Method and apparatus for drilling printed wiring boards
    1.
    发明授权
    Method and apparatus for drilling printed wiring boards 失效
    印刷线路板钻孔方法和装置

    公开(公告)号:US06531677B2

    公开(公告)日:2003-03-11

    申请号:US09970909

    申请日:2001-10-05

    IPC分类号: B23K2638

    摘要: An improved method and apparatus for drilling blind via holes to connect between upper conductive layers and lower conductive layers of printed wiring boards with laser lights. The resin layer contacting the targeted conductive layer is drilled to remain the residual layer with laser lights, and the residual layer is removed with a UV laser beam whose energy density is lower than the decomposition energy threshold of the conductive layer and higher than that of the resin layer. The apparatus for this drilling has at least two laser paths. The spatial energy distributions are made top-hat-shaped with beam homogenizer units in the paths, and the diameters and the energy densities are adjusted independently.

    摘要翻译: 一种用于钻孔盲孔的改进方法和装置,以连接具有激光的印刷线路板的上导电层和下导电层。 钻孔与目标导电层接触的树脂层用激光保持残留层,残余层用能量密度低于导电层分解能阈值的紫外激光束去除,高于 树脂层。 用于该钻孔的装置具有至少两个激光路径。 空间能量分布由路径中的光束均化器单元制成顶帽形,直径和能量密度独立调整。

    Laser Machining Method and Laser Machining Apparatus
    2.
    发明申请
    Laser Machining Method and Laser Machining Apparatus 有权
    激光加工方法和激光加工设备

    公开(公告)号:US20080053974A1

    公开(公告)日:2008-03-06

    申请号:US11843274

    申请日:2007-08-22

    IPC分类号: B23K26/06

    摘要: A laser machining method and a laser machining apparatus by which holes excelling in form accuracy can be machined efficiently are to be provided. A first cylindrical lens and/or a second cylindrical lens to correct any deformation of reflective face of a first mirror and/or a second mirror is arranged on an optical axis of a laser beam, and converging positions of the laser beam for an X-component and for a Y-component are coincident with a point on the optical axis.

    摘要翻译: 可以提供激光加工方法和激光加工装置,通过该激光加工方法可以有效地加工成形精度优异的孔。 用于校正第一反射镜和/或第二反射镜的反射面的任何变形的第一柱面透镜和/或第二柱面透镜布置在激光束的光轴上,并且用于X射线的激光束的会聚位置, 分量和Y分量与光轴上的点重合。

    Laser machining method and laser machining apparatus
    3.
    发明授权
    Laser machining method and laser machining apparatus 有权
    激光加工方法和激光加工设备

    公开(公告)号:US07923659B2

    公开(公告)日:2011-04-12

    申请号:US11843274

    申请日:2007-08-22

    IPC分类号: B23K26/06 B23K26/073

    摘要: A laser machining method and a laser machining apparatus by which holes excelling in form accuracy can be machined efficiently are to be provided. A first cylindrical lens and/or a second cylindrical lens to correct any deformation of reflective face of a first mirror and/or a second mirror is arranged on an optical axis of a laser beam, and converging positions of the laser beam for an X-component and for a Y-component are coincident with a point on the optical axis.

    摘要翻译: 可以提供激光加工方法和激光加工装置,通过该激光加工方法可以有效地加工成形精度优异的孔。 用于校正第一反射镜和/或第二反射镜的反射面的任何变形的第一柱面透镜和/或第二柱面透镜布置在激光束的光轴上,并且用于X射线的激光束的会聚位置, 分量和Y分量与光轴上的点重合。

    Laser machining method and laser machining apparatus
    4.
    发明授权
    Laser machining method and laser machining apparatus 有权
    激光加工方法和激光加工设备

    公开(公告)号:US07205501B2

    公开(公告)日:2007-04-17

    申请号:US10927185

    申请日:2004-08-27

    IPC分类号: B23K26/38

    摘要: A laser machining method and a laser machining apparatus superior in hole position accuracy and hole quality. An outgoing beam outputted as short pulses is shaped by a pulse shaping unit so as to form a #1 branch beam. The #1 branch beam is supplied to a portion to be machined, so as to machine the portion. In this case, the #1 branch beam may be controlled to synchronize with the outgoing beam. When a piece to be machined is made from a metal material and at least one of an organic material and an inorganic material, the metal material is machined with a laser beam shaped to have a pulse width not shorter than 100 ns, and at least one of the organic material and the inorganic material is machined with a laser beam shaped to have a pulse width shorter than 100 ns.

    摘要翻译: 激光加工方法和激光加工装置,其孔位精度和孔质量优异。 作为短脉冲输出的输出光束通过脉冲整形单元成形,从而形成#1分支光束。 将#1分支光束供给到要加工的部分,以便加工该部分。 在这种情况下,可以控制#1分支光束与输出光束同步。 当要被加工的零件由金属材料和有机材料和无机材料中的至少一种制成时,金属材料被加工成具有不小于100ns的脉冲宽度的激光束,并且至少一个 的有机材料和无机材料用激光束加工成具有短于100ns的脉冲宽度。

    Laser machining method and laser machining apparatus
    5.
    发明申请
    Laser machining method and laser machining apparatus 有权
    激光加工方法和激光加工设备

    公开(公告)号:US20050155958A1

    公开(公告)日:2005-07-21

    申请号:US10927185

    申请日:2004-08-27

    摘要: A laser machining method and a laser machining apparatus superior in hole position accuracy and hole quality. An outgoing beam outputted as short pulses is shaped by a pulse shaping unit so as to form a #1 branch beam. The #1 branch beam is supplied to a portion to be machined, so as to machine the portion. In this case, the #1 branch beam may be controlled to synchronize with the outgoing beam. When a piece to be machined is made from a metal material and at least one of an organic material and an inorganic material, the metal material is machined with a laser beam shaped to have a pulse width not shorter than 100 ns, and at least one of the organic material and the inorganic material is machined with a laser beam shaped to have a pulse width shorter than 100 ns.

    摘要翻译: 激光加工方法和激光加工装置,其孔位精度和孔质量优异。 作为短脉冲输出的输出光束通过脉冲整形单元成形,从而形成#1分支光束。 将#1分支光束供给到要加工的部分,以便加工该部分。 在这种情况下,可以控制#1分支光束与输出光束同步。 当要被加工的零件由金属材料和有机材料和无机材料中的至少一种制成时,金属材料被加工成具有不小于100ns的脉冲宽度的激光束,并且至少一个 的有机材料和无机材料用激光束加工成具有短于100ns的脉冲宽度。

    Method and Apparatus for Machining Thin-Film Layer of Workpiece
    6.
    发明申请
    Method and Apparatus for Machining Thin-Film Layer of Workpiece 审中-公开
    加工薄膜薄膜层的方法与装置

    公开(公告)号:US20120031147A1

    公开(公告)日:2012-02-09

    申请号:US13254155

    申请日:2010-02-24

    IPC分类号: C03B35/24 C03B23/02

    摘要: An apparatus for machining a thin-film layer of a workpiece, which is a transparent glass on which a thin-film layer is disposed on a top surface thereof, includes a workpiece-underside support mechanism for supporting the workpiece in a vertical direction by an air floatation mechanism and a suction mechanism, a clamp device for gripping the workpiece so as to follow the movement in the vertical direction of the workpiece, and a machining head for machining the thin-film layer with a laser beam. The machining head machines the thin-film layer on the top surface of the workpiece by irradiating the workpiece with a laser beam entering through the underside of the workpiece. Further including nozzles, the thin-film layer is machined while the cooling medium is delivered from the nozzles disposed by the thin-film layer side.

    摘要翻译: 作为在其上表面设置有薄膜层的透明玻璃的工件的薄膜层的加工装置包括:工件下侧支撑机构,用于将工件沿垂直方向支撑, 空气浮起机构和抽吸机构,用于夹持工件以沿着工件的垂直方向移动的夹紧装置,以及用激光束加工薄膜层的加工头。 加工头通过用通过工件下侧进入的激光束照射工件来在工件的顶表面上加工薄膜层。 进一步包括喷嘴,在从由薄膜层侧设置的喷嘴输送冷却介质的同时加工薄膜层。

    Method and apparatus for laser drilling
    7.
    发明申请
    Method and apparatus for laser drilling 审中-公开
    激光钻孔的方法和装置

    公开(公告)号:US20060076323A1

    公开(公告)日:2006-04-13

    申请号:US11243998

    申请日:2005-10-06

    IPC分类号: B23K26/38

    摘要: There is provided a laser drilling method that prevents hanging, expansion, or crinkles of copper foil caused when an ultraviolet laser beam that requires no surface roughening is used for a thin double-sided copper-clad film. The drilling method of the copper-clad film comprises the steps of: using an ultraviolet laser as a laser beam; drilling after bonding a resin film to the backside of the film which is the opposite side to the laser-beam-incidence; and delaminating the resin film on the backside after drilling. The resin film bonded to the backside prevents the copper foil from hanging, thus allowing the laser beam to be efficiently applied to the copper foil, and allowing the copper foil to be completely removed by ablation. In the case of a blind hole, the resin film bonded to the backside prevents expansion of the copper foil. Crinkles can be also prevented.

    摘要翻译: 提供了一种激光打孔方法,当不需要表面粗糙化的紫外线激光束用于薄的双面覆铜膜时,防止铜箔的悬挂,膨胀或皱缩。 铜包膜的钻孔方法包括以下步骤:使用紫外线激光器作为激光束; 在将树脂膜粘合到与激光束入射的相反侧的膜的背面之后进行钻孔; 并在钻孔后在背面剥离树脂膜。 结合到背面的树脂膜防止铜箔悬垂,从而允许激光束有效地施加到铜箔上,并且通过烧蚀使铜箔完全去除。 在盲孔的情况下,结合到背面的树脂膜防止铜箔膨胀。 也可以防止皱纹。

    Composite sheet, machining method for composite sheet and laser machining apparatus
    8.
    发明申请
    Composite sheet, machining method for composite sheet and laser machining apparatus 审中-公开
    复合片材,复合片材加工方法及激光加工设备

    公开(公告)号:US20080008854A1

    公开(公告)日:2008-01-10

    申请号:US11808248

    申请日:2007-06-07

    IPC分类号: B32B3/10 B23K26/00 B29C35/08

    摘要: A composite sheet whose product price can be reduced with a smaller number of manufacturing processes. A laser oscillator outputs a pulsed beam at a frequency f. A mask shapes the outer shape of the beam into a triangular, quadrangular or hexagonal shape. N pieces of time-sharing means time-share the beam to form N beams having a frequency f/N. N pairs of positioning means position the time-shared beams. A condensing lens condenses the beams. A rotating drum displaces a workpiece. A control means controls the time-sharing means, the N pairs of positioning means and a pedestal. The N pairs of positioning means are positioned to irradiate predetermined positions with the beams. The pedestal is moved. The time-sharing means are thereupon operated in predetermined order. The workpiece is machined to make holes whose outer shapes depend on the mask so that distances between sides of adjacent holes are equal to one another.

    摘要翻译: 一种复合片材,其制造价格可以减少,制造工艺数量较少。 激光振荡器以频率 f输出脉冲波束。 掩模将光束的外部形状形成为三角形,四边形或六边形形状。 N个分时装置意味着时间共享波束以形成具有频率f / N的N个波束。 N对定位装置定时共享光束。 聚光镜聚光。 旋转的滚筒移动工件。 控制装置控制分时装置,N对定位装置和基座。 N对定位装置定位成用梁照射预定位置。 基座移动。 分时装置随后以预定的顺序操作。 加工工件以形成其外形取决于掩模的孔,使得相邻孔的侧面之间的距离彼此相等。

    SURFACE TREATMENT METHOD FOR COPPER AND SURFACE TREATMENT METHOD FOR PRINTED WIRING BOARD
    10.
    发明申请
    SURFACE TREATMENT METHOD FOR COPPER AND SURFACE TREATMENT METHOD FOR PRINTED WIRING BOARD 审中-公开
    用于印刷线路板的铜和表面处理方法的表面处理方法

    公开(公告)号:US20110036493A1

    公开(公告)日:2011-02-17

    申请号:US12921656

    申请日:2009-02-25

    IPC分类号: B29C65/16 C25D11/34

    摘要: The present invention provides a surface treatment method for a printed wiring board to form cupric oxide on a surface of an outer layer of copper foil of a laminated board formed by laminating copper foils to base resin layers the cupric oxide being formed to have thickness 0.6 μm to 3.0 μm by performing electrolytic anodizing in an alkaline aqueous solution containing copper oxide ions at a concentration of more than 0.001 mol/l but not more than the saturation point, under the conditions that the electrolytic solution contains sodium hydroxide or potassium hydroxide of 2 mol/l to 6 mol/l and liquid temperature is 50° C. to 90° C.

    摘要翻译: 本发明提供一种印刷线路板的表面处理方法,该印刷线路板在层压板的铜箔的外层的表面上形成氧化铜,所述层压板通过将铜箔层叠到形成为厚度为0.6μm的氧化铜的基础树脂层而形成 通过在浓度大于0.001mol / l且不大于饱和点的含有氧化铜离子的碱性水溶液中,在电解液含有2mol的氢氧化钠或氢氧化钾的条件下进行电解阳极氧化至3.0μm / l至6mol / l,液体温度为50℃至90℃