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公开(公告)号：US11656006B2
公开(公告)日：2023-05-23
申请号：US16836727
申请日：2020-03-31
发明人： Paul Artman , Jeffrey Holland , Vinod Kamath
CPC分类号： F25B21/02 , H05K7/20236 , H05K7/20272 , H05K7/20281 , F25B2321/023 , F25B2321/0251
摘要： Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof are disclosed. According to an aspect, a system includes a liquid vessel that defines an interior space for holding a cooling liquid and an electronic component. The system also includes a heat conduit including a first portion, a second portion, and a third portion. The heat conduit is configured to transfer heat between the portions. Further, the first portion is configured to transfer heat from the electronic component to the second portion. The second portion is configured to transfer heat to the cooling liquid and to the third portion. The system includes a thermoelectric cooler positioned within the interior space. The thermoelectric cooler includes an absorption side and a rejection side. The thermoelectric cooler is configured to transfer heat from the absorption side to the rejection side.
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公开(公告)号：US20200315066A1
公开(公告)日：2020-10-01
申请号：US16366000
申请日：2019-03-27
发明人： Paul Artman , Andrew Thomas Junkins
IPC分类号： H05K7/20
摘要： Systems and methods for cooling an electronic device via interface of a heat-transfer conduit of the electronic device to a cold plate assembly are disclosed. According to an aspect, a system includes an electronic device including one or more electronic components. Further, the electronic device includes a heat-transfer conduit including a first end and a second end. The first end of the heat-transfer conduit is positioned to receive heat from the electronic component(s). The heat-transfer conduit is configured to conduct heat from the first end to the second end. Further, the system includes a cold plate assembly including a cold plate and a mechanism configured to permit movement of the cold plate. At the first position, the cold plate may contact the second end for receipt of heat from the heat-transfer conduit at the second end. At the second position, the cold plate is apart from the second end.
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公开(公告)号：US10102041B2
公开(公告)日：2018-10-16
申请号：US15085127
申请日：2016-03-30
发明人： Paul Artman , Gary D. Cudak , Fred A. Bower, III , Ajay Dholakia
摘要： A method includes tracking, for each of a plurality of workloads, a wear rate incurred by a component of a given component type as a result of processing an instance of the workload on a compute node that includes the component. The method further comprises determining a remaining lifespan for a plurality of components in a plurality of compute nodes, and identifying a component from among the plurality of components having a remaining lifespan of less than a first threshold amount. Sill further, the method comprises identifying an instance of one of the workloads that needs processing and has a wear rate greater than a second threshold amount, and processing the identified workload instance on the identified component.
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公开(公告)号：US09921851B2
公开(公告)日：2018-03-20
申请号：US15084861
申请日：2016-03-30
IPC分类号： G06F9/44
CPC分类号： G06F9/4411 , G06F8/61 , G06F8/654 , G06F9/4416 , G06F9/44505 , G06F9/5005
摘要： Apparatuses, methods, systems, and program products are disclosed for dynamically loading firmware based on workloads. A workload module determines a workload configured to be executed on a system. A firmware module determines a firmware configuration associated with the workload. A loading module dynamically accesses the firmware configuration associated with the workload from a remote data store, and loads the firmware configuration on the system prior to execution of the workload.
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公开(公告)号：US20220151098A1
公开(公告)日：2022-05-12
申请号：US17094696
申请日：2020-11-10
发明人： Andrew Junkins , Paul Artman , Vinod Kamath
IPC分类号： H05K7/20
摘要： Cooling devices for cooling electronic components with liquid cooling and associated methods thereof are disclosed. According to an aspect, a device includes a housing that defines an interior space. The device also includes an electronic component positioned in the interior space. The device also includes a liquid cooling component configured to engage the housing and the electronic component for cooling the electronic component and the interior space.
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公开(公告)号：US20210302074A1
公开(公告)日：2021-09-30
申请号：US16836727
申请日：2020-03-31
发明人： Paul Artman , Jeffrey Holland , Vinod Kamath
摘要： Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof are disclosed. According to an aspect, a system includes a liquid vessel that defines an interior space for holding a cooling liquid and an electronic component. The system also includes a heat conduit including a first portion, a second portion, and a third portion. The heat conduit is configured to transfer heat between the portions. Further, the first portion is configured to transfer heat from the electronic component to the second portion. The second portion is configured to transfer heat to the cooling liquid and to the third portion. The system includes a thermoelectric cooler positioned within the interior space. The thermoelectric cooler includes an absorption side and a rejection side. The thermoelectric cooler is configured to transfer heat from the absorption side to the rejection side.
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7.发明授权公开(公告)号：US10248602B2
公开(公告)日：2019-04-02
申请号：US14859252
申请日：2015-09-19
发明人： Paul Artman , Andrew T. Junkins , Jiabing Li , Rodrigo Samper , Marcelo Vinante
摘要： Computing devices having slots and components for receipt of different types of peripherals are disclosed. According to an aspect, a computing device includes a body that defines an interior and comprises a rear wall defining a slot that extends into the interior. The slot is sized and shaped for receipt of two or more different types of peripherals. The computing device includes a motherboard that defines another slot being sized and shaped for receipt of the different types of peripherals. The other slot is substantially coplanar with the second slot. The computing device includes a connector operably interfaced with the motherboard and configured to interface with the different types of peripherals.
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公开(公告)号：US10185379B2
公开(公告)日：2019-01-22
申请号：US15088086
申请日：2016-03-31
发明人： Paul Artman , Fred A. Bower , Gary D. Cudak , Ajay Dholakia
摘要： Systems and methods for usage of secondary power supplies in computing environments based on risk and cost assessments are disclosed. According to an aspect, a method includes determining a risk value to a primary power source of a need to utilize a secondary power source for powering a plurality of computing devices. The method includes using the secondary power source to power a portion of the computing devices based on the determined risk value.
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9.发明授权公开(公告)号：US10162963B2
公开(公告)日：2018-12-25
申请号：US15084666
申请日：2016-03-30
摘要： A method is provided for detecting malware, such as a virus or spyware. The method looks for deviations expected operating parameters instead of focusing solely on conventional malware signatures. The method includes monitoring current operating parameters for a computing system running one or more application, obtaining baseline operating parameters for the computing system running the one or more application in the absence of malware, identifying a deviation between the current operating parameters and the baseline operating parameters, and determining whether the identified deviation matches a deviation associated with a predetermined malware definition.
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公开(公告)号：US11058027B2
公开(公告)日：2021-07-06
申请号：US16373699
申请日：2019-04-03
发明人： Paul Artman , Vinod Kamath
IPC分类号： H05K7/20 , G05B19/042
摘要： Systems and methods for controlling air distribution to electronic components are disclosed. According to an aspect, a system includes fans configured to distribute air to a plurality of electronic components. The system also includes a fan controller configured to control the fans based on a form factor and/or a quantity of the electronic components.
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