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    ROLLING CONTACT SCREENING METHOD AND APPARATUS
    1.
    发明申请
    ROLLING CONTACT SCREENING METHOD AND APPARATUS 审中-公开
    滚动联系人筛选方法和装置

    公开(公告)号：US20050058771A1

    公开(公告)日：2005-03-17

    申请号：US10605219

    申请日：2003-09-16

    申请人： L. Herron ,  James Humenik ,  David Long ,  Jason Miller

    发明人： L. Herron ,  James Humenik ,  David Long ,  Jason Miller

    IPC分类号： B41F15/42 ,  H05K3/12 ,  H05K3/40 ,  B05D5/12

    CPC分类号： H05K3/1233 ,  B41F15/42 ,  H05K3/4053 ,  H05K2203/0143

    摘要： A method of applying paste to an electronic circuit board substrate containing via openings comprises providing over the substrate a mask having openings therein for lines and openings corresponding to the substrate via openings, and providing a roller having a surface adjacent the roller. Paste is then applied either to the mask or to a side of the surface facing the mask. The method then includes rolling the roller and the surface over the mask and flowing the paste into the openings in the mask without substantially sliding the roller and surface over the mask. In the preferred embodiment, paste is applied to a side of the surface facing the mask and the surface containing the paste is rolled over the mask. The surface may be attached to the roller. More preferably, the surface is on a film strip, separate from the roller, disposed between the roller and the substrate.

    摘要翻译： 将糊剂涂布到包含通孔的电子电路板基底上的方法包括在基底上设置一个掩模，该掩模在其上具有与基底通孔开口相对应的线和开口的开口，并提供一个具有与滚子相邻的表面的辊。 然后将糊剂施加到面罩或面向面罩的表面的一侧。 该方法然后包括将辊和表面滚动在掩模上并将糊剂流动到面罩中的开口中，而不使辊和表面基本上滑过掩模。 在优选实施例中，将糊剂施加到面向面罩的表面的一侧，并且将含有糊状物的表面卷在掩模上。 表面可以附接到辊子。 更优选地，表面位于设置在辊和基底之间的与辊分离的膜条上。

    FULLY AUTOMATED PASTE DISPENSE SYSTEM FOR DISPENSING SMALL DOTS AND LINES
    2.
    发明申请
    FULLY AUTOMATED PASTE DISPENSE SYSTEM FOR DISPENSING SMALL DOTS AND LINES 有权

    公开(公告)号：US20080057180A1

    公开(公告)日：2008-03-06

    申请号：US11931153

    申请日：2007-10-31

    申请人： Thomas Weiss ,  James Humenik ,  Mark LaPlante ,  David Long

    发明人： Thomas Weiss ,  James Humenik ,  Mark LaPlante ,  David Long

    IPC分类号： B05D5/12

    CPC分类号： B05C11/1034 ,  H05K1/092 ,  H05K3/1241 ,  H05K2203/0126

    摘要： A method of dispensing a flowable conductive paste onto a greensheet from a dispensing apparatus comprising an orifice member having first and second surfaces and a bore therethrough between the surfaces, a pressurized chamber adjacent the orifice member first surface containing the paste, and a punch having a face movable through the orifice member bore. The method comprises positioning the punch outside the orifice member bore such that the punch face is spaced from the orifice member first surface, flowing a desired amount of paste onto the punch face, moving the paste on the punch face through the orifice member bore until the punch face extends beyond the orifice member second surface, and contacting the workpiece with the paste while still on the punch face to deposit the paste on the greensheet. The method then provides for retracting the punch until the punch face is substantially coplanar with the orifice member second surface, and then cleaning the punch face and coplanar orifice member second surface to remove any residual paste thereon.

    FULLY AUTOMATED PASTE DISPENSE SYSTEM FOR DISPENSING SMALL DOTS AND LINES
    3.
    发明申请
    FULLY AUTOMATED PASTE DISPENSE SYSTEM FOR DISPENSING SMALL DOTS AND LINES 有权
    完全自动化的粉煤灰处理系统，用于分配小动物和线条

    公开(公告)号：US20080054023A1

    公开(公告)日：2008-03-06

    申请号：US11931096

    申请日：2007-10-31

    申请人： Thomas Weiss ,  James Humenik ,  Mark LaPlante ,  David Long

    发明人： Thomas Weiss ,  James Humenik ,  Mark LaPlante ,  David Long

    IPC分类号： B05C5/00 ,  G01F11/00 ,  B67D5/42 ,  B05C11/00

    CPC分类号： B05C11/1034 ,  H05K1/092 ,  H05K3/1241 ,  H05K2203/0126

    摘要： A method of dispensing a flowable conductive paste onto a greensheet from a dispensing apparatus comprising an orifice member having first and second surfaces and a bore therethrough between the surfaces, a pressurized chamber adjacent the orifice member first surface containing the paste, and a punch having a face movable through the orifice member bore. The method comprises positioning the punch outside the orifice member bore such that the punch face is spaced from the orifice member first surface, flowing a desired amount of paste onto the punch face, moving the paste on the punch face through the orifice member bore until the punch face extends beyond the orifice member second surface, and contacting the workpiece with the paste while still on the punch face to deposit the paste on the greensheet. The method then provides for retracting the punch until the punch face is substantially coplanar with the orifice member second surface, and then cleaning the punch face and coplanar orifice member second surface to remove any residual paste thereon.

    摘要翻译： 一种从分配装置将可流动的导电膏分配到毛坯上的方法，该分配装置包括具有第一表面和第二表面的孔口构件和在其之间的孔，在邻近孔口构件第一表面的加压室和含有该糊料的冲头， 面可通过孔口构件孔移动。 该方法包括将冲头定位在孔口构件孔的外部，使得冲头表面与孔构件第一表面间隔开，将期望量的浆料流动到冲头表面上，通过孔口构件孔移动冲压面上的浆料，直到 冲头面延伸超过孔口构件第二表面，并且在仍然在冲压面上的同时使工件与浆料接触以将浆料沉积在毛坯上。 该方法然后提供回缩冲头，直到冲头表面与孔口构件第二表面基本共面，然后清洁冲头面和共面孔构件第二表面以去除其上的残留糊料。

    FULLY AUTOMATED PASTE DISPENSE SYSTEM FOR DISPENSING SMALL DOTS AND LINES
    4.
    发明申请
    FULLY AUTOMATED PASTE DISPENSE SYSTEM FOR DISPENSING SMALL DOTS AND LINES 有权

    公开(公告)号：US20080058976A1

    公开(公告)日：2008-03-06

    申请号：US11931217

    申请日：2007-10-31

    申请人： Thomas Weiss ,  James Humenik ,  Mark LaPlante ,  David Long

    发明人： Thomas Weiss ,  James Humenik ,  Mark LaPlante ,  David Long

    IPC分类号： G06F19/00

    CPC分类号： B05C11/1034 ,  H05K1/092 ,  H05K3/1241 ,  H05K2203/0126

    摘要： A method of dispensing a flowable conductive paste onto a greensheet from a dispensing apparatus comprising an orifice member having first and second surfaces and a bore therethrough between the surfaces, a pressurized chamber adjacent the orifice member first surface containing the paste, and a punch having a face movable through the orifice member bore. The method comprises positioning the punch outside the orifice member bore such that the punch face is spaced from the orifice member first surface, flowing a desired amount of paste onto the punch face, moving the paste on the punch face through the orifice member bore until the punch face extends beyond the orifice member second surface, and contacting the workpiece with the paste while still on the punch face to deposit the paste on the greensheet. The method then provides for retracting the punch until the punch face is substantially coplanar with the orifice member second surface, and then cleaning the punch face and coplanar orifice member second surface to remove any residual paste thereon.

    Fully automated paste dispense system for dispensing small dots and lines
    5.
    发明申请
    Fully automated paste dispense system for dispensing small dots and lines 有权
    完全自动化的糊剂分配系统用于分配小点和线

    公开(公告)号：US20050042381A1

    公开(公告)日：2005-02-24

    申请号：US10645384

    申请日：2003-08-21

    申请人： Thomas Weiss ,  James Humenik ,  Mark LaPlante ,  David Long

    发明人： Thomas Weiss ,  James Humenik ,  Mark LaPlante ,  David Long

    IPC分类号： B05D3/00 ,  B05C5/00 ,  B05C11/10 ,  B05D5/12 ,  B67D7/60 ,  H05K1/09 ,  H05K3/10 ,  H05K3/12 ,  B05C11/00

    CPC分类号： B05C11/1034 ,  H05K1/092 ,  H05K3/1241 ,  H05K2203/0126

    摘要： A method of dispensing a flowable conductive paste onto a greensheet from a dispensing apparatus comprising an orifice member having first and second surfaces and a bore therethrough between the surfaces, a pressurized chamber adjacent the orifice member first surface containing the paste, and a punch having a face movable through the orifice member bore. The method comprises positioning the punch outside the orifice member bore such that the punch face is spaced from the orifice member first surface, flowing a desired amount of paste onto the punch face, moving the paste on the punch face through the orifice member bore until the punch face extends beyond the orifice member second surface, and contacting the workpiece with the paste while still on the punch face to deposit the paste on the greensheet. The method then provides for retracting the punch until the punch face is substantially coplanar with the orifice member second surface, and then cleaning the punch face and coplanar orifice member second surface to remove any residual paste thereon.

    摘要翻译： 一种从分配装置将可流动的导电膏分配到毛坯上的方法，该分配装置包括具有第一表面和第二表面的孔口构件和在其之间的孔，在邻近孔口构件第一表面的加压室和含有该糊料的冲头， 面可通过孔口构件孔移动。 该方法包括将冲头定位在孔口构件孔的外部，使得冲头表面与孔构件第一表面间隔开，将期望量的浆料流动到冲头表面上，通过孔口构件孔移动冲压面上的浆料，直到 冲头面延伸超过孔口构件第二表面，并且在仍然在冲压面上的同时使工件与浆料接触以将浆料沉积在毛坯上。 该方法然后提供回缩冲头，直到冲头表面与孔口构件第二表面基本共面，然后清洁冲头面和共面孔构件第二表面以去除其上的残留糊料。

    METHOD AND APPARATUS FOR POINT OF CARE OSMOLARITY TESTING
    7.
    发明申请
    METHOD AND APPARATUS FOR POINT OF CARE OSMOLARITY TESTING 审中-公开
    方法和装置用于治疗心理测试

    公开(公告)号：US20080053206A1

    公开(公告)日：2008-03-06

    申请号：US11930270

    申请日：2007-10-31

    申请人： Govindarajan Natarajan ,  James Humenik ,  Scott Partington ,  Srinivasa Reddy

    发明人： Govindarajan Natarajan ,  James Humenik ,  Scott Partington ,  Srinivasa Reddy

    IPC分类号： G01N13/04 ,  G01N27/00 ,  G01N27/26

    CPC分类号： G01N13/04 ,  Y10T436/11

    摘要： An apparatus and a method are disclosed for providing point of care testing for osmolarity of a bodily fluid. An apparatus is disclosed as having a fluid pathway passing through it for receiving and testing a sample fluid. The invention permits osmolarity testing of a sample fluid wherein the sample fluid has a volume of less than approximately 30 nL, and implements a method and device to measure fluid osmolarity in a clinical setting quickly and accurately, while also reducing evaporation of the fluid.

    摘要翻译： 公开了一种用于提供用于体液的渗透压的护理测试点的装置和方法。 公开了一种具有通过它的流体路径用于接收和测试样品流体的装置。 本发明允许样品流体的渗透压测试，其中样品流体具有小于约30nL的体积，并且实现了在临床设置中快速且准确地测量流体渗透压的方法和装置，同时还减少了流体的蒸发。

    METHOD AND STRUCTURE TO ENABLE FINE GRID MLC TECHNOLOGY
    8.
    发明申请
    METHOD AND STRUCTURE TO ENABLE FINE GRID MLC TECHNOLOGY 审中-公开
    使用精细网格技术的方法和结构

    公开(公告)号：US20070169600A1

    公开(公告)日：2007-07-26

    申请号：US11307111

    申请日：2006-01-24

    申请人： Govindarajan Natarajan ,  Michael Cranmer ,  James Humenik

    发明人： Govindarajan Natarajan ,  Michael Cranmer ,  James Humenik

    IPC分类号： B26F1/02 ,  B32B38/04

    CPC分类号： B26F1/02 ,  B26F2210/08 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/005 ,  H05K2201/09854 ,  H05K2203/0156 ,  H05K2203/016 ,  H05K2203/1476 ,  H05K2203/1536 ,  Y10T83/0572 ,  Y10T83/0577

    摘要： Methods of forming, and the intermediate substrate products formed, are disclosed whereby a via is formed in the substrate, followed by a second via. The second via is formed such that it overlap the first via, and may remove a first portion of any via distortion residing within the first via. A third via is then formed in the substrate to at least overlap the first via. The third via may remove a second portion of any via distortion within the first via. The second and third vias are formed on opposite sides of the first via, such that the first, second and third vias together form a symmetrically extended via within the substrate. Optionally, a rigid support film may be provided under the substrate prior to forming the extended via.

    摘要翻译： 公开了形成方法和形成的中间基板产品，由此在基板中形成通孔，随后形成第二通孔。 第二通道形成为使其与第一通孔重叠，并且可以去除驻留在第一通孔内的任何通孔失真的第一部分。 然后在衬底中形成至少与第一通孔重叠的第三通孔。 第三通孔可以去除第一通孔内的任何通孔失真的第二部分。 第二和第三通孔形成在第一通孔的相对侧上，使得第一，第二和第三通孔一起在衬底内形成对称延伸的通孔。 可选地，在形成延伸通孔之前，可以在基底之下设置刚性支撑膜。