公开(公告)号：US20220190221A1

公开(公告)日：2022-06-16

申请号：US17437372

申请日：2020-03-03

Applicant: LG CHEM, LTD.

Inventor： Kiseok LEE ,  Kun Seok LEE ,  Seung Heon LEE

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/44 ,  H01L33/38

Abstract: A transparent light emitting device display comprising: a transparent substrate; a conductive metal pattern provided on the transparent substrate; a light emitting device provided on at least a part of the conductive metal pattern; a first transparent adhesive layer provided on the transparent substrate, the conductive metal pattern, and the light emitting device; a UV-cut film provided on the first transparent adhesive layer; and a second transparent adhesive layer provided on the UV-cut film.

公开(公告)号：US20220132675A1

公开(公告)日：2022-04-28

申请号：US17569926

申请日：2022-01-06

Applicant: LG CHEM, LTD.

Inventor： Yong Goo SON ,  Kun Seok LEE ,  Jung Ok MOON ,  Kiseok LEE ,  Seung Heon LEE

IPC: H05K3/38 ,  H05K1/02

Abstract: A method of manufacturing a transparent electrode substrate according to an exemplary embodiment of the present application comprises: forming a structure comprising a transparent base, a bonding layer provided on the transparent base, and a metal foil provided on the bonding layer; forming a metal foil pattern by patterning the metal foil; heat-treating the structure comprising the metal foil pattern at a temperature of 70° C. to 100° C.; and completely curing the bonding layer.

公开(公告)号：US20210074895A1

公开(公告)日：2021-03-11

申请号：US16971933

申请日：2019-08-20

Applicant: LG CHEM, LTD.

Inventor： Kun Seok LEE ,  Yong Goo SON ,  Kiseok LEE ,  Seung Heon LEE

IPC: H01L33/62 ,  H01L25/075

Abstract: An electrode substrate for a transparent light emitting device display according to an embodiment of the this application comprises: a transparent substrate; (M rows×N columns) light emitting device pad portions provided on the transparent substrate as a matrix; and a first common electrode wiring portion, a second common electrode wiring portion, and a signal electrode wiring portion which are provided on the transparent substrate and connected to the light emitting device pad portions, respectively, in which each of the first common electrode wiring portion, the second common electrode wiring portion, and the signal electrode wiring portion comprises a metal mesh pattern, and line resistance of the first common electrode wiring portion or the second common electrode wiring portion connected to the light emitting device pad portions constituting one row among the light emitting device pad portions satisfies Equation 1 above.

公开(公告)号：US20190341574A1

公开(公告)日：2019-11-07

申请号：US16303974

申请日：2017-02-23

Applicant: LG CHEM, LTD.

Inventor： Yong Goo SON ,  Song Ho JANG ,  Jiehyun SEONG ,  Kiseok LEE ,  Seung Heon LEE

IPC: H01L51/52 ,  H01L51/50

Abstract: Provided is an electrode structure having a transparent electrode, a light blocking pattern provided on the transparent electrode, an auxiliary electrode pattern provided on the light blocking pattern, and an organic insulating pattern covering the light blocking pattern and the auxiliary electrode pattern, wherein a line width of the light blocking pattern is larger than a line width of the auxiliary electrode pattern. Also provided are an electronic device including the electrode structure, and a method of manufacturing the electrode structure.

公开(公告)号：US20210195760A1

公开(公告)日：2021-06-24

申请号：US16755540

申请日：2019-03-11

Applicant: LG CHEM, LTD.

Inventor： Yong Goo SON ,  Kun Seok LEE ,  Jung Ok MOON ,  Kiseok LEE ,  Seung Heon LEE

IPC: H05K3/38 ,  H05K1/02

Abstract: A method of manufacturing a transparent electrode substrate according to an exemplary embodiment includes: a) forming a structure including a transparent base, a bonding layer on a surface of the transparent base, and a metal foil on a surface of the bonding layer opposite the transparent base; b) forming a metal foil pattern by patterning the metal foil; c) heat-treating the structure resulting from b) at a temperature of 70° C. to 100° C.; and d) completely curing the bonding layer. Also, a transparent electrode substrate is disclosed.

公开(公告)号：US20180196346A1

公开(公告)日：2018-07-12

申请号：US15741993

申请日：2017-01-04

Applicant: LG CHEM, LTD.

Inventor： Yong Goo SON ,  Seung Heon LEE ,  Han Min SEO ,  Chang Yoon LIM ,  Ji Eun MYUNG ,  Kiseok LEE

IPC: G03F7/20 ,  H05K3/00 ,  G03F7/16 ,  G03F7/32 ,  G03F7/038

CPC classification number: G03F7/2002 ,  G03F7/038 ,  G03F7/162 ,  G03F7/168 ,  G03F7/322 ,  H01L51/5212 ,  H05K1/0274 ,  H05K1/09 ,  H05K3/0011 ,  H05K3/12 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/0376 ,  H05K2201/09681 ,  H05K2203/0264 ,  H05K2203/0278

Abstract: The present specification relates to a manufacturing method of a circuit board. More particularly, the present specification relates to a circuit board and a manufacturing method of an electronic device including the same.

公开(公告)号：US20180164677A1

公开(公告)日：2018-06-14

申请号：US15580241

申请日：2016-07-28

Applicant: LG CHEM, LTD.

Inventor： Yong Goo SON ,  Kiseok LEE ,  Seung Heon LEE

IPC: G03F1/48

Abstract: The present specification relates to a photomask, a laminate including the photomask, a method for manufacturing the photomask and a method for forming a pattern using the photomask.

公开(公告)号：US20200281047A1

公开(公告)日：2020-09-03

申请号：US16650312

申请日：2018-12-05

Applicant: LG CHEM, LTD.

Inventor： Jiehyun SEONG ,  Jung Il YOON ,  Sang Hoon SON ,  Kiseok LEE ,  Yong Goo SON ,  Jooyeon KIM ,  Jong Sung PARK ,  Seung Heon LEE

IPC: H05B3/86 ,  H05B3/36 ,  B32B15/20 ,  B32B27/36 ,  B32B37/02 ,  B32B37/24 ,  B32B15/09 ,  B32B17/10

Abstract: The heating film including: a transparent substrate; a coating layer provided on the transparent substrate and having a refractive index of 1.450 to 1.485; and a metal foil pattern provided on the coating layer, in which a ten-point average roughness (Rz) of a surface of the metal foil pattern is more than 0.9 μm.

公开(公告)号：US20190098706A1

公开(公告)日：2019-03-28

申请号：US16084523

申请日：2016-12-23

Applicant: LG CHEM, LTD.

Inventor： Jooyeon KIM ,  Yong Goo SON ,  Seung Heon LEE ,  Jiehyun SEONG ,  Ji Eun MYUNG ,  Kiseok LEE

IPC: H05B3/86 ,  C09D11/102 ,  C09D11/037 ,  C09D11/033

Abstract: The present specification relates to an ink composition, a cured pattern prepared using an ink composition, a heating element including a cured pattern, and a method for manufacturing a heating element.

公开(公告)号：US20190074105A1

公开(公告)日：2019-03-07

申请号：US16084844

申请日：2016-12-23

Applicant: LG CHEM, LTD.

Inventor： Ji Eun MYUNG ,  Jooyeon KIM ,  Seung Heon LEE ,  Jiehyun SEONG ,  Kiseok LEE

IPC: H01B5/14 ,  H05B3/84

Abstract: The present invention relates to a heating element and a manufacturing method therefor. More specifically, according to one embodiment of the present invention, provided is a method for manufacturing a heating element, comprising the steps of: preparing an adhesive film; forming conductive heating patterns on the adhesive film; and laminating a transparent substrate on at least one surface of the adhesive film having the conductive heating patterns.