01L23/12 , G01L27/00
摘要： A microphone device comprises a microphone die including a microphone motor, an acoustic integrated circuit structured to process signals produced by the microphone motor, and a sensor die stacked on top of the acoustic integrated circuit, wherein the sensor die comprises a pressure sensor. Another microphone comprises a microphone die including a microphone motor and an integrated circuit die. The integrated circuit die comprises an acoustic integrated circuit structured to process signals produced by the microphone motor, a pressure sensor, and a pressure integrated circuit structured to press signals produced by the pressure sensor.
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