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公开(公告)号：US06926070B2
公开(公告)日：2005-08-09
申请号：US10104526
申请日：2002-03-22
CPC分类号： H01L23/473 , F28D2021/0029 , F28F1/32 , F28F1/34 , F28F21/067 , H01L2924/0002 , Y10S165/905 , H01L2924/00
摘要： A cooling system is provided with a heat exchanger that has a thermally conductive tube over-molded with a plurality of thermally conductive fins. To form the heat exchanger, a thermally conductive tube is provided. Insert molding, over molding or injection molding is utilized to incorporate thermally conductive fins with the thermally conductive tubes. The molding process may also simultaneously create any required features, such as mounting features and fittings for tubing to be connected to the heat exchanger.
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公开(公告)号：US06983789B2
公开(公告)日：2006-01-10
申请号：US11112049
申请日：2005-04-22
申请人： Kurt A. Jenkins , John G. Olendorf , Peter Davison
发明人： Kurt A. Jenkins , John G. Olendorf , Peter Davison
IPC分类号： F28F7/00
CPC分类号： H01L23/473 , F28D2021/0029 , F28F1/32 , F28F1/34 , F28F21/067 , H01L2924/0002 , Y10S165/905 , H01L2924/00
摘要： A cooling system is provided with a heat exchanger that has a thermally conductive tube over-molded with a plurality of thermally conductive fins. To form the heat exchanger, a thermally conductive tube is provided. Insert molding, over molding or injection molding is utilized to incorporate thermally conductive fins with the thermally conductive tubes. The molding process may also simultaneously create any required features, such as mounting features and fittings for tubing to be connected to the heat exchanger.
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公开(公告)号：US06585534B2
公开(公告)日：2003-07-01
申请号：US09137520
申请日：1998-08-20
IPC分类号： H01R1362
CPC分类号： H05K7/1405 , H01L23/4093 , H01L2924/0002 , H01R12/7047 , H01L2924/00
摘要： A retention mechanism for an electronic assembly which has a substrate and a heat sink. The retention mechanism includes a substrate slot that receives the substrate and a heat sink slot that receives the heat sink. There may be two retention mechanisms that are attached to a printed circuit board adjacent to an electrical connector. There may be two heat sink slots symmetrically located about the substrate slot so that the mechanism can be mounted to a left side or a right side of the connector. The symmetric slots eliminate the need for a left side mechanism and a right side mechanism. The retainer mechanism may also have a nut retainer that captures a nut that is used to attach the mechanism to the printed circuit board. The nut retainer allows the nut to be transported with the retainer mechanism during an assembly process.
摘要翻译： 一种用于具有基板和散热器的电子组件的保持机构。 保持机构包括接收基板的基板槽和接收散热器的散热槽。 可能有两个固定机构连接到与电连接器相邻的印刷电路板。 可能有两个对准地位于基板槽周围的散热槽，使得该机构可以安装在连接器的左侧或右侧。 对称槽消除了对左侧机构和右侧机构的需要。 保持器机构还可以具有螺母保持器，其捕获用于将机构附接到印刷电路板的螺母。 螺母固定器允许螺母在组装过程中与保持器机构一起运输。
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公开(公告)号：US6101096A
公开(公告)日：2000-08-08
申请号：US330242
申请日：1999-06-10
申请人： Mike MacGregor , Michael T. Crocker , Thomas Wong , Peter Davison , Rolf A. Konstad , David A. Jones
发明人： Mike MacGregor , Michael T. Crocker , Thomas Wong , Peter Davison , Rolf A. Konstad , David A. Jones
CPC分类号： H05K7/142 , H05K7/1431 , Y10T24/42 , Y10T403/75
摘要： A fastener for an electronic assembly. The fastener may have a spring arm that extends from a stem. The fastener can attach a cover to a heat sink of an electronic assembly. The stem may be inserted into a boss of the cover. The spring arm may exert a force onto the heat sink to press the sink into an integrated circuit package of the assembly.
摘要翻译： 用于电子组件的紧固件。 紧固件可以具有从杆延伸的弹簧臂。 紧固件可以将盖子附接到电子组件的散热器。 杆可以插入盖的凸台中。 弹簧臂可以在散热器上施加一个力，以将水槽压入组件的集成电路封装中。
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公开(公告)号：US6028771A
公开(公告)日：2000-02-22
申请号：US189905
申请日：1998-11-11
申请人： Thomas Wong , Michael Crocker , Peter Davison , Mike MacGregor , Joe Benefield
发明人： Thomas Wong , Michael Crocker , Peter Davison , Mike MacGregor , Joe Benefield
CPC分类号： H05K5/0013 , H05K7/142 , H05K7/1431
摘要： A cover for a substrate of an electronic assembly. The cover may include a snap-in pin that can be inserted through an opening of the substrate. The cover may also have a barbed pin that exerts a force onto the substrate. The force secures the pin to the substrate. The snap-in pin and barbed pin may extend from a panel portion of the cover which covers one side of the substrate. The entire cover may be constructed as a relatively inexpensive plastic injection molded part.
摘要翻译： 一种用于电子组件的基板的盖。 盖可以包括可插入通过基板的开口的卡扣销。 盖子还可以具有向基板施加力的倒钩销。 力将销固定到基板上。 卡扣销和倒钩销可以从覆盖基板的一侧的盖的面板部分延伸。 整个盖可以被构造为相对便宜的塑料注塑部件。
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公开(公告)号：US20050226729A1
公开(公告)日：2005-10-13
申请号：US11100404
申请日：2005-04-07
申请人： Joana Negulescu , Peter Davison
发明人： Joana Negulescu , Peter Davison
CPC分类号： F01D5/326 , Y10T29/49321
摘要： A turbine blade locking device axially retains a turbine blade (1) inserted in an axial, profiled slot (10) of a turbine disk (6). The turbine disk (6) is provided with a locking groove (8) passing through the slot (10) and extending radially in the plane of the turbine disk (6). A locking pin (4) is inserted in the locking groove (8) and the blade root (3) is provided at its bottom side with a notch (9) aligning with the locking groove (8). A portion of an elastic element (5) is arranged radially below the locking pin (4) to pre-load the locking pin (4) in a radially outward direction and into the notch (9).
摘要翻译： 涡轮机叶片锁定装置轴向地保持插入在涡轮盘（6）的轴向型轮廓槽（10）中的涡轮叶片（1）。 涡轮盘（6）设置有穿过狭槽（10）并在涡轮盘（6）的平面内径向延伸的锁定槽（8）。 锁定销（4）插入到锁定槽（8）中，并且叶片根部（3）在其底侧设置有与锁定槽（8）对准的凹口（9）。 弹性元件（5）的一部分径向地设置在锁定销（4）的下方，以将锁定销（4）沿径向向外的方向预加载到凹口（9）中。
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公开(公告)号：US20050168939A1
公开(公告)日：2005-08-04
申请号：US11049353
申请日：2005-02-02
申请人： Masayuki Iijima , Tomoaki Ikeda , Masashi Miyazawa , Kouji Ueno , Paul Gwin , Brian Long , Peter Davison , Rolf Konstad
发明人： Masayuki Iijima , Tomoaki Ikeda , Masashi Miyazawa , Kouji Ueno , Paul Gwin , Brian Long , Peter Davison , Rolf Konstad
IPC分类号： F25D9/00 , F28D1/053 , H01L23/473 , H05K7/20 , F28D15/00
CPC分类号： F28D1/05375 , F28D2021/0031 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A small water-cooling type electronic component cooling apparatus is provided. The electronic component cooling apparatus comprises a so-called water-cooling heat sink 3, a radiator 7 cooled by an electric fan 5, first and second coolant paths 9, 11 for circulating a coolant between the heat sink 3 and the radiator 7, and an electric pump 13 to supply a moving energy to the coolant. The electric pump 13 is arranged at a position facing the heat-radiating portion of the radiator 7.
摘要翻译： 提供了一种小型水冷式电子部件冷却装置。 电子部件冷却装置包括所谓的水冷散热器3，由电风扇5冷却的散热器7，用于在散热器3和散热器7之间循环冷却剂的第一和第二冷却剂路径9,11，以及 电动泵13，其向冷却剂提供移动能量。 电动泵13配置在与散热器7的散热部相对的位置。
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公开(公告)号：US06722908B2
公开(公告)日：2004-04-20
申请号：US10335679
申请日：2003-01-02
IPC分类号： H01R1362
CPC分类号： H05K7/1405 , H01L23/4093 , H01L2924/0002 , H01R12/7047 , H01L2924/00
摘要： A retention mechanism for an electronic assembly which has a substrate and a heat sink. The retention mechanism includes a substrate slot that receives the substrate and a heat sink slot that receives the heat sink. There may be two retention mechanisms that are attached to a printed circuit board adjacent to an electrical connector. There may be two heat sink slots symmetrically located about the substrate slot so that the mechanism can be mounted to a left side or a right side of the connector. The symmetric slots eliminate the need for a left side mechanism and a right side mechanism. The retainer mechanism may also have a nut retainer that captures a nut that is used to attach the mechanism to the printed circuit board. The nut retainer allows the nut to be transported with the retainer mechanism during an assembly process.
摘要翻译： 一种用于具有基板和散热器的电子组件的保持机构。 保持机构包括接收基板的基板槽和接收散热器的散热槽。 可能有两个固定机构连接到与电连接器相邻的印刷电路板。 可能有两个对准地位于基板槽周围的散热槽，使得该机构可以安装在连接器的左侧或右侧。 对称槽消除了对左侧机构和右侧机构的需要。 保持器机构还可以具有螺母保持器，其捕获用于将机构附接到印刷电路板的螺母。 螺母固定器允许螺母在组装过程中与保持器机构一起运输。
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公开(公告)号：US6159031A
公开(公告)日：2000-12-12
申请号：US327212
申请日：1999-06-07
IPC分类号： H01R13/627 , H01R13/62
CPC分类号： H01R13/6275 , H01R12/716
摘要： A retention mechanism for securing an electronic subassembly. The retention mechanism may include a latch that extends from a wall. The latch may extend into either a cover opening of a SECC type subassembly or a heat sink notch of a SEPP type subassembly.
摘要翻译： 一种用于固定电子组件的保持机构。 保持机构可以包括从壁延伸的闩锁。 闩锁可以延伸到SEPP型子组件的SECC型子组件的盖开口或散热器槽口中。
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公开(公告)号：US20140022720A1
公开(公告)日：2014-01-23
申请号：US13997871
申请日：2012-05-17
申请人： Peter Davison , David Pidwerbecki
发明人： Peter Davison , David Pidwerbecki
CPC分类号： H05K7/02 , B29C39/10 , G06F1/1626 , G06F1/203 , G06F1/32
摘要： Systems and methods provide for a device including a film having a shape that defines an interior region. The device may also include one or more electronic components disposed within the interior region of the film, and a hardened thermo-set resin within the interior region, wherein the thermo-set resin encompasses the electronic components and substantially fills the interior region of the film. In one example, printed content is coupled to a surface of the film. In addition, the thermo-set resin may include an additive that is configured to absorb and distribute heat generated by the electronic components.
摘要翻译： 系统和方法提供了包括具有限定内部区域的形状的膜的装置。 该装置还可以包括设置在膜的内部区域内的一个或多个电子部件和内部区域内的硬化的热固树脂，其中热固性树脂包围电子部件并基本上填充膜的内部区域 。 在一个示例中，印刷内容耦合到胶片的表面。 此外，热固树脂可以包括被配置为吸收和分配由电子部件产生的热量的添加剂。
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