公开(公告)号：US10950754B2

公开(公告)日：2021-03-16

申请号：US16474197

申请日：2017-12-27

Applicant: LG INNOTEK CO., LTD.

Inventor： Woong Sun Yum ,  Hyun Ju Kim ,  Jin Soo Park ,  Seung Il Lee ,  Jae Young Im

IPC: H01L33/38 ,  H01L33/30 ,  H01L33/40

Abstract: An embodiment discloses a semiconductor device comprising: a light-emitting structure having a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer; a first electrode disposed on the first conductive semiconductor layer; a second electrode disposed below the second conductive semiconductor layer; and a current blocking layer disposed between the second conductive semiconductor layer and the second electrode, wherein the first conductive semiconductor layer includes a first region in which the first electrode is disposed and a second region, the thickness of which is less than the thickness of the first region, and the current blocking layer is disposed in a region corresponding to the first region in the thickness direction.

公开(公告)号：US10593838B2

公开(公告)日：2020-03-17

申请号：US16100785

申请日：2018-08-10

Applicant: LG INNOTEK CO., LTD.

Inventor： Youn Joon Sung ,  Jin Soo Park ,  Rak Jun Choi

IPC: H01L33/38 ,  H01L33/12 ,  H01L33/32 ,  H01L33/44 ,  H01L31/0304

Abstract: The embodiment discloses a semiconductor device which includes: a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer; a first electrode electrically connected to the first conductive semiconductor layer; a second electrode electrically connected to the second conductive semiconductor layer; a first cover electrode disposed on the first electrode; and an insulation layer disposed between the first electrode and the second electrode, wherein the insulation layer comprises a first insulation portion disposed between the first conductive semiconductor layer and the first cover electrode, and a second insulation portion disposed on the first cover electrode, wherein the first cover electrode comprises a first protrusion portion disposed between an upper surface of the first insulation portion and a lower surface of the second insulation portion.

公开(公告)号：US09287466B2

公开(公告)日：2016-03-15

申请号：US14088180

申请日：2013-11-22

Applicant: LG INNOTEK CO., LTD

Inventor： Bum Chul Cho ,  Jin Soo Park

IPC: H01L33/48 ,  H01L33/60 ,  H01L33/44 ,  H01L33/46 ,  H01L33/62

CPC classification number: H01L33/483 ,  H01L33/44 ,  H01L33/46 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: A light emitting device package is provided. The light emitting device package comprises a substrate comprising a plurality of protrusions, an insulating layer on the substrate, a metal layer on the insulating layer, and a light emitting device on the substrate electrically connected to the metal layer.

Abstract translation: 提供发光器件封装。 发光器件封装包括包括多个突起的基板，在基板上的绝缘层，绝缘层上的金属层，以及与该金属层电连接的基板上的发光器件。