Method of fabricating light emitting diode
    2.
    发明授权
    Method of fabricating light emitting diode 有权
    制造发光二极管的方法

    公开(公告)号:US08470626B2

    公开(公告)日:2013-06-25

    申请号:US13150759

    申请日:2011-06-01

    IPC分类号: H01L21/00

    CPC分类号: H01L33/007

    摘要: Exemplary embodiments of the present invention relate to a method of fabricating a light emitting diode (LED). According to an exemplary embodiment of the present invention, the method includes growing a first GaN-based semiconductor layer on a substrate at a first temperature by supplying a chamber with a nitride source gas and a first metal source gas, stopping the supply of the first metal source gas and maintaining the first temperature for a first time period after stopping the supply of the first metal source gas, decreasing the temperature of the substrate to the a second temperature after the first time period elapses, growing an active layer of the first GaN-based semiconductor layer at the second temperature by supplying the chamber with a second metal source gas.

    摘要翻译: 本发明的示例性实施例涉及一种制造发光二极管(LED)的方法。 根据本发明的示例性实施例,该方法包括通过向室提供氮化物源气体和第一金属源气体,在第一温度下在衬底上生长第一GaN基半导体层,停止第一 金属源气体,并且在停止第一金属源气体的供给之后保持第一温度第一温度,在第一时间段之后将衬底的温度降低到第二温度,生长第一GaN的有源层 在第二温度下通过向腔室供应第二金属源气体。