Method for producing low defect density strained -Si channel MOSFETS
    1.
    发明授权
    Method for producing low defect density strained -Si channel MOSFETS 有权
    低缺陷密度应变-Si沟道MOSFET的制造方法

    公开(公告)号:US07202142B2

    公开(公告)日:2007-04-10

    申请号:US10838721

    申请日:2004-05-03

    IPC分类号: H01L21/20

    摘要: A silicon strained channel MOSFET device and method for forming the same the method providing improved wafer throughput and low defect density including the steps of providing a silicon substrate; epitaxially growing a first silicon layer using at least one deposition precursor selected from the group consisting of disilane, trisilane, dichlorosilane, and silane; epitaxially growing a step-grade SiGe buffer layer over and contacting the first silicon layer using at least one deposition precursor selected from the group consisting of disilane and trisilane; epitaxially growing a SiGe capping layer over and contacting the step-grade SiGe buffer layer using at least one deposition precursor selected from the group consisting of disilane and trisilane; and, epitaxially growing a second silicon layer using at least one deposition precursor selected from the group consisting of disilane, trisilane, dichlorosilane, and silane.

    摘要翻译: 一种硅应变通道MOSFET器件及其形成方法,该方法提供提供晶片生产能力和低缺陷密度的方法,包括提供硅衬底的步骤; 使用选自乙硅烷,丙硅烷,二氯硅烷和硅烷的至少一种沉积前体外延生长第一硅层; 使用选自乙硅烷和丙硅烷的至少一种沉积前体外延生长阶梯级SiGe缓冲层并使第一硅层接触; 使用至少一种选自乙硅烷和丙硅烷的沉积前体外延生长SiGe覆盖层并使其与阶级SiGe缓冲层接触; 并且使用至少一种选自乙硅烷,丙硅烷,二氯硅烷和硅烷的沉积前体外延生长第二硅层。

    Method for producing high throughput strained-Si channel MOSFETS
    2.
    发明授权
    Method for producing high throughput strained-Si channel MOSFETS 失效
    生产高通量应变Si沟道MOSFET的方法

    公开(公告)号:US06982208B2

    公开(公告)日:2006-01-03

    申请号:US10838625

    申请日:2004-05-03

    IPC分类号: H01L21/30

    摘要: A method for forming a strained silicon layer device with improved wafer throughput and low defect density including providing a silicon substrate; epitaxially growing a first silicon layer using at least one deposition precursor selected from the group consisting of disilane and trisilane; epitaxially growing a step-grade SiGe buffer layer over and contacting the first silicon layer using at least one deposition precursor selected from the group consisting of disilane and trisilane; epitaxially growing a SiGe capping layer over and contacting the step-grade SiGe buffer layer using at least one deposition precursor selected from the group consisting of disilane and trisilane; and, epitaxially growing a second silicon layer using at least one deposition precursor selected from the group consisting of disilane and silane.

    摘要翻译: 一种用于形成具有改善的晶片生产量和低缺陷密度的应变硅层器件的方法,包括提供硅衬底; 使用选自乙硅烷和丙硅烷的至少一种沉积前体外延生长第一硅层; 使用选自乙硅烷和丙硅烷的至少一种沉积前体外延生长阶梯级SiGe缓冲层并使第一硅层接触; 使用至少一种选自乙硅烷和丙硅烷的沉积前体外延生长SiGe覆盖层并使其与阶级SiGe缓冲层接触; 以及使用至少一种选自乙硅烷和硅烷的沉积前体外延生长第二硅层。

    Discontinuity prevention for SiGe deposition
    4.
    发明授权
    Discontinuity prevention for SiGe deposition 有权
    SiGe沉积的不连续性预防

    公开(公告)号:US06911369B2

    公开(公告)日:2005-06-28

    申请号:US10365257

    申请日:2003-02-12

    摘要: The present disclosure provides a process for producing a SiGe layer in a bipolar device having a reduced amount of gaps or discontinuities on a shallow trench isolation (STI) region use for a base electrode connection. The process is used for forming an SiGe layer for use in a semiconductor device. The process includes doping a single crystal substrate with a first dopant type, baking the doped single crystal substrate at a temperature less than 900° C., and at a pressure less than 100 torr; and depositing the SiGe layer on the baked single crystal substrate (epi SiGe) to serve as the base electrode and on the STI region (poly SiGe) to serve as a connection for the base electrode. The semiconductor device is thereby created from the combination of the doped single crystal substrate and the deposited SiGe layer.

    摘要翻译: 本公开提供了一种用于在双极性器件中制造SiGe层的方法,该双极器件在用于基极连接的浅沟槽隔离(STI)区域上具有减少的间隙或不连续性。 该方法用于形成用于半导体器件的SiGe层。 该方法包括掺杂具有第一掺杂剂类型的单晶衬底,在小于900℃的温度和低于100托的压力下烘焙掺杂的单晶衬底; 以及将SiGe层沉积在焙烧的单晶衬底(epi SiGe)上以用作基极和在STI区(poly SiGe)上作为基极的连接。 由此,由掺杂的单晶衬底和沉积的SiGe层的组合形成半导体器件。

    METHOD FOR PRODUCING HIGH THROUGHPUT STRAINED-SI CHANNEL MOSFETS
    5.
    发明申请
    METHOD FOR PRODUCING HIGH THROUGHPUT STRAINED-SI CHANNEL MOSFETS 失效
    用于生产高通量应变SI沟道MOSFET的方法

    公开(公告)号:US20050245058A1

    公开(公告)日:2005-11-03

    申请号:US10838625

    申请日:2004-05-03

    摘要: A method for forming a strained silicon layer device with improved wafer throughput and low defect density including providing a silicon substrate; epitaxially growing a first silicon layer using at least one deposition precursor selected from the group consisting of disilane and trisilane; epitaxially growing a step-grade SiGe buffer layer over and contacting the first silicon layer using at least one deposition precursor selected from the group consisting of disilane and trisilane; epitaxially growing a SiGe capping layer over and contacting the step-grade SiGe buffer layer using at least one deposition precursor selected from the group consisting of disilane and trisilane; and, epitaxially growing a second silicon layer using at least one deposition precursor selected from the group consisting of disilane and silane.

    摘要翻译: 一种用于形成具有改善的晶片生产量和低缺陷密度的应变硅层器件的方法,包括提供硅衬底; 使用选自乙硅烷和丙硅烷的至少一种沉积前体外延生长第一硅层; 使用选自乙硅烷和丙硅烷的至少一种沉积前体外延生长阶梯级SiGe缓冲层并使第一硅层接触; 使用至少一种选自乙硅烷和丙硅烷的沉积前体外延生长SiGe覆盖层并使其与阶级SiGe缓冲层接触; 以及使用至少一种选自乙硅烷和硅烷的沉积前体外延生长第二硅层。

    Method for producing low defect density strained -Si channel MOSFETS
    8.
    发明申请
    Method for producing low defect density strained -Si channel MOSFETS 有权
    低缺陷密度应变-Si沟道MOSFET的制造方法

    公开(公告)号:US20050245035A1

    公开(公告)日:2005-11-03

    申请号:US10838721

    申请日:2004-05-03

    摘要: A silicon strained channel MOSFET device and method for forming the same the method providing improved wafer throughput and low defect density including the steps of providing a silicon substrate; epitaxially growing a first silicon layer using at least one deposition precursor selected from the group consisting of disilane, trisilane, dichlorosilane, and silane; epitaxially growing a step-grade SiGe buffer layer over and contacting the first silicon layer using at least one deposition precursor selected from the group consisting of disilane and trisilane; epitaxially growing a SiGe capping layer over and contacting the step-grade SiGe buffer layer using at least one deposition precursor selected from the group consisting of disilane and trisilane; and, epitaxially growing a second silicon layer using at least one deposition precursor selected from the group consisting of disilane, trisilane, dichlorosilane, and silane.

    摘要翻译: 一种硅应变通道MOSFET器件及其形成方法,该方法提供提供晶片生产能力和低缺陷密度的方法,包括提供硅衬底的步骤; 使用选自乙硅烷,丙硅烷,二氯硅烷和硅烷的至少一种沉积前体外延生长第一硅层; 使用选自乙硅烷和丙硅烷的至少一种沉积前体外延生长阶梯级SiGe缓冲层并使第一硅层接触; 使用至少一种选自乙硅烷和丙硅烷的沉积前体外延生长SiGe覆盖层并使其与阶级SiGe缓冲层接触; 并且使用至少一种选自乙硅烷,丙硅烷,二氯硅烷和硅烷的沉积前体外延生长第二硅层。