Methods for fabricating patterned features utilizing imprint lithography
    10.
    发明授权
    Methods for fabricating patterned features utilizing imprint lithography 有权
    使用压印光刻制造图案特征的方法

    公开(公告)号:US07122482B2

    公开(公告)日:2006-10-17

    申请号:US10694284

    申请日:2003-10-27

    IPC分类号: H01L21/302 H01L21/461

    摘要: One embodiment of the present invention is a method for generating patterned features on a substrate that includes: (a) forming a first layer on at least a portion of a surface of the substrate, the first layer comprising at least one layer of a first material, which one layer abuts the surface of the substrate; (b) forming a second layer of a second material on at least a portion of the first layer, which second layer is imprinted with the patterned features; (c) removing at least portions of the second layer to extend the patterned features to the first layer; and (d) removing at least portions of the first layer to extend the patterned features to the substrate; wherein the first layer and the second layer may be exposed to an etching process that undercuts the patterned features, and the first material may be lifted-off.

    摘要翻译: 本发明的一个实施例是一种用于在衬底上产生图案化特征的方法,其包括:(a)在衬底的表面的至少一部分上形成第一层,第一层包括至少一层第一材料 其中一层邻接衬底的表面; (b)在所述第一层的至少一部分上形成第二材料的第二层,所述第二层被印刷所述图案化特征; (c)去除所述第二层的至少一部分以将所述图案化特征延伸到所述第一层; 和(d)去除所述第一层的至少一部分以将所述图案化特征延伸到所述基底; 其中第一层和第二层可以暴露于蚀刻过程,其蚀刻图案化的特征,并且第一材料可以被剥离。