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公开(公告)号：US20240002715A1
公开(公告)日：2024-01-04
申请号：US18031756
申请日：2022-01-28
申请人： LG Chem, Ltd.
发明人： Hye Jin Kim , Je Sik Jung , Hyoung Sook Park , Jin Hyeok Won , Sung Bum Hong , Sol Yi Lee , Jong Hun Choi , Sang Hyuk Seo , Jae Min Jung
CPC分类号： C09K5/14 , C08K7/18 , C08G18/4286 , C08G18/73 , C08G18/755 , C08K2201/005 , C08G18/791 , H05K7/2039 , C08K2201/001 , C08K2201/014 , C08G18/722
摘要： According to the present invention, it is possible to provide a composition comprising a resin component and a filler component comprising a filler having a specific gravity of 3 or more and a filler having a specific gravity of less than 3, which achieves a low specific gravity effect in a state where a filler is filled in a high content and in a state where realization of physical properties is sufficiently secured, and has improved storage stability without deterioration of physical properties such as a thermal conductivity, and a product comprising a heating element and the composition or a cured product thereof in thermal contact with the heating element.
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公开(公告)号：US20240301267A1
公开(公告)日：2024-09-12
申请号：US18038512
申请日：2022-01-26
申请人： LG Chem, Ltd.
发明人： Sol Yi Lee , Je Sik Jung , Hyoung Sook Park , Jin Hyeok Won , Hye Jin Kim , Sung Bum Hong , Jong Hun Choi , Sang Hyuk Seo , Jae Min Jung
CPC分类号： C09K5/14 , C08G18/722 , C08G18/73 , C08G18/755 , C08G18/758 , C08K7/18 , H01M10/653
摘要： The present application can provide a curable composition capable of securing processability due to excellent blending properties with a filler while having little viscosity change with time and for forming a cured product having excellent electrical insulation performance, and can provide a device comprising, between an exothermic element and a cooling region, a cured product of a tow-component curable composition including the curable composition in thermal contact with both.
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公开(公告)号：US20240101740A1
公开(公告)日：2024-03-28
申请号：US18274252
申请日：2022-10-07
申请人： LG Chem, Ltd.
发明人： Bethy Kim , Je Sik Jung , Sang Hyuk Seo , Sung Bum Hong , Sol Yi Lee
IPC分类号： C08F220/18 , C08K13/04 , C09K5/14 , H01M10/653 , H01M50/211 , H01M50/293
CPC分类号： C08F220/1808 , C08K13/04 , C09K5/14 , H01M10/653 , H01M50/211 , H01M50/293 , C08F2800/20 , C08K7/18 , C08K2201/001
摘要： A curable composition is capable of forming a thick film having excellent curing characteristics even at a relatively low temperature and is capable of securing an excellent level of thermal conductivity as well as a desired level of appropriate adhesion force while having fast curing characteristics. A battery pack to which the curable composition is applied, and a device comprising the battery pack are also provided.
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