Abstract:
A cooling apparatus for a light valve of the present invention includes a control box disposed on the back of the light valve to actuate the light valve, followed by a heat pipe and a heat-conducting component pasted upon the inner surface of the control box. The heat-conducting component is connected to a heat-collecting end of the heat pipe and one of its surface contacts with the light valve. The heat of the light valve is conducted to the second part of the control box through the heat-conducting component, and then the heat is conducted to the second part of the control box via the heat pipe pasted upon it. Thus, the heat of the light valve can be removed through the large area of the second part of control box, so as to increase the cooling efficiency and simplify the cooling apparatus.
Abstract:
A memory device having improved sensing speed and reliability and a method of forming the same are provided. The memory device includes a first dielectric layer having a low k value over a semiconductor substrate, a second dielectric layer having a second k value over the first dielectric layer, and a capacitor formed in the second dielectric layer wherein the capacitor comprises a cup region at least partially filled by the third dielectric layer. The memory device further includes a third dielectric layer over the second dielectric layer and a bitline over the third dielectric layer. The bitline is electrically coupled to the capacitor. A void having great dimensions is preferably formed in the cup region of the capacitor.
Abstract:
The invention provides a modularized rotatable signal control box which is assembled in a housing of an electronic appliance. The signal control box comprises a module base and a rotatable module. The module base is assembled in the housing of the electronic appliance. The rotatable module comprises a hidden panel and at least one rotating element. The hidden panel comprises at least one signal input/output connector, and the rotating element is used for rotatably connecting the rotatable module to the module base.
Abstract:
An adjusting apparatus for projection comprises a carrier having a central screw hole and three rounded indentations around central screw hole, an adjusting frame having a plane section and a base section, and a holder. The center of the plane section has a circular concave dug a hole with a smaller aperture. A ball bearing is accommodated in the circular concave. The plane section of the adjusting frame has three screw holes corresponding to the rounded indentations. Three angle-adjusting bolts respectively insert through the screw holes to abut against the rounded indentations. Rotating the angle-adjusting bolts relative to each other varies the length of the angle-adjusting bolts calculated from the plane section of the adjusting frame to the carrier. Thereby, an angle adjustment of a mirror is achieved.
Abstract:
A method for making capacitor-over-bit line (COB) DRAM using a self-aligned contact etching technology is achieved. After forming FET gate electrodes, sidewall spacers are formed from a first Si.sub.3 N.sub.4 etch-stop layer, while a portion of the Si.sub.3 N.sub.4 is retained as an etch-stop layer on the source/drain areas. Self-aligned contact openings are etched in a first oxide layer to the source/drain areas, and polysilicon landing plugs are formed in all the self-aligned openings. A second oxide layer is deposited and contact holes are etched to the landing plugs for bit lines. A polycide layer having a cap layer is deposited and patterned to form bit lines. A third Si.sub.3 N.sub.4 etch-stop layer is conformally deposited over the bit lines and patterned to form openings over the landing plugs for the capacitor node contacts while forming Si.sub.3 N.sub.4 sidewall spacers on the bit lines exposed in the openings. A third oxide layer is deposited, and openings having relaxed alignment tolerances, can be etched to the capacitor node contacts because the underlying third etch-stop layer prevents overetching. A conducting layer is deposited and etched back to form bottom electrodes in the openings, and the third oxide layer is removed, while the Si.sub.3 N.sub.4 etch-stop layers prevents over-etching. An interelectrode dielectric layer is deposited, and capacitor top electrodes are formed.
Abstract translation:实现了使用自对准接触蚀刻技术制造电容器对位线(COB)DRAM的方法。 在形成FET栅电极之后,侧壁间隔物由第一Si 3 N 4蚀刻停止层形成,而一部分Si 3 N 4作为蚀刻停止层保留在源/漏区上。 自对准的接触开口在第一氧化物层中蚀刻到源极/漏极区域,并且在所有自对准开口中形成多晶硅着色塞。 沉积第二氧化物层,并将接触孔蚀刻到位线的着陆塞。 沉积具有盖层的多晶硅化物层并构图以形成位线。 第三个Si 3 N 4蚀刻停止层被保形地沉积在位线上并被图案化以在用于电容器节点接触的着陆塞上形成开口,同时在开口中暴露的位线上形成Si 3 N 4侧壁间隔物。 沉积第三氧化物层,并且具有松弛的取向公差的开口可被蚀刻到电容器节点接点,因为下面的第三蚀刻停止层防止过蚀刻。 导电层被沉积并回蚀刻以在开口中形成底部电极,并且去除第三氧化物层,而Si 3 N 4蚀刻停止层防止过蚀刻。 沉积电极间电介质层,形成电容器顶部电极。
Abstract:
The present disclosure provides a semiconductor device that includes a semiconductor substrate, an isolation structure formed in the semiconductor substrate, a conductive layer formed over the isolation structure, and a metal-insulator-metal (MIM) capacitor formed over the isolation structure. The MIM capacitor has a crown shape that includes a top electrode, a first bottom electrode, and a dielectric disposed between the top electrode and the first bottom electrode, the first bottom electrode extending at least to a top surface of the conductive layer.
Abstract:
An input/output device used for connecting at least one external wire with a display apparatus, comprises a case, at least one I/O connector, a flip cover, and a lighting device. The case embedded in the case of the display apparatus has a wiring slot to provide the wire passing through the case. The I/O connectors embedded on the case are electrically connected to the display apparatus. The flip cover is pivoted on the case. The lighting device having a light source and a switch is associated with the flip cover to turn on or turn off the light source.
Abstract:
A memory device having improved sensing speed and reliability and a method of forming the same are provided. The memory device includes a first dielectric layer having a low k value over a semiconductor substrate, a second dielectric layer having a second k value over the first dielectric layer, and a capacitor formed in the second dielectric layer wherein the capacitor comprises a cup region at least partially filled by the third dielectric layer. The memory device further includes a third dielectric layer over the second dielectric layer and a bitline over the third dielectric layer. The bitline is electrically coupled to the capacitor. A void having great dimensions is preferably formed in the cup region of the capacitor.
Abstract:
A semiconductor device. The semiconductor device includes a substrate having an array region and a decoupling region, a first dielectric layer overlying the substrate, a second dielectric layer overlying the first dielectric layer, a plurality of active components formed in the first dielectric layer within the array region, a first capacitor formed in the second dielectric layer within the array region, a second capacitor formed in the second dielectric layer within the decoupling region, and a first plug formed in the first dielectric layer within the array region electrically connecting the active component and the first capacitor. The invention also provides a method of fabricating the semiconductor device.
Abstract:
An input/output device used for connecting at least one external wire with a display apparatus, comprises a case, at least one I/O connector, a flip cover, and a lighting device. The case embedded in the case of the display apparatus has a wiring slot to provide the wire passing through the case. The I/O connectors embedded on the case are electrically connected to the display apparatus. The flip cover is pivoted on the case. The lighting device having a light source and a switch is associated with the flip cover to turn on or turn off the light source.