公开(公告)号：US06344706B1

公开(公告)日：2002-02-05

申请号：US09412204

申请日：1999-10-05

申请人： Koji Morita ,  Masanobu Sugimori ,  Muneyuki Daidai

发明人： Koji Morita ,  Masanobu Sugimori ,  Muneyuki Daidai

IPC分类号： H01L4108

CPC分类号： H03H9/09 ,  H01L41/053 ,  H03H3/04 ,  Y10T29/42 ,  Y10T29/49146 ,  Y10T29/49171

摘要： A piezoelectric component includes a substantially rectangular shaped piezoelectric element, a first elastic material covering at least a pair of end portions of the piezoelectric element, the pair of end portions including edge parts of the piezoelectric element, a second elastic material covering the entire piezoelectric element and the first elastic material, and an outer-cladding resin covering the whole circumference of the piezoelectric element which is covered with the second elastic material.

摘要翻译： 压电元件包括​​大致矩形的压电元件，覆盖压电元件的至少一个端部的第一弹性材料，该一对端部包括压电元件的边缘部分，覆盖整个压电元件的第二弹性材料 第一弹性材料和覆盖有被第二弹性材料覆盖的压电元件的整个周边的外包层树脂。

公开(公告)号：US06957475B2

公开(公告)日：2005-10-25

申请号：US10036599

申请日：2001-11-09

申请人： Koji Morita ,  Masanobu Sugimori ,  Muneyuki Daidai

发明人： Koji Morita ,  Masanobu Sugimori ,  Muneyuki Daidai

IPC分类号： H03H9/17 ,  H01L41/053 ,  H03H3/02 ,  H03H3/04 ,  H03H9/02 ,  H03H9/09 ,  H04R17/10 ,  H05K3/28

CPC分类号： H03H9/09 ,  H01L41/053 ,  H03H3/04 ,  Y10T29/42 ,  Y10T29/49146 ,  Y10T29/49171

摘要： A method of manufacturing a piezoelectric component includes forming an unhardened first elastic material partially on at least a pair of end portions of a piezoelectric element, the pair of end portions including an edge portion of the piezoelectric element, hardening the first elastic material, forming an unhardened second elastic material on the entire circumference of the piezoelectric element and the first elastic material, hardening the second elastic material, forming an unhardened outer-cladding resin on the entire circumference of the second elastic material covering the piezoelectric element and the first elastic material, and hardening the outer-cladding resin.

摘要翻译： 制造压电元件的方法包括部分地在压电元件的至少一对端部上形成未硬化的第一弹性材料，该一对端部包括压电元件的边缘部分，硬化第一弹性材料，形成 在压电元件和第一弹性材料的整个圆周上的未硬化的第二弹性材料，使第二弹性材料硬化，在覆盖压电元件和第一弹性材料的第二弹性材料的整个圆周上形成未硬化的外包层树脂， 并使外包层树脂硬化。

公开(公告)号：US6093996A

公开(公告)日：2000-07-25

申请号：US236242

申请日：1999-01-25

申请人： Muneyuki Daidai ,  Toshiaki Sugimura

发明人： Muneyuki Daidai ,  Toshiaki Sugimura

IPC分类号： H03H9/02 ,  H01L41/053 ,  H03H3/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/17 ,  H03H9/54

CPC分类号： H03H3/02 ,  H03H9/0547 ,  H03H9/1014

摘要： A surface mounting type piezoelectric component includes an insulating substrate, an external electrode disposed on the insulating substrate, and a piezoelectric element including an electrode. The piezoelectric element is fixed to the insulating substrate and the electrode of the piezoelectric element is connected to the external electrode. A metal cap is fixed to the insulating substrate via an adhesive agent and covers the piezoelectric element. A glass transition temperature of the adhesive agent in a cured state is about 120 degrees centigrade or more. A difference between absolute values of a thermal-expansion-coefficient of the metal cap and of the insulating substrate is about 8 ppm/degrees centigrade or less.

摘要翻译： 表面安装型压电元件包括​​绝缘基板，设置在绝缘基板上的外部电极和包括电极的压电元件。 压电元件固定在绝缘基板上，压电元件的电极与外部电极连接。 金属盖经由粘合剂固定在绝缘基板上并覆盖压电元件。 粘合剂在固化状态下的玻璃化转变温度为约120摄氏度或更高。 金属盖和绝缘基板的热膨胀系数的绝对值之差为大约8ppm /摄氏度以下。

公开(公告)号：US06621011B1

公开(公告)日：2003-09-16

申请号：US09483313

申请日：2000-01-14

申请人： Muneyuki Daidai ,  Akihiro Nomura

发明人： Muneyuki Daidai ,  Akihiro Nomura

IPC分类号： H05K100

CPC分类号： H01G4/2325 ,  H01C1/034 ,  H01C1/148 ,  H01C17/281 ,  H01G4/005 ,  H01L23/145 ,  H01L23/49805 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/246 ,  H05K3/403 ,  H05K2201/0347 ,  H05K2201/09181 ,  Y10T29/49147 ,  H01L2924/00

摘要： An electronic chip component includes a package provided with external electrodes having excellent heat resistance and adhesion. In the electronic chip component, a package includes heat-resistant resin molding, and the external electrodes are provided on the surface of the package. The resin molding include a polymeric material having polar groups of at least one of an ether group, an ester group, a hydroxyl group, a carbonyl group, an amido group, and an imido group. The external electrodes have a multilayer structure having at least two layers including a lowermost layer containing a conductive film formed by baking conductive paste composed of a resin composition and metal particles at a low temperature, the resin composition including a compound having a trifunctional or higher functional group in one molecule. Each of the external electrodes includes an uppermost layer including a metal plate having good solderability.

摘要翻译： 电子芯片部件包括具有优异的耐热性和粘附性的外部电极的封装。 在电子芯片部件中，封装包括耐热树脂成型，外部电极设置在封装的表面上。 树脂模制品包括具有醚基，酯基，羟基，羰基，酰胺基和亚氨基中的至少一个的极性基团的聚合物材料。 所述外部电极具有至少两层的多层结构，所述多层结构包括含有通过在低温下烘烤由树脂组合物和金属颗粒组成的导电糊而形成的导电膜的最下层，所述树脂组合物包含具有三官能或更高官能度的化合物 在一个分子中。 每个外部电极包括包括具有良好可焊性的金属板的最上层。

公开(公告)号：US06531806B1

公开(公告)日：2003-03-11

申请号：US09643143

申请日：2000-08-21

申请人： Muneyuki Daidai

发明人： Muneyuki Daidai

IPC分类号： H01L4108

CPC分类号： H03H9/1035

摘要： A chip-type piezoelectric component has greatly increased bond strength of external electrodes while allowing the external electrodes to be easily formed. The external electrodes including a conductive paste are continuously formed on the side surface of a laminated body in which a piezoelectric element is laminated with seal substrates in addition to embedding a part of the external electrodes in recesses in which terminal electrodes of the piezoelectric element have been exposed. A metal plating layer having good solder wettability is provided on the outermost layer of the external electrode. The bonding strength between the external electrode and the laminated body is greatly improved by the wedge effect of the conductive paste penetrated in the recess, thereby preventing the electrode from peeling. The electrical continuity between the terminal electrode and the external electrode of the piezoelectric element is greatly improved because a portion of the external electrode is embedded in the recess in which the terminal electrode of the piezoelectric element is exposed.

摘要翻译： 芯片型压电元件极大地增加外部电极的结合强度，同时允许外部电极容易地形成。 除了将一部分外部电极嵌入到压电元件的端子电极的凹部中之外，在压电元件与密封基板层叠的层叠体的侧面上连续形成包括导电性糊料的外部电极 裸露。 在外部电极的最外层设置有具有良好焊料润湿性的金属镀层。 外部电极和层叠体之间的接合强度通过渗透在凹部中的导电膏的楔形效应大大提高，从而防止电极剥离。 由于外部电极的一部分嵌入在压电元件的端子电极露出的凹部内，所以压电元件的端子电极与外部电极之间的电连续性大大提高。

公开(公告)号：US06445108B1

公开(公告)日：2002-09-03

申请号：US09501381

申请日：2000-02-09

申请人： Tetsuo Takeshima ,  Takeshi Kishimoto ,  Muneyuki Daidai ,  Akihiro Nomura ,  Masayuki Fujino

发明人： Tetsuo Takeshima ,  Takeshi Kishimoto ,  Muneyuki Daidai ,  Akihiro Nomura ,  Masayuki Fujino

IPC分类号： H04R1700

CPC分类号： H04R31/003 ,  B06B1/0603 ,  G10K9/121 ,  G10K9/122 ,  H04R1/06 ,  H04R17/00 ,  H04R2307/023

摘要： A piezoelectric acoustic component includes a diaphragm having a substantially rectangular piezoelectric plate including front and back surfaces, an electrode disposed on the front surface, a substantially rectangular metal plate bonded to the back surface of the substantially rectangular piezoelectric plate directly or via an electrode disposed on the back surface of the substantially rectangular piezoelectric plate, an insulating cap having an upper wall, four side walls extending from the upper, a pair of support members arranged to support the diaphragm at the inside of the two of four sides walls opposed to each other, and a plate shaped substrate having a first electrode section and a second electrode section. The diaphragm is disposed the insulating cap. Two of four side edges of the diaphragm are opposed to each other and fixed to the pair of support members. A gap is formed between the other two of four side edges of the diaphragm and the cap and is sealed by elastic sealing material. An acoustic space is provided between the diaphragm and the upper wall of the insulating cap. An opening edge of the four side walls of the insulating cap is bonded to the substrate. The metal plate is electrically connected to the first electrode section. The electrode disposed on the front surface of the substantially rectangular piezoelectric plate is electrically connected to the second electrode section.

摘要翻译： 压电声部件包括具有前表面和后表面的基本为矩形的压电板的隔膜，设置在前表面上的电极，大致矩形的金属板，直接或者经由设置在基本上矩形的压电板的背面上的电极 基本为矩形的压电板的背面，具有上壁的绝缘盖，从上部延伸的四个侧壁，一对支撑构件，其布置成将隔膜支撑在彼此相对的四个侧壁中的两个的两侧的内侧 以及具有第一电极部和第二电极部的板状基板。 隔膜设置绝缘帽。 隔膜的四个侧边缘中的两个彼此相对并固定到一对支撑构件。 在隔膜和盖的四个侧边缘中的另外两个之间形成间隙，并且通过弹性密封材料密封。 在隔膜和绝缘盖的上壁之间提供声学空间。 绝缘盖的四个侧壁的开口边缘与基板结合。 金属板电连接到第一电极部分。 设置在大致矩形的压电板的前表面上的电极与第二电极部电连接。

公开(公告)号：US5593721A

公开(公告)日：1997-01-14

申请号：US457141

申请日：1995-06-01

申请人： Muneyuki Daidai ,  Manabu Sumita

发明人： Muneyuki Daidai ,  Manabu Sumita

IPC分类号： H03H9/02 ,  H03H3/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/17 ,  B05D5/12 ,  H04R17/00

CPC分类号： H03H9/1042 ,  Y10T29/42

摘要： An organic silicon compound 10 is applied around vibrating electrodes 3a and 3b of a piezoelectric resonant element 1. A compound such as silane, chlorosilane, silazane, silthiane, siloxane, cyclosilane, cyclosilazane, cyclosilthiane, cyclosiloxane, silanol, or metallosilicone is used as the organic silicon compound 10. Around the piezoelectric resonant element 1 and the organic silicon compound 10, for example, an ultraviolet ray curing resin is applied, and the ultraviolet ray curing resin is cured, thereby a permeable film 11 is formed. A cavity 12 is formed around the vibrating electrodes 3a and 3b by dispersing the organic silicon compound 10 to the outside through the film 11. Around the film 11, for example, an outer coating resin is applied, and the outer coating resin is cured, thereby an outer coating material 13 is formed.

摘要翻译： 将有机硅化合物10施加在压电谐振元件1的振动电极3a和3b周围。使用硅烷，氯硅烷，硅氮烷，硅藻土，硅氧烷，环硅烷，环硅氮烷，环硅石，环硅氧烷，硅烷醇或金属硅氧烷等化合物作为 有机硅化合物10.在压电谐振元件1和有机硅化合物10的周围，例如，施加紫外线固化树脂，固化紫外线固化树脂，从而形成渗透膜11。 通过将有机硅化合物10通过膜11分散到外部，在振动电极3a和3b周围形成空腔12.围绕膜11，例如涂覆外涂层树脂，外涂层树脂固化， 从而形成外涂层13。