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公开(公告)号：US20150021651A1
公开(公告)日：2015-01-22
申请号：US14509321
申请日：2014-10-08
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Min KONG , Choong Youl KIM , Hee Seok CHOI
CPC classification number: H01L33/60 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: Disclosed is a light emitting device package. The light emitting device package includes a package body having a first cavity and a second cavity; a plurality of reflective frames comprising a first reflective frame and a second reflective frame on the first cavity and the second cavity, respectively, and each of the first reflective frame and the second reflective frame comprises a bottom frame and at least two side wall frames extending from the bottom frame; and a light emitting device on the first reflective frame, wherein the first reflective frame and the second reflective frame are electrically separated from each other.
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公开(公告)号：US20150179906A1
公开(公告)日：2015-06-25
申请号：US14638398
申请日：2015-03-04
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Min KONG , Choong Youl KIM , Hee Seok CHOI
CPC classification number: H01L33/60 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: Disclosed is a light emitting device package. The light emitting device package includes a package body having a first cavity and a second cavity; a plurality of reflective frames comprising a first reflective frame and a second reflective frame on the first cavity and the second cavity, respectively, and each of the first reflective frame and the second reflective frame comprises a bottom frame and at least two side wall frames extending from the bottom frame; and a light emitting device on the first reflective frame, wherein the first reflective frame and the second reflective frame are electrically separated from each other.
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公开(公告)号：US20150021644A1
公开(公告)日：2015-01-22
申请号：US14507488
申请日：2014-10-06
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Min KONG , Choong Youl KIM , Hee Seok CHOI
CPC classification number: H01L33/60 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: Disclosed is a light emitting device package. The light emitting device package includes a package body having a first cavity and a second cavity; a plurality of reflective frames comprising a first reflective frame and a second reflective frame on the first cavity and the second cavity, respectively, and each of the first reflective frame and the second reflective frame comprises a bottom frame and at least two side wall frames extending from the bottom frame; and a light emitting device on the first reflective frame, wherein the first reflective frame and the second reflective frame are electrically separated from each other.
Abstract translation: 公开了一种发光器件封装。 发光器件封装包括具有第一腔和第二腔的封装体; 多个反射框架，分别包括在第一空腔和第二空腔上的第一反射框架和第二反射框架，并且第一反射框架和第二反射框架中的每一个包括底框架和至少两个侧壁框架， 从底部框架; 以及在所述第一反射框架上的发光器件，其中所述第一反射框架和所述第二反射框架彼此电分离。
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公开(公告)号：US20140145205A1
公开(公告)日：2014-05-29
申请号：US14169581
申请日：2014-01-31
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Min KONG , Choong Youl KIM , Hee Seok CHOI
CPC classification number: H01L33/60 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: Disclosed is an LED package. The LED package includes a package body, a first frame and a second frame on the package body and a light emitting device chip on the first frame. The first frame is separated from the second frame, and the first frame includes a bottom frame on the package body and at least two sidewall frames extending from the bottom frame and inclined with respect to the bottom frame.
Abstract translation: 公开了一种LED封装。 LED封装包括封装主体，封装主体上的第一框架和第二框架以及第一框架上的发光器件芯片。 第一框架与第二框架分离，并且第一框架包括封装主体上的底部框架和从底部框架延伸并相对于底部框架倾斜的至少两个侧壁框架。
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公开(公告)号：US20210305475A1
公开(公告)日：2021-09-30
申请号：US17261935
申请日：2019-06-10
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Min KONG , Sung Ho KIM , Taek Kyun KIM
Abstract: A light emitting device package according to an embodiment comprises: first and second frames disposed spaced apart from each other; a body disposed surrounding the first and second frames and having first and second openings spaced apart from each other; a light emitting device disposed on the body and including first and second bonding parts; and first and second conductive parts disposed in the first and second openings respectively, wherein the first and second openings perpendicularly overlap the first and second frames respectively, the first and second conductive parts are electrically connected to the first and second frames respectively, the first and second bonding parts are disposed in the first and second openings respectively, and are electrically connected to the first and second conductive parts, and the light emitting device includes a support region disposed on the body outside the first and second openings. In addition, a light source module, according to an embodiment, comprises a circuit board and at least one light emitting device package disposed on the circuit board.
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Patent Agency Ranking
公开(公告)号：US20180306405A1
公开(公告)日：2018-10-25
申请号：US15738075
申请日：2016-06-22
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Min KONG
CPC classification number: F21V5/04 , G02B3/08 , G02B7/022 , G02B19/0066 , G02B27/0955 , H04N5/2254 , H04N5/2256 , H04N5/2354 , H05B33/0857
Abstract: Embodiments disclose an optical lens and a light emitting module having the same. The disclosed light emitting module includes: an optical lens including a light-transmitting first body, an incident part including an incident surface and a pattern on a periphery of the incident surface under the first body, and an emitting part protruding from an upper surface of the first body; a light emitting device having a second body having a cavity in which the incident part of the optical lens is disposed, a light emitting diode in the cavity, and a recess in which an outer lower surface of the first body faces a periphery of the cavity; and an adhesive for bonding the outer lower surface of the first body of the optical lens to the recess of the light emitting device, wherein a lower portion of the first body is disposed in the recess.
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公开(公告)号：US20180019386A1
公开(公告)日：2018-01-18
申请号：US15544495
申请日：2016-01-19
Applicant: LG INNOTEK CO., LTD.
Inventor： Tae Sung LEE , Sung Min KONG , Young Min RYU , Jae Hwan JUNG , Jong Beom CHOI
CPC classification number: H01L33/647 , H01L25/0753 , H01L33/486 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2933/0033 , H01L2924/00014
Abstract: A light-emitting element disclosed in an embodiment comprises: a body having a cavity; first and second lead frames arranged in the cavity; a third lead frame arranged between the first and second lead frames in the cavity; a fourth lead frame arranged between the first and second lead frames and distanced from the third frame in the cavity; a first light-emitting chip arranged on the first lead frame; and a second light-emitting chip arranged on the second lead frame, wherein the body comprises: first and second sides arranged on opposing sides from each other; and third and fourth sides arranged on opposing sides from each other, the first lead frame comprises first and second lead parts protruding toward the first and second sides, the second lead frame comprises third and forth lead parts protruding toward the first and second sides, the third frame comprises a fifth lead part protruding toward the first side, and the fourth lead frame comprises a sixth lead part protruding toward the second side.
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公开(公告)号：US20160149102A1
公开(公告)日：2016-05-26
申请号：US14983294
申请日：2015-12-29
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Min KONG , Choong Youl KIM , Hee Seok CHOI
CPC classification number: H01L33/60 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: Disclosed is a light emitting device package. The light emitting device is a package body including a first recess which is provided with a bottom face and a plurality of inner walls surrounding the bottom face the plurality of inner walls including a first inner wall and a second inner wall, which are opposing walls; a lead frame exposed at the bottom face of the package body, the lead frame including a bottom frame and a reflector exposed along one of the first inner wall and the second inner wall; a light emitting element provided on the lead frame; and a transparent material provided in the package body to cover the light emitting element. A material of the reflector is a same as a material of the bottom frame of the lead frame.
Abstract translation: 公开了一种发光器件封装。 发光装置是包括第一凹部的封装主体，第一凹部设置有底面和围绕底面的多个内壁，所述多个内壁包括作为相对壁的第一内壁和第二内壁; 所述引线框架在所述封装主体的底面处露出，所述引线框架包括底框架和反射器，所述反射器沿着所述第一内壁和所述第二内壁中的一个露出; 设置在引线框架上的发光元件; 以及设置在封装主体中以覆盖发光元件的透明材料。 反射器的材料与引线框架的底部框架的材料相同。
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公开(公告)号：US20130341654A1
公开(公告)日：2013-12-26
申请号：US13975029
申请日：2013-08-23
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Min KONG , Choong Youl KIM , Hee Seok CHOI
IPC: H01L33/62
CPC classification number: H01L33/60 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: Disclosed is an LED package. The LED package includes a package body, a first frame and a second frame on the package body and a light emitting device chip on the first frame. The first frame is separated from the second frame, and the first frame includes a bottom frame on the package body and at least two sidewall frames extending from the bottom frame and inclined with respect to the bottom frame.
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公开(公告)号：US20190288168A1
公开(公告)日：2019-09-19
申请号：US16345186
申请日：2017-10-27
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Min KONG
Abstract: Disclosed is a semiconductor device package according to an embodiment, the semiconductor comprising: a substrate; first and second lead frames arranged on the substrate; a semiconductor device electrically connected to the first and second lead frames; a reflective layer arranged on the substrate so as to reflect the light emitted from the semiconductor device; and a lens arranged on the substrate so as to cover the semiconductor device, the reflective layer, and the first and second lead frames.
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