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公开(公告)号:US11798789B2
公开(公告)日:2023-10-24
申请号:US16960818
申请日:2018-09-10
Applicant: LAM RESEARCH CORPORATION
Inventor: Alejandro Sanchez , Grayson Ford , Darrell Ehrlich , Aravind Alwan , Kevin Leung , Anthony Contreras , Zhumin Han , Raphael Casaes , Joanna Wu
IPC: H01J37/32 , H01L21/67 , H01L21/687
CPC classification number: H01J37/32642 , H01J37/32715 , H01L21/67069 , H01L21/68735 , H01L21/68742 , H01J2237/20235
Abstract: A first edge ring for a substrate support is provided. The first edge ring includes an annular-shaped body and one or more lift pin receiving elements. The annular-shaped body is sized and shaped to surround an upper portion of the substrate support. The annular-shaped body defines an upper surface, a lower surface, a radially inner surface, and a radially outer surface. The one or more lift pin receiving elements are disposed along the lower surface of the annular-shaped body and sized and shaped to receive and provide kinematic coupling with top ends respectively of three or more lift pins.