ENCAPSULATING COMPOSITION AND ORGANIC ELECTRONIC DEVICE COMPRISING SAME

    公开(公告)号:US20240317914A1

    公开(公告)日:2024-09-26

    申请号:US18259705

    申请日:2021-12-31

    Applicant: LG CHEM, LTD.

    CPC classification number: C08F220/1811 H10K50/844 H10K71/10

    Abstract: The encapsulating composition according to the present invention comprises a radical-curable compound having at least one or more radical-curable functional groups, and has composition polarizability of 1.8 or less, wherein the composition polarizability is the sum of values obtained by multiplying each “compound polarizability of radical-curable compounds” constituting the encapsulating composition and “the weight ratio of the relevant radical-curable compound to the encapsulating composition” and the compound polarizability may be calculated by the following general equation 1.


    Compound polarizability=(the value obtained by combining the number of carbons and the number of oxygens included in the molecular structure of the relevant radical-curable compound)/(the value obtained by subtracting the number of oxygens from the number of carbons in the molecular structure of the relevant radical-curable compound)  [General Equation 1]

    MULTI FUNCTION PHOTOACID GENERATOR AND CHEMICALLY AMPLIFIED PHOTORESIST COMPOSITION FOR THICK LAYER COMPRISING THE SAME

    公开(公告)号:US20200033725A1

    公开(公告)日:2020-01-30

    申请号:US16489560

    申请日:2018-08-24

    Applicant: LG CHEM, LTD.

    Abstract: The present invention relates to a photoacid generator, and a chemically amplified photoresist composition for a thick film including the same, wherein the photoacid generator has excellent solubility and sensitivity, and also has an anti-corrosion effect, in addition to the effect as a photoacid generator. Thus, a chemically amplified photoresist composition for a thick film including the photoacid generator reduces scum and/or footing at the exposed part after development. The photoacid generator represented by the following Chemical Formula 1: In Chemical Formula 1, the definition of each substituents is the same as the detail description of the specification.

    PHOTORESIST COMPOSITION
    8.
    发明申请

    公开(公告)号:US20200218153A1

    公开(公告)日:2020-07-09

    申请号:US16631765

    申请日:2018-07-24

    Applicant: LG CHEM, LTD.

    Abstract: The present invention relates to a chemically amplified photoresist composition including an alkali-soluble resin including a (meth)acrylate-based resin containing a (meth)acrylate-based repeating unit in which a heterocyclic compound is substituted via a divalent functional group containing an alkylene sulfide having 1 to 20 carbon atoms.

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