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公开(公告)号：US20250136433A1
公开(公告)日：2025-05-01
申请号：US19003909
申请日：2024-12-27
Applicant: Knowles Electronics, LLC
Inventor： Michael Pedersen
IPC: B81B3/00
Abstract: Various implementations of MEMS sensors include an IC die having a cavity that forms at least part of the back volume of the sensor. This arrangement helps to address the problems of lateral velocity gradients and viscosity-induced losses. In some of the embodiments, the cavity is specially configured (e.g., with pillars, channels, and/or rings) to reduce the lateral movement of air. Other solutions (used in conjunction with such cavities) include ways to make a diaphragm move more like a piston (e.g., by adding a protrusion that gives it more “up-down” motion and less lateral motion) or to use a piston (e.g., a rigid piece of silicon such as an integrated circuit die) in place of a diaphragm
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公开(公告)号：US12240748B2
公开(公告)日：2025-03-04
申请号：US17207722
申请日：2021-03-21
Applicant: Knowles Electronics, LLC
Inventor： Peter V. Loeppert , Michael Pedersen , Vahid Naderyan
IPC: B81B3/00
Abstract: A micro-electro-mechanical systems (MEMS) die includes a piston; an electrode facing the piston, wherein a capacitance between the piston and the electrode changes as the distance between the piston and the electrode changes; and a resilient structure (e.g., a gasket or a pleated wall) disposed between the piston and the electrode, wherein the resilient structure supports the piston and resists the movement of the piston with respect to the electrode. A back volume is bounded by the piston and the resilient structure and the resilient structure blocks air from leaving the back volume. The piston may be a rigid body made of a conductive material, such as metal or a doped semiconductor. The MEMS die may also include a second resilient structure, which provides further support to the piston and is disposed within the back volume.
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公开(公告)号：US20240208802A1
公开(公告)日：2024-06-27
申请号：US18600185
申请日：2024-03-08
Applicant: Knowles Electronics, LLC
Inventor： Peter V. Loeppert , Michael Pedersen , Vahid Naderyan
IPC: B81B3/00
CPC classification number: B81B3/0021 , B81B3/0054 , B81B2201/0257 , B81B2203/0127 , B81B2203/04
Abstract: A micro-electro-mechanical systems (MEMS) die includes a piston; an electrode facing the piston, wherein a capacitance between the piston and the electrode changes as the distance between the piston and the electrode changes; and a resilient structure (e.g., a gasket or a pleated wall) disposed between the piston and the electrode, wherein the resilient structure supports the piston and resists the movement of the piston with respect to the electrode. A back volume is bounded by the piston and the resilient structure and the resilient structure blocks air from leaving the back volume. The piston may be a rigid body made of a conductive material, such as metal or a doped semiconductor. The MEMS die may also include a second resilient structure, which provides further support to the piston and is disposed within the back volume.
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公开(公告)号：US11827511B2
公开(公告)日：2023-11-28
申请号：US17286231
申请日：2019-11-18
Applicant: Knowles Electronics, LLC
Inventor： Peter V. Loeppert , Michael Pedersen
CPC classification number: B81B3/0059 , H04R1/32 , B81B2201/0257 , B81B2201/0264
Abstract: A MEMS transducer for a microphone includes a closed chamber, an array of conductive pins, a dielectric grid, and a diaphragm. The closed chamber is at a pressure lower than atmospheric pressure. The array of conductive pins is in a fixed position in the closed chamber, distributed in two dimensions, and have gaps formed therebetween. The dielectric grid is positioned within the closed chamber, includes a grid of dielectric material positioned between the gaps of the array of conductive pins, and is configured to move parallel to the conductive pins. The diaphragm is configured to form a portion of the closed chamber and deflect in response to changes in a differential pressure between the pressure within the closed chamber and a pressure outside the transducer. The diaphragm is configured to move the dielectric grid relative to the array of conductive pins in response to a change in the differential pressure.
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公开(公告)号：US11787688B2
公开(公告)日：2023-10-17
申请号：US17099442
申请日：2020-11-16
Applicant: KNOWLES ELECTRONICS, LLC
Inventor： Sung Bok Lee , Vahid Naderyan , Bing Yu , Michael Kuntzman , Yunfei Ma , Michael Pedersen
CPC classification number: B81C1/00158 , B81B3/0021 , G01L9/0042 , H04R31/003 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81C2201/0132 , B81C2201/0133
Abstract: A method of forming an acoustic transducer comprises providing a substrate and depositing a first structural layer on the substrate. The first structural layer is selectively etched to form at least one of an enclosed trench or an enclosed pillar thereon. A second structural layer is deposited on the first structural layer and includes a depression or a bump corresponding to the enclosed trench or pillar, respectively. At least the second structural layer is heated to a temperature above a glass transition temperature of the second structural layer causing the second structural layer to reflow. A diaphragm layer is deposited on the second structural layer such that the diaphragm layer includes at least one of a downward facing corrugation corresponding to the depression or an upward facing corrugation corresponding to the bump. The diaphragm layer is released, thereby forming a diaphragm suspended over the substrate.
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Patent Agency Ranking
公开(公告)号：US20230192475A1
公开(公告)日：2023-06-22
申请号：US17869870
申请日：2022-07-21
Applicant: Knowles Electronics, LLC
Inventor： Ken Deng , Michael Pedersen , Richard Li-Chen Chen , Shubham Shubham , Faisal Zaman
IPC: B81B3/00 , G01C19/5755 , G01H11/06
CPC classification number: B81B3/0051 , G01C19/5755 , G01H11/06 , B81B2201/0235 , B81B2201/0285 , B81B2203/0163 , B81B2203/0307 , B81B2203/04 , B81B2203/055
Abstract: A vibration sensor/accelerometer includes, in various implementations, a MEMS die that includes a plate having an aperture, an anchor disposed within the aperture, a plurality of arms (e.g., rigid arms) extending from the anchor, and a plurality of resilient members (e.g., looped or folded springs with a carefully designed spring stiffness), each resilient member connecting the plate to an arm of the plurality of arms. The plate may be made from a solid layer in which the resilient members are etched from the same layer. The MEMS die may also include top and bottom wafers, and travel stoppers extending from the top and bottom wafers as well as through the plate.
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公开(公告)号：US11554953B2
公开(公告)日：2023-01-17
申请号：US17111465
申请日：2020-12-03
Applicant: Knowles Electronics, LLC
Inventor： Peter V. Loeppert , Michael Pedersen
Abstract: A first electrode of a MEMS device can be oriented lengthwise along and parallel to an axis, and can have a first end and a second end. A second electrode can be oriented lengthwise along and parallel to the axis and can have a first end and a second end. A third electrode can be oriented lengthwise along and parallel to the axis and can have a first end and a second end. The first, second, and third electrodes can each be located at least partially within an aperture of a plurality of apertures of a solid dielectric that can surround the second electrode second end and the third electrode first end. The second electrode first end and the third electrode second end can be located outside of the solid dielectric.
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公开(公告)号：US11516597B2
公开(公告)日：2022-11-29
申请号：US17117073
申请日：2020-12-09
Applicant: Knowles Electronics, LLC
Inventor： Mohsin Nawaz , Stephen C. Thompson , Michael Pedersen , Peter V. Loeppert , Zouhair Sbiaa
Abstract: A force feedback actuator includes a pair of electrodes and a dielectric member. The pair of electrodes are spaced apart from one another to form a gap. The dielectric member is disposed at least partially within the gap. The dielectric member includes a first portion having a first permittivity and a second portion having a second permittivity that is different from the first permittivity. The dielectric member and the pair of electrodes are configured for movement relative to each other.
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公开(公告)号：US20210204071A1
公开(公告)日：2021-07-01
申请号：US17131497
申请日：2020-12-22
Applicant: Knowles Electronics, LLC
Inventor： Michael Pedersen , Joshua Watson , John Szczech
Abstract: A microelectromechanical system (MEMS) transducer for integration in a microphone assembly is designed to produce heat-generated acoustic signals. The MEMS transducer generally comprises a substrate having an aperture, a transduction element located at least partially over the aperture and coupled to the substrate, electrical contacts coupled to the transduction element, and a resistor integrated with the substrate or the transduction element. The resistor is coupled to electrical contacts that are electrically isolated from the contacts of the MEMS transducer or transduction element. The transduction element includes an insulating material coupled to the substrate. The transduction element comprises a fixed electrode and a movable electrode located at least partially over the aperture of the substrate. The fixed electrode or the moving electrode is formed on the insulating material. The resistor can be formed on the insulating material or suspended from the insulating material.
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公开(公告)号：US20210029470A1
公开(公告)日：2021-01-28
申请号：US16982497
申请日：2019-03-20
Applicant: Knowles Electronics, LLC
Inventor： Mohsin Nawaz , Shubham Shubham , David Schafer , Michael Pedersen , Claus Furst , Mohammad Shajaan , Jay Cech
Abstract: Microphones including a housing defining a cavity, a plurality of conductors positioned within the cavity, at least one dielectric bar positioned within the cavity, and a transducer diaphragm. The conductors are structured to move in response to pressure changes while the housing remains fixed. A first conductor generates first electrical signals responsive to the pressure changes resulting from changes in an atmospheric pressure. A second conductor generates second electrical signals responsive to the pressure changes resulting from acoustic activity. The dielectric bar is fixed with respect to the cavity and remains fixed under the pressure changes. The dielectric bar is adjacent to at least one of the conductors. In response to an applied pressure that is an atmospheric pressure and/or an acoustic pressure, the transducer diaphragm exerts a force on the housing and displaces at least a portion of conductors with respect to the dielectric bar.
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