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公开(公告)号:US20150021651A1
公开(公告)日:2015-01-22
申请号:US14509321
申请日:2014-10-08
Applicant: LG INNOTEK CO., LTD.
Inventor: Sung Min KONG , Choong Youl KIM , Hee Seok CHOI
CPC classification number: H01L33/60 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: Disclosed is a light emitting device package. The light emitting device package includes a package body having a first cavity and a second cavity; a plurality of reflective frames comprising a first reflective frame and a second reflective frame on the first cavity and the second cavity, respectively, and each of the first reflective frame and the second reflective frame comprises a bottom frame and at least two side wall frames extending from the bottom frame; and a light emitting device on the first reflective frame, wherein the first reflective frame and the second reflective frame are electrically separated from each other.
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2.
公开(公告)号:US20130049057A1
公开(公告)日:2013-02-28
申请号:US13662508
申请日:2012-10-28
Applicant: LG INNOTEK CO., LTD.
Inventor: Sung Min KONG , Choong Youl KIM , Hee Seok CHOI
IPC: H01L33/60
CPC classification number: H01L33/60 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: Disclosed is an LED package. The LED package includes a package body, a first frame and a second frame on the package body and a light emitting device chip on the first frame. The first frame is separated from the second frame, and the first frame includes a bottom frame on the package body and at least two sidewall frames extending from the bottom frame and inclined with respect to the bottom frame.
Abstract translation: 公开了一种LED封装。 LED封装包括封装主体,封装主体上的第一框架和第二框架以及第一框架上的发光器件芯片。 第一框架与第二框架分离,并且第一框架包括封装主体上的底部框架和从底部框架延伸并相对于底部框架倾斜的至少两个侧壁框架。
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3.
公开(公告)号:US20160149102A1
公开(公告)日:2016-05-26
申请号:US14983294
申请日:2015-12-29
Applicant: LG INNOTEK CO., LTD.
Inventor: Sung Min KONG , Choong Youl KIM , Hee Seok CHOI
CPC classification number: H01L33/60 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: Disclosed is a light emitting device package. The light emitting device is a package body including a first recess which is provided with a bottom face and a plurality of inner walls surrounding the bottom face the plurality of inner walls including a first inner wall and a second inner wall, which are opposing walls; a lead frame exposed at the bottom face of the package body, the lead frame including a bottom frame and a reflector exposed along one of the first inner wall and the second inner wall; a light emitting element provided on the lead frame; and a transparent material provided in the package body to cover the light emitting element. A material of the reflector is a same as a material of the bottom frame of the lead frame.
Abstract translation: 公开了一种发光器件封装。 发光装置是包括第一凹部的封装主体,第一凹部设置有底面和围绕底面的多个内壁,所述多个内壁包括作为相对壁的第一内壁和第二内壁; 所述引线框架在所述封装主体的底面处露出,所述引线框架包括底框架和反射器,所述反射器沿着所述第一内壁和所述第二内壁中的一个露出; 设置在引线框架上的发光元件; 以及设置在封装主体中以覆盖发光元件的透明材料。 反射器的材料与引线框架的底部框架的材料相同。
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公开(公告)号:US20130341654A1
公开(公告)日:2013-12-26
申请号:US13975029
申请日:2013-08-23
Applicant: LG INNOTEK CO., LTD.
Inventor: Sung Min KONG , Choong Youl KIM , Hee Seok CHOI
IPC: H01L33/62
CPC classification number: H01L33/60 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: Disclosed is an LED package. The LED package includes a package body, a first frame and a second frame on the package body and a light emitting device chip on the first frame. The first frame is separated from the second frame, and the first frame includes a bottom frame on the package body and at least two sidewall frames extending from the bottom frame and inclined with respect to the bottom frame.
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公开(公告)号:US20170155024A1
公开(公告)日:2017-06-01
申请号:US15361149
申请日:2016-11-25
Applicant: LG INNOTEK CO., LTD.
Inventor: Dong Hyun YU , Choong Youl KIM
IPC: H01L33/62
CPC classification number: H01L33/62 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
Abstract: A light emitting package includes a first lead frame; a second lead frame spaced apart from the first lead frame in a first direction; a body coupled to the first lead frame and the second lead frame; and a light emitting element on the first lead frame. The first lead frame includes first to fourth side parts, the first side part includes a first protrusion that protrudes outwards from one side surface of the body, and a first contact part disposed at the end of the first protrusion. The second lead frame includes fifth to eighth side parts, the fifth side part includes a second protrusion that protrudes outwards from a side surface of the body, which is symmetrical to the one side surface of the body, and a second contact part disposed at the end of the second protrusion. Each of the first contact part and the second contact part includes a second layer and first layer covers the second layer.
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公开(公告)号:US20170104142A1
公开(公告)日:2017-04-13
申请号:US15382553
申请日:2016-12-16
Applicant: LG INNOTEK CO., LTD.
Inventor: Sung Min KONG , Choong Youl KIM , Hee Seok CHOI
CPC classification number: H01L33/60 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: A light emitting device package including a package body including a recess which is provided with a bottom face and a plurality of inner walls surrounding the bottom face, the plurality of inner walls including a first inner wall and a second inner wall, which are opposing walls; a lead frame including a first portion disposed on the bottom face of the package body and at least one second portion extending from the first portion, the first portion including a planar upper surface exposed at the bottom face and a planar lowermost surface positioned opposite to the planar upper surface; a light emitting element provided on the planar upper surface of the first portion; and a transparent material provided in the recess of the package body to cover the light emitting element. The at least one second portion includes an upper surface exposed at the first inner walls and a lower surface opposite to the upper surface; the lower surface of the at least one second portion includes a lower curved surface; the planar lowermost surface of the first portion is positioned lower than the lower curved surface of the at least one second portion; a stepped portion is positioned between the lower curved surface of the at least one second portion and the lowermost surface of the first portion; and the stepped portion contacts the package body.
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公开(公告)号:US20130313966A1
公开(公告)日:2013-11-28
申请号:US13956064
申请日:2013-07-31
Applicant: FORCE4 CORP. , LG INNOTEK CO., LTD.
Inventor: Choong Youl KIM , Joong In AN , Seung Hyok PARK , Ho Shin YOON , Chang Hee LEE
CPC classification number: C09K11/7728 , C09K11/65 , H01L33/502 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2224/8592 , H01L2924/181 , H05B33/12 , H01L2924/00014 , H01L2924/00012
Abstract: A phosphor and a light emitting device containing the phosphor are provided. According to an embodiment, the phosphor is expressed in a chemical formula of LxMyCz1Nz2:Aa where L is at least one of an alkaline earth metal, a transition metal, Zn, Cd, Al, Ga, In, Ti, Ge, and Sn; M is at least one of B, Si, P, S, F, Cl, I, and Se; and A is at least one of an alkaline rare earth metal and the transition metal, and where 0
Abstract translation: 提供荧光体和含有荧光体的发光装置。 根据一个实施方案,荧光体以化学式LxMyCz1Nz2:Aa表示,其中L是碱土金属,过渡金属,Zn,Cd,Al,Ga,In,Ti,Ge和Sn中的至少一种; M是B,Si,P,S,F,Cl,I和Se中的至少一种; 并且A是碱性稀土金属和过渡金属中的至少一种,并且其中0
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公开(公告)号:US20150179906A1
公开(公告)日:2015-06-25
申请号:US14638398
申请日:2015-03-04
Applicant: LG INNOTEK CO., LTD.
Inventor: Sung Min KONG , Choong Youl KIM , Hee Seok CHOI
CPC classification number: H01L33/60 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: Disclosed is a light emitting device package. The light emitting device package includes a package body having a first cavity and a second cavity; a plurality of reflective frames comprising a first reflective frame and a second reflective frame on the first cavity and the second cavity, respectively, and each of the first reflective frame and the second reflective frame comprises a bottom frame and at least two side wall frames extending from the bottom frame; and a light emitting device on the first reflective frame, wherein the first reflective frame and the second reflective frame are electrically separated from each other.
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9.
公开(公告)号:US20150021644A1
公开(公告)日:2015-01-22
申请号:US14507488
申请日:2014-10-06
Applicant: LG INNOTEK CO., LTD.
Inventor: Sung Min KONG , Choong Youl KIM , Hee Seok CHOI
CPC classification number: H01L33/60 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: Disclosed is a light emitting device package. The light emitting device package includes a package body having a first cavity and a second cavity; a plurality of reflective frames comprising a first reflective frame and a second reflective frame on the first cavity and the second cavity, respectively, and each of the first reflective frame and the second reflective frame comprises a bottom frame and at least two side wall frames extending from the bottom frame; and a light emitting device on the first reflective frame, wherein the first reflective frame and the second reflective frame are electrically separated from each other.
Abstract translation: 公开了一种发光器件封装。 发光器件封装包括具有第一腔和第二腔的封装体; 多个反射框架,分别包括在第一空腔和第二空腔上的第一反射框架和第二反射框架,并且第一反射框架和第二反射框架中的每一个包括底框架和至少两个侧壁框架, 从底部框架; 以及在所述第一反射框架上的发光器件,其中所述第一反射框架和所述第二反射框架彼此电分离。
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10.
公开(公告)号:US20140145205A1
公开(公告)日:2014-05-29
申请号:US14169581
申请日:2014-01-31
Applicant: LG INNOTEK CO., LTD.
Inventor: Sung Min KONG , Choong Youl KIM , Hee Seok CHOI
CPC classification number: H01L33/60 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: Disclosed is an LED package. The LED package includes a package body, a first frame and a second frame on the package body and a light emitting device chip on the first frame. The first frame is separated from the second frame, and the first frame includes a bottom frame on the package body and at least two sidewall frames extending from the bottom frame and inclined with respect to the bottom frame.
Abstract translation: 公开了一种LED封装。 LED封装包括封装主体,封装主体上的第一框架和第二框架以及第一框架上的发光器件芯片。 第一框架与第二框架分离,并且第一框架包括封装主体上的底部框架和从底部框架延伸并相对于底部框架倾斜的至少两个侧壁框架。
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