摘要:
A light-emitting device includes a light-emitting element and a light-guiding member for causing light from the light-emitting element entering into it through one surface thereof. The light-emitting element includes a lead member with a light-emitting element chip mounted thereon and a molded member to which the lead member is secured. The lead member has a metallic part extending from the molded member, and the metallic part is bent. The thus arranged light-emitting device has an excellent heat release capability. An image reading apparatus using the light-emitting device is also provided.
摘要:
A light-emitting device includes a light-emitting element and a light-guiding member for causing light from the light-emitting element entering into it through one surface thereof. The light-emitting element includes a lead member with a light-emitting element chip mounted thereon and a molded member to which the lead member is secured. The lead member has a metallic part extending from the molded member, and the metallic part is bent. The thus arranged light-emitting device has an excellent heat release capability. An image reading apparatus using the light-emitting device is also provided.
摘要:
There are provided a light emitting unit in which temperature increase due to heat generated in a light emitting element is suppressed to enhance light emission efficiency, a linear illumination device in which the light emitting unit is incorporated, and a contact-type image sensor and an image scanner in which the linear illumination device is incorporated. A lead frame 23 in the light emitting unit has an extension 29. The extension 29 is folded along a case 12, and a plate-shaped heat dissipater 30 is connected to the extension 29. The connection is carried out by forming holes 29a and 30a in the extension 29 and the heat dissipater 30, respectively, and engaging a protrusion 31 formed on the case 12 in the holes 29a and 30a. The extension 29 thus comes into tight contact with the heat dissipater 30 and is fixed thereto. The heat dissipater 30 is made of a good thermally conductive material, such as copper, and formed separately from the lead frame 23.
摘要:
An image sensor and a manufacturing method thereof are provided, so that the warp or the distortion is not caused even if there is the thermal expansion difference or the thermal contraction difference in the longitudinal direction between the linear illuminating device and the frame. The image sensor comprises a linear illuminating device for illuminating an original; a light-receiving element array for receiving reflected light from the original; a lens array for focusing the original on the light-receiving element array; a frame for containing the linear illuminating device, the lens array, and the light-receiving element array; and a resilient retaining portion for pressing the linear illuminating device, which is mounted in the frame, into the frame.
摘要:
An aligning tool having a plurality of grooves formed side by side is provided; gradient index rod lenses are placed in alignment within the grooves at an average spacing of 1 μm-5 μm; the gradient index rod lenses are fixed to form an integral unit as they maintain the aligned state; thereafter the end faces of each rod lens are polished.
摘要:
There is provided an image sensor in which an enlargement of a substrate width is not caused even in a case that a rod-shaped light source is provided on both sides of a resin lens plate, respectively, and in which a positional accuracy of component is superior. The image sensor comprises a rod-shaped light source for irradiating light to an original placed on an original glass plate, an imaging optics for focusing light reflected on the original, and a light-receiving element for receiving light passing through the imaging optics, the light-receiving element being positioned at a predetermined location on a substrate which is provided with through holes for terminals of lead frames of the rod-shaped light source. The terminals of lead frames of the rod-shaped light source are bent toward the center of the substrate to be connected with the through holes.
摘要:
A contact image sensor is provided including a housing, a slit plate a lens, one or two light sources and a light-receiving element array mounted on a light-receiving element array substrate. The housing contains the slit plate, the lens, the one or two light sources and the light-receiving element array substrate. The optical system of the contact image sensor is aligned and one or more depressions are formed on an end of the substrate for the alignment. Power to the one or two light sources is applied through one or more leads. Each of the one or more depressions is large enough so that each of the leads can be passed through the respective depressions.
摘要:
Cone-shaped projections are provided outside a lens forming area in the middle on one surface of a resin lens plate and depressions to be fitted to these projections are formed on the other surface. A resin lens array is formed by stacking the resin lens plates one over another through fitting these projections and depressions to each other. A fitting depression having a flat supporting seat face at a position on an optical path of light emitted by light-emitting elements of a light-emitting element array chip is formed in the lens holder, and the resin lens array is placed in the fitting depression. A transparent cover composed of a flat and smooth plate is arranged over the output surface of the resin lens array and a metal retainer is attached to the transparent cover so that a pressing pressure is always applied to the resin lens array.
摘要:
The present invention provides an object-sensing device capable of estimating the presence of an object attached on a sensing surface, the kind of the object and the state of the object. An image is formed by a lens with light via the sensing surface, and the light is received by a light-receiving element portion in which a plurality of micro-light-receiving elements are arranged. In the object detection mode, totally reflected light from the sensing surface is received by the light-receiving element portion. The components are arranged at an angle that allows total reflection when there is no object, and does not allow the total reflection condition to be satisfied when there is an object. In the light scattering object detection mode, scattered light from the sensing surface is received by the light-receiving element portion. A signal pattern is obtained by joining detection signal levels of the micro-light-receiving elements in accordance with the arrangement of the micro-light-receiving elements. An increase portion or a drop portion of the signal pattern that appears in accordance with the presence of the object or a difference in the state thereof is analyzed, so that the kind and the state of the object such as a rain drop, muddy water, fogging, ice or the like are estimated.
摘要:
There is provided an image sensor in which an enlargement of a substrate width is not caused even in a case that a rod-shaped light source is provided on both sides of a resin lens plate, respectively, and in which a positional accuracy of component is superior. The image sensor comprises a rod-shaped light source for irradiating light to an original placed on an original glass plate, an imaging optics for focusing light reflected on the original, and a light-receiving element for receiving light passing through the imaging optics, the light-receiving element being positioned at a predetermined location on a substrate which is provided with through holes for terminals of lead frames of the rod-shaped light source. The terminals of lead frames of the rod-shaped light source are bent toward the center of the substrate to be connected with the through holes.