公开(公告)号：US4360649A

公开(公告)日：1982-11-23

申请号：US254277

申请日：1981-04-15

申请人： Kunimasa Kamio ,  Koichi Okuno ,  Satoru Haraguchi ,  Hiroyuki Yamaguchi ,  Koichi Ohashi

发明人： Kunimasa Kamio ,  Koichi Okuno ,  Satoru Haraguchi ,  Hiroyuki Yamaguchi ,  Koichi Ohashi

IPC分类号： C08G59/14 ,  C08G59/18 ,  C08G59/40 ,  C08G59/64

CPC分类号： C08G59/184 ,  C08G59/1477 ,  C08G59/4021 ,  C08G59/4035

摘要： A curable resin composition comprising an epoxy resin, a hardener and an epoxy compound-dialkylamine adduct as a latent hardener. The composition is excellent in storage stability at ambient temperatures and rapidly curable under heating conditions, and is usable as adhesives, paints, molding materials, casting materials and so on.

摘要翻译： 一种包含环氧树脂，硬化剂和作为潜在硬化剂的环氧化合物 - 二烷基胺加合物的可固化树脂组合物。 该组合物在环境温度下的储存稳定性优异，并且在加热条件下快速固化，并且可用作粘合剂，油漆，模塑材料，浇铸材料等。

公开(公告)号：US4410457A

公开(公告)日：1983-10-18

申请号：US375096

申请日：1982-05-05

申请人： Kenji Fujimura ,  Shigeru Sekiya ,  Kunimasa Kamio ,  Koichi Okuno ,  Satoru Haraguchi ,  Koiti Ohasi ,  Hiroyuki Yamaguchi

发明人： Kenji Fujimura ,  Shigeru Sekiya ,  Kunimasa Kamio ,  Koichi Okuno ,  Satoru Haraguchi ,  Koiti Ohasi ,  Hiroyuki Yamaguchi

IPC分类号： C08G59/00 ,  C08L33/00 ,  C08L33/02 ,  C08L63/00 ,  C09J11/04 ,  C09J163/00 ,  H01B1/22 ,  H01B1/24 ,  H01L23/482 ,  H05K1/09 ,  H01B1/06

CPC分类号： H01B1/22 ,  H01B1/24 ,  H01L23/4828 ,  H05K1/095 ,  H01L2924/0002

摘要： An electroconductive paste comprising(a) an electroconductive filler,(b) a reactive solvent, and(c) a hardener comprising(c-1) an epoxy resin,(c-2) a latent hardener, and(c-3) an epoxy compound-dialkylamine adduct,the percent by weight of (a), (b) and (c) being 95 to 50, 1 to 20 and 4 to 30, respectively, and the weight ratio of (c-1):(c-2):(c-3) being 100:0 to 30:0.1 to 40. The paste is useful for bonding electronic elements to metal lead frames and/or substrates.

摘要翻译： 1.一种导电浆料，其包含（a）导电填料，（b）反应性溶剂和（c）包含（c-1）环氧树脂，（c-2）潜在硬化剂和（c-3） 环氧化合物 - 二烷基胺加成物，（a），（b）和（c）的重量百分比分别为95〜50,1〜20和4〜30，（c-1）：（c -2）：（c-3）为100:0至30:0.1至40。该糊剂可用于将电子元件接合到金属引线框架和/或基板。

公开(公告)号：US4908417A

公开(公告)日：1990-03-13

申请号：US347157

申请日：1989-05-02

申请人： Yutaka Shiomi ,  Kunimasa Kamio ,  Satoru Haraguchi ,  Shigeki Naitoh

发明人： Yutaka Shiomi ,  Kunimasa Kamio ,  Satoru Haraguchi ,  Shigeki Naitoh

IPC分类号： C08G77/455 ,  C08L61/14 ,  C08L79/08

CPC分类号： C08L79/085 ,  C08G77/455 ,  C08L61/14

摘要： A thermosetting resin composition is prepared by mixing(A) a phenol novolak resin having hydroxy groups and allyl-etherified hydroxy groups,(B) a polymaleimide compound having two or more maleimide groups in the molecule, and(C) at least one silicone resin having the following formula (I); ##STR1## wherein R.sub.1 and R.sub.2, which may be the same or different, are methyl or phenyl; R.sub.3 and R.sub.4, which may be the same or different, are methyl, phenyl, hydrogen or a group having an amino group or an epoxy group but at least one of R.sub.3 and R.sub.4 is hydrogen or a group having an amino group or an epoxy group; and l and m, which may be the same or different, are a number of 0-400. The thermosetting resin composition of the present invention can be suitably used for encapsulating electric devices, for example, and gives, by curing, a cured resin product of high quality.

公开(公告)号：US5399715A

公开(公告)日：1995-03-21

申请号：US066099

申请日：1993-06-02

申请人： Shigeki Naitoh ,  Yasuhiro Endo ,  Youichi Ueda ,  Kunimasa Kamio

发明人： Shigeki Naitoh ,  Yasuhiro Endo ,  Youichi Ueda ,  Kunimasa Kamio

IPC分类号： C07C209/60 ,  C07C211/50 ,  C07D207/44 ,  C07D207/452 ,  C08F8/30 ,  C08F8/48 ,  H05K1/03 ,  C07D207/24

CPC分类号： C07D207/452 ,  C07C209/60 ,  C07C211/50 ,  C08F8/30 ,  C08F8/48 ,  C07C2102/08 ,  H05K1/0346

摘要： The polyamino oligomers of this invention are obtained by reacting diisopropenylbenzenes or bis(.alpha.-hydroxyisopropyl)benzenes and anilines in the presence of an acid catalyst and characterized by the recurring unit having an indane skeleton. These polyamino oligomers can be used as curing agent for laminate resins. Also, they can be reacted with maleic anhydride to prepare polymaleimide compounds of this invention.The polymaleimide compounds of this invention are low in melting point (or softening point) and, in combination with a substance producing three-dimensional crosslinkage such as triallyl isocyanurate, aromatic diamine, etc., can provide thermosetting resin compositions suited for producing copper-clad laminates. The copper-clad laminates obtained from the thermosetting resin compositions of this invention are low in dielectric constant, heat-resistant and also low in water absorptivity, so that they are useful for multi-layer printed boards.

摘要翻译： PCT No.PCT / JP92 / 01030 Sec。 371日期：1993年6月2日 102（e）日期1993年6月2日PCT提交1992年8月12日PCT公布。 公开号WO93 / 12933 日本7月8日，1993年。本发明的聚氨基低聚物是通过在酸催化剂存在下使二异丙烯基苯或双（α-羟基异丙基）苯和苯胺反应获得的，其特征在于具有二氢茚骨架的重复单元。 这些聚氨基低聚物可以用作层压树脂的固化剂。 此外，它们可以与马来酸酐反应以制备本发明的聚马来酰亚胺化合物。 本发明的聚马来酰亚胺化合物的熔点（或软化点）低，并且与产生三维交联的物质如三烯丙基异氰脲酸酯，芳族二胺等组合可以提供适用于生产铜包覆的热固性树脂组合物 层压板。 由本发明的热固性树脂组合物获得的覆铜层压板的介电常数，耐热性和吸水性也低，因此它们可用于多层印刷板。

公开(公告)号：US4957995A

公开(公告)日：1990-09-18

申请号：US402663

申请日：1989-09-05

申请人： Yasuhisa Saito ,  Katsuya Watanabe ,  Kohichi Okuno ,  Kunimasa Kamio ,  Akira Morii

发明人： Yasuhisa Saito ,  Katsuya Watanabe ,  Kohichi Okuno ,  Kunimasa Kamio ,  Akira Morii

IPC分类号： C07D301/27 ,  C08G59/32 ,  C08G59/40 ,  C08J5/24 ,  C08L63/00

CPC分类号： C08J5/24 ,  C08G59/3227 ,  C08G59/40 ,  C08L63/00 ,  C08J2363/00 ,  Y10T428/31511

摘要： A low viscosity epoxy resin, i.e., a low viscosity polyglycidyl derivative, of an aminophenol having at least one alkyl group on its aromatic ring of which viscosity is 15 poises or below as measured at 25.degree. C., a resin composition containing said resin, and a fiberreinforced composite material containing as matrix a cured product of said epoxy resin composition and a fiber as reinforcing material.

公开(公告)号：US4621123A

公开(公告)日：1986-11-04

申请号：US809007

申请日：1985-12-16

申请人： Hisao Takagishi ,  Kazunori Kawakami ,  Kunimasa Kamio ,  Khoichi Okuno

发明人： Hisao Takagishi ,  Kazunori Kawakami ,  Kunimasa Kamio ,  Khoichi Okuno

IPC分类号： C07F9/655 ,  C08G8/04 ,  C08G8/28 ,  C08G59/06 ,  C08G59/30 ,  C08G59/32 ,  C07D407/14 ,  C07F9/53 ,  C08G61/02

CPC分类号： C08G59/063 ,  C07F9/65502 ,  C08G59/304 ,  C08G59/3218 ,  C08G59/3254 ,  C08G8/04 ,  C08G8/28

摘要： Novel phosphorus-containing polyglycidyl ethers capable of forming a cured epoxy resin having a high flame retardancy and excellent in heat resistance characteristics such as heat deterioration resistance, glass transition temperature, thermal deformation temperature and the like; a process for producing said phosphorus-containing polyglycidyl ethers; phosphorus-containing polyphenol compounds used in production of said phosphorus-containing polyglycidyl ethers; and a process for producing said phosphorus-containing polyphenol compounds.

摘要翻译： 能够形成阻燃性高，耐热劣化性，玻璃化转变温度，热变形温度等耐热特性优异的固化环氧树脂的新型含磷聚缩水甘油醚; 一种生产所述含磷聚缩水甘油醚的方法; 用于生产所述含磷聚缩水甘油醚的含磷多酚化合物; 以及生产所述含磷多酚化合物的方法。

公开(公告)号：US4108924A

公开(公告)日：1978-08-22

申请号：US661553

申请日：1976-02-25

申请人： Katsuo Akagane ,  Teruho Adachi ,  Kunimasa Kamio

发明人： Katsuo Akagane ,  Teruho Adachi ,  Kunimasa Kamio

IPC分类号： C08L27/00 ,  C08G59/00 ,  C08K5/1515 ,  C08L1/00 ,  C08L23/00 ,  C08L27/04 ,  C08L33/00 ,  C08L33/02 ,  C08L51/00 ,  C08L51/02 ,  C08L63/00 ,  C08L101/00 ,  C08L101/04 ,  C08K5/15

CPC分类号： C08L27/04 ,  C08L101/04

摘要： A chlorine-containing resin is prevented from degradation due to heat and light by addition of a novolac type epoxy compound of the formula, ##STR1## wherein R is hydrogen or C.sub.1 - C.sub.4 alkyl, and n is a number of 5 to 15.

摘要翻译： 通过加入下式的酚醛清漆型环氧化合物，其中R是氢或C 1 -C 4烷基，n是5至15的数，防止含氯树脂由于热和光而劣化。

公开(公告)号：US5478871A

公开(公告)日：1995-12-26

申请号：US287251

申请日：1994-08-08

申请人： Kazuo Takebe ,  Takashi Morimoto ,  Yutaka Shiomi ,  Yasuhide Sugiyama ,  Shigeki Naitoh ,  Noriaki Saito ,  Shuichi Kanagawa ,  Kunimasa Kamio

发明人： Kazuo Takebe ,  Takashi Morimoto ,  Yutaka Shiomi ,  Yasuhide Sugiyama ,  Shigeki Naitoh ,  Noriaki Saito ,  Shuichi Kanagawa ,  Kunimasa Kamio

IPC分类号： C07D303/24 ,  C08G8/04 ,  C08G59/08 ,  C08G59/32 ,  H01L23/29 ,  C08L63/00

CPC分类号： C08G59/08 ,  C07D303/24 ,  C08G59/3218 ,  C08G8/04 ,  H01L23/293 ,  H01L2924/0002

摘要： The present invention provides polyhydric phenols which are starting materials for glycidyl ether compounds which can provide cured products having low moisture absorption, high heat resistance and improved crack resistance and can be used for encapsulating semiconductor devices. The polyhydric phenols are represented by the following formula: ##STR1## wherein R.sup.1 independently represents a halogen atom, an alkyl or cycloalkyl group of 1-9 carbon atoms, an alkoxy group of 4 or less carbon atoms or an aryl group and R.sup.1 may be identical or different when l is 2 or more, R.sup.2 independently represents a halogen atom, an alkoxy group of 4 or less carbon atoms or an alkyl group of 6 or less carbon atoms and R.sup.2 may be identical or different when m is 2 or more, R.sup.3 independently represents a hydrogen atom or an alkyl group of 6 or less carbon atoms, the average recurring unit number n is 0-10, l is 0-4 and m is 0-7, and can be contained as a curing agent in an epoxy resin composition which is used not only for giving cured products but also for encapsulating semiconductor devices.

摘要翻译： 本发明提供作为缩水甘油醚化合物的原料的多元酚，其可以提供具有低吸湿性，高耐热性和改善的抗裂性的固化产物，并可用于封装半导体器件。 多元酚由下式表示：其中R1独立地表示卤素原子，1-9个碳原子的烷基或环烷基，4个或更少个碳原子的烷氧基或芳基，R1可以是 当l为2以上时，相同或不同，R2独立地表示卤素原子，碳原子数为4以下的烷氧基或碳原子数6以下的烷基，R2可以相同或不同，m为2以上时， R3独立地表示氢原子或碳原子数为6以下的烷基，平均重复单元数n为0〜10，l为0-4，m为0〜7，作为固化剂可以含有 环氧树脂组合物不仅用于提供固化产物，而且用于封装半导体器件。

公开(公告)号：US4913697A

公开(公告)日：1990-04-03

申请号：US281458

申请日：1988-12-08

申请人： Yasuhisa Saito ,  Kunimasa Kamio ,  Shuichi Kanagawa ,  Yutaka Shiomi

发明人： Yasuhisa Saito ,  Kunimasa Kamio ,  Shuichi Kanagawa ,  Yutaka Shiomi

IPC分类号： C07D251/34 ,  C08F222/40 ,  C08G73/06 ,  C08G73/12

CPC分类号： C08G73/0644 ,  C07D251/34 ,  C08F222/40 ,  C08G73/12

摘要： A thermosetting resin composition comprising (i) a polymaleimide compound having at least two maleimide groups in the molecule and (ii) an s-triazine compound having at least two alkenylaryloxy groups in the molecule; a resin-composition for encapsulant comprising said polymaleimide compound, said traizine compound, and an inorganic filler as essential components; and said s-triazine compound.

公开(公告)号：US4871832A

公开(公告)日：1989-10-03

申请号：US146684

申请日：1988-01-21

申请人： Yasuhisa Saito ,  Shuichi Kanagawa ,  Katsuya Watanabe ,  Kunimasa Kamio

发明人： Yasuhisa Saito ,  Shuichi Kanagawa ,  Katsuya Watanabe ,  Kunimasa Kamio

IPC分类号： C07D403/04 ,  C08G59/40 ,  C08G59/50 ,  C08G59/62 ,  C08G73/10

CPC分类号： C07D403/04 ,  C08G59/4042 ,  C08G59/5053 ,  C08G59/62 ,  C08G73/10 ,  C08G73/1067

摘要： The invention provides an imide compound represented by the general formula (I), ##STR1## wherein X represents a hydroxyl or amino group, Ar.sub.1 and Ar.sub.2 independently represent an aromatic residue, R.sub.1 represents a hydrogen atom or a C.sub.1 -C.sub.10 alkyl group, R.sub.2 represents a hydrogen atom, a C.sub.1 -C.sub.20 alkyl or alkoxy group or a hydroxyl group, and n represents a number of from 0 to 6, and also provides an epoxy resin composition containing the imide compound (B) and epoxy resins (A) as essential components.

摘要翻译： 本发明提供由通式（I）表示的酰亚胺化合物，其中X表示羟基或氨基，Ar 1和Ar 2独立地表示芳族残基，R 1表示氢原子或C 1 -C 10烷基，R 2表示氢原子，C 1〜C 20烷基或烷氧基或羟基，n表示0〜6的数，并且还提供含有酰亚胺化合物（B）和 环氧树脂（A）为必须成分。