公开(公告)号：US11787688B2

公开(公告)日：2023-10-17

申请号：US17099442

申请日：2020-11-16

Applicant: KNOWLES ELECTRONICS, LLC

Inventor： Sung Bok Lee ,  Vahid Naderyan ,  Bing Yu ,  Michael Kuntzman ,  Yunfei Ma ,  Michael Pedersen

IPC: B81C1/00 ,  B81B3/00 ,  H04R31/00 ,  G01L9/00

CPC classification number: B81C1/00158 ,  B81B3/0021 ,  G01L9/0042 ,  H04R31/003 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C2201/0132 ,  B81C2201/0133

Abstract: A method of forming an acoustic transducer comprises providing a substrate and depositing a first structural layer on the substrate. The first structural layer is selectively etched to form at least one of an enclosed trench or an enclosed pillar thereon. A second structural layer is deposited on the first structural layer and includes a depression or a bump corresponding to the enclosed trench or pillar, respectively. At least the second structural layer is heated to a temperature above a glass transition temperature of the second structural layer causing the second structural layer to reflow. A diaphragm layer is deposited on the second structural layer such that the diaphragm layer includes at least one of a downward facing corrugation corresponding to the depression or an upward facing corrugation corresponding to the bump. The diaphragm layer is released, thereby forming a diaphragm suspended over the substrate.

公开(公告)号：US20230288281A1

公开(公告)日：2023-09-14

申请号：US18184466

申请日：2023-03-15

Applicant: Knowles Electronics, LLC

Inventor： Andy Unruh ,  Sung Bok Lee ,  Pete Loeppert ,  Wade Conklin ,  Michael Kuntzman ,  Vahid Naderyan

IPC: G01L19/00 ,  G01L9/00 ,  H04R19/00 ,  H04R19/04

CPC classification number: G01L19/0092 ,  G01L9/0016 ,  G01L9/0047 ,  H04R19/005 ,  H04R19/04 ,  H04R2499/11 ,  H04R2499/15

Abstract: In accordance with one aspect, a device is provided having a transducer comprising a conductor, a diaphragm configured to move relative to the conductor, and a reference volume in communication with the external environment. The diaphragm separates the reference volume and the external environment. The device further includes a controller operably coupled to the transducer and configured to determine an air pressure of an external environment based at least in part on movement of the diaphragm.

公开(公告)号：US11671766B2

公开(公告)日：2023-06-06

申请号：US17531229

申请日：2021-11-19

Applicant: KNOWLES ELECTRONICS, LLC

Inventor： Sung Bok Lee ,  Vahid Naderyan ,  Bing Yu ,  Michael Kuntzman ,  Yunfei Ma ,  Wade Conklin ,  Peter Loeppert

IPC: H04R25/00 ,  H04R19/04 ,  H04R7/18 ,  H04R7/06 ,  B81B3/00 ,  B81B7/00 ,  H04R1/04 ,  H04R3/00 ,  H04R7/10

CPC classification number: H04R19/04 ,  B81B3/0072 ,  B81B7/0025 ,  H04R1/04 ,  H04R3/00 ,  H04R7/06 ,  H04R7/10 ,  H04R7/18 ,  B81B2201/0257 ,  B81B2203/019 ,  B81B2203/0127 ,  B81B2207/012 ,  H04R2201/003

Abstract: A microphone device includes a base and a microelectromechanical system (MEMS) transducer and an integrated circuit (IC) disposed on the base. The microphone device also includes a cover mounted on the base and covering the MEMS transducer and the IC. The MEMS transducer includes a diaphragm attached to a surface of the substrate and a back plate mounted on the substrate and in a spaced apart relationship with the diaphragm. The diaphragm is attached to the surface of the substrate along at least a portion of a periphery of the diaphragm. The diaphragm can include a silicon nitride insulating layer, and a conductive layer, that faces a conductive layer of the back plate. The MEMS transducer can include a peripheral support structure that is disposed between at least a portion of the diaphragm and the substrate. The diaphragm can include one or more pressure equalizing apertures.

公开(公告)号：US09743191B2

公开(公告)日：2017-08-22

申请号：US14873816

申请日：2015-10-02

Applicant: Knowles Electronics, LLC

Inventor： Sagnik Pal ,  Sung Bok Lee

IPC: H04R25/00 ,  H04R7/24 ,  H04R19/00 ,  H04R7/12 ,  H04R1/04

CPC classification number: H04R7/24 ,  H04R1/04 ,  H04R7/122 ,  H04R19/005

Abstract: An acoustic apparatus includes a back plate, a diaphragm, and at least one pillar. The diaphragm and the back plate are disposed in spaced relation to each other. At least one pillar is configured to at least temporarily connect the back plate and the diaphragm across the distance. The diaphragm stiffness is increased as compared to a diaphragm stiffness in absence of the pillar. The at least one pillar provides a clamped boundary condition when the diaphragm is electrically biased and the clamped boundary is provided at locations where the diaphragm is supported by the at least one pillar.

公开(公告)号：US20170230758A1

公开(公告)日：2017-08-10

申请号：US15424602

申请日：2017-02-03

Applicant: Knowles Electronics, LLC

Inventor： Michael Kuntzman ,  Wade Conklin ,  Sung Bok Lee

IPC: H04R19/04 ,  H04R1/28 ,  H04R29/00

CPC classification number: H04R19/04 ,  H04R1/2873 ,  H04R29/004 ,  H04R2201/003

Abstract: The present disclosure generally relates to acoustic assemblies. One acoustic assembly includes a base and a first die disposed on the base. The first die comprises a microelectromechanical system (MEMS) microphone that includes a first diaphragm and a first back plate. The MEMS microphone has a barometric release. The acoustic assembly also includes a second die disposed on the base. The second die comprises a pressure sensor. The acoustic assembly further includes a cover coupled to the base and enclosing the first dies and the second die. A back volume is formed between the base, the first die, the second die, and the cover. The pressure sensor is configured to sense a pressure of the back volume.

公开(公告)号：US20170026760A1

公开(公告)日：2017-01-26

申请号：US15216630

申请日：2016-07-21

Applicant: Knowles Electronics, LLC

Inventor： John J. Albers ,  Joshua Watson ,  Kurt B. Friel ,  Norman Dennis Talag ,  Sung Bok Lee

IPC: H04R23/00 ,  G01N27/22

CPC classification number: H04R23/00 ,  G01N27/121 ,  G01N27/223 ,  H04R19/005 ,  H04R2201/003

Abstract: Various embodiments relating to microphone with integrated sensor are disclosed herein. In one implementation, a sensor is disposed in, on, integrated with, and/or at the lid of a micro electro mechanical system (MEMS) microphone. In another implementation, a sensor is disposed at or integrated with an insert, over which a micro electro mechanical system (MEMS) device is disposed in a MEMS microphone. In disposing the sensor at the lid or insert, significant space savings are achieved. Consequently, a small-sized microphone is provided and achieved allowing the microphone deployed in applications where miniaturization is required or advantageous.

Abstract translation: 本文公开了与具有集成传感器的麦克风相关的各种实施例。 在一个实施方案中，将传感器设置在微机电系统（MEMS）麦克风的一个或多个盖上。 在另一个实施方案中，传感器设置在插入件上或与插入件集成在一起，微机电系统（MEMS）装置在该插入件上设置在MEMS麦克风中。 将传感器设置在盖子或插件上时，可以节省大量空间。 因此，提供并实现了小型麦克风，使麦克风部署在需要小型化或有利的应用中。

公开(公告)号：US20150304753A1

公开(公告)日：2015-10-22

申请号：US14755673

申请日：2015-06-30

Applicant: Knowles Electronics, LLC

Inventor： Peter V. Loeppert ,  Ryan M. McCall ,  Daniel Giesecke ,  Sandra F. Vos ,  John B. Szczech ,  Sung Bok Lee ,  Peter Van Kessel

IPC: H04R1/08

CPC classification number: H04R1/08 ,  H04R1/04 ,  H04R1/086 ,  H04R2201/003

Abstract: A micro-electro-mechanical system (MEMS) microphone includes a rectangular substrate with a rigid base layer, a first metal layer, a second metal layer, one or more electrical pathways, an acoustic port, and a patterned flexible printed circuit board material. The MEMS microphone also includes a MEMS microphone die and a solid single-piece rectangular cover.

Abstract translation: 微电子机械系统（MEMS）麦克风包括具有刚性基底层，第一金属层，第二金属层，一个或多个电路径，声学端口和图案化的柔性印刷电路板材料的矩形基板。 MEMS麦克风还包括一个MEMS麦克风模具和一个实心的单件矩形盖子。

公开(公告)号：US08969980B2

公开(公告)日：2015-03-03

申请号：US13623598

申请日：2012-09-20

Applicant: Knowles Electronics, LLC

Inventor： Sung Bok Lee

IPC: H01L29/84 ,  B81B7/00 ,  H04R19/00 ,  H04R19/04

CPC classification number: B81B7/0029 ,  B81B2201/0257 ,  B81B2203/0127 ,  H01L2224/48091 ,  H01L2924/15151 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H01L2924/00014

Abstract: A micro-electromechanical system (MEMS) device includes a housing and a base. The base includes a port opening extending therethrough and the port opening communicates with the external environment. The MEMS die is disposed on the base and over the opening. The MEMS die includes a diaphragm and a back plate and the MEMS die, the base, and the housing form a back volume. At least one vent extends through the MEMS die and not through the diaphragm. The at least one vent communicates with the back volume and the port opening and is configured to allow venting between the back volume and the external environment.

Abstract translation: 微机电系统（MEMS）装置包括壳体和基座。 基座包括延伸穿过其中的端口开口，并且端口开口与外部环境连通。 MEMS管芯设置在基座上并在开口上方。 MEMS管芯包括隔膜和背板，并且MEMS管芯，基座和壳体形成后部体积。 至少一个通气孔延伸穿过MEMS管芯而不通过隔膜。 所述至少一个通风口与所述后部体积和所述端口开口相通并且被构造成允许所述后部体积与所述外部环境之间的排气。

公开(公告)号：US20140133687A1

公开(公告)日：2014-05-15

申请号：US14075818

申请日：2013-11-08

Applicant: Knowles Electronics, LLC

Inventor： Sung Bok Lee

IPC: H04R1/04

CPC classification number: H04R1/083 ,  H04R2201/003

Abstract: An acoustic device includes a substrate, a microelectromechanical system (MEMS) apparatus, a cover, a port, and a valve. The MEMS apparatus includes a diaphragm and a back plate. The cover is coupled to the substrate and encloses the MEMS apparatus. The port is disposed through the substrate and the MEMS apparatus is disposed over the port. The valve is disposed over the port and opposite the MEMS apparatus. The valve is configured to assume a closed position during the occurrence of a high pressure event and prevent a pressure transient from damaging the MEMS apparatus. The valve is configured to assume an open position during the absence of a high pressure event.

Abstract translation: 声学装置包括基板，微机电系统（MEMS）装置，盖，端口和阀。 MEMS装置包括隔膜和背板。 盖子耦合到基板并且封装MEMS装置。 端口设置在基板上，MEMS装置设置在端口上。 阀设置在端口上并与MEMS装置相对。 阀被配置为在高压事件发生期间处于闭合位置，并且防止压力瞬变损坏MEMS装置。 阀被配置为在没有高压事件期间呈现打开位置。

公开(公告)号：US20210168515A1

公开(公告)日：2021-06-03

申请号：US16887822

申请日：2020-05-29

Applicant: Knowles Electronics, LLC

Inventor： Peter V. Loeppert ,  Sung Bok Lee

IPC: H04R11/04

Abstract: An acoustic transducer comprises a transducer substrate defining an aperture therein. A diaphragm is disposed on the transducer substrate. The diaphragm comprises a diaphragm inner portion disposed over the aperture such that an outer edge of the diaphragm inner portion is located radially inwards of a rim of the aperture, the diaphragm inner portion having a first stress. A diaphragm outer portion extends radially from the outer edge of the diaphragm inner portion to at least the rim of the aperture, the diaphragm outer portion having a second stress different from the first stress.