公开(公告)号：US20190334066A1

公开(公告)日：2019-10-31

申请号：US16068042

申请日：2017-09-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Chang Man LIM ,  Ki Seok KIM ,  June O SONG

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/60 ,  H01L23/00

Abstract: A light emitting device package including a first frame having first and second through holes; a light emitting device including first and second electrode pads; a first resin disposed between the first frame and the light emitting device; and a conductive material disposed in the first through hole and the second through hole. Further, the first electrode pad of the light emitting device overlaps with the first through hole and the second electrode pad of the light emitting device overlaps with the second through hole; the first electrode pad and the second electrode pad are spaced apart from each other; and the conductive material in the first and second through holes respectively contacts the first and second electrode pads, and a first side surface of the first electrode pad and a second side surface of the second electrode pad facing the first side surface contact the first resin.

公开(公告)号：US20190074410A1

公开(公告)日：2019-03-07

申请号：US15766717

申请日：2017-09-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Chang Man LIM ,  Ki Seok KIM ,  Won Jung KIM ,  June O SONG

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/52

Abstract: A light emitting device package can include first and second frames spaced apart from each other; a package body including a body portion disposed between the first and second frames; a light emitting device including first and second electrode pads; a first through hole in the first frame; a second through hole in the second frame; a conductive material disposed in the first and second through holes; and an intermetallic compound layer disposed between the conductive material and the first frame, and between the conductive material and the second frame, in which the first electrode pad of the light emitting device overlaps with the first through hole in the first frame, the second electrode pad of the light emitting device overlaps with the second through hole in the second frame, and the first and second electrode pads are spaced apart from each other.

公开(公告)号：US20190019929A1

公开(公告)日：2019-01-17

申请号：US16035306

申请日：2018-07-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Chang Man LIM ,  Ki Seok KIM ,  Young Shin KIM ,  June O SONG ,  Ju Hyeon OH ,  Chang Hyeong LEE ,  Tae Sung LEE ,  Se Yeon JUNG ,  Byung Yeon CHOI ,  Sung Min HWANG

IPC: H01L33/62 ,  H01L33/38 ,  H01L33/44 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L33/382 ,  H01L33/44 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: The light emitting device package disclosed in the embodiment includes: first and second frames having first and second through holes; a body disposed between the first and second frames; a light emitting device including a first bonding pad and a second bonding pad; and a conductive part in the first and second through holes. wherein at least one of the first and second bonding pads faces the first and second frames and overlaps with the first and second through holes and includes a contact region contacting the conductive part and a first non-contact non-contacting the conducive part.

公开(公告)号：US20170292071A1

公开(公告)日：2017-10-12

申请号：US15506336

申请日：2015-08-24

Applicant: LG INNOTEK CO., LTD.

Inventor： Ji Wook MOON ,  Hyoung Jin KIM ,  Chang Man LIM ,  Bong Kul MIN

IPC: C09K11/77 ,  C01F17/00 ,  H01L33/00

CPC classification number: C09K11/7733 ,  C01F17/0012 ,  C09K11/0838 ,  C09K11/616 ,  C09K11/7734 ,  C09K11/7774 ,  H01L33/0045 ,  H01L33/504 ,  H01L33/507 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/8592 ,  Y02B20/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An embodiment provides a phosphor composition and a light emitting device package comprising the same, wherein the phosphor composition comprises green phosphor, amber phosphor, and red phosphor, wherein the amber phosphor is expressed as chemical formula Lim−2XSi12-m−nAlm+nOnN16-n:Eu2+, where 2≦m≦5, 2≦n≦10, 0.01≦X≦1. The light emitting element package of the embodiment can display white light having improved brightness and color rendering index.

公开(公告)号：US20210184090A1

公开(公告)日：2021-06-17

申请号：US16769900

申请日：2018-11-30

Applicant: LG INNOTEK CO., LTD.

Inventor： Won Jung KIM ,  June O SONG ,  Chang Man LIM ,  Ki Seok KIM

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/48 ,  H01L33/60

Abstract: The light emitting device package disclosed in the embodiment includes a first frame having a first through hole; a second frame having a second through hole; a body disposed between the first and second frames; and light emitting devices disposed on the first and second frames, wherein the first and second through holes have an area of a lower surface larger than an area of the upper surface, and centers of the upper and lower surfaces of the first through hole may be offset from each other in the vertical direction, and centers of the upper and lower surfaces of the second through hole may be offset from each other in the vertical direction.

公开(公告)号：US20190334063A1

公开(公告)日：2019-10-31

申请号：US16070484

申请日：2017-09-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Ki Seok KIM ,  Won Jung KIM ,  June O SONG ,  Chang Man LIM

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/62 ,  H01L33/56

Abstract: A light emitting device package is discussed. The light emitting device package includes a first frame having a first through hole; a second frame having a second through hole; a connecting frame diagonally extending in the light emitting device package from the first frame to the second frame; a first light emitting device including a first electrode pad and a second electrode pad, the second electrode pad being disposed on the first through hole of the first frame; and a second light emitting device including a third electrode pad and a fourth electrode pad, the third electrode pad being disposed on the second through hole of the second frame.

公开(公告)号：US20190207062A1

公开(公告)日：2019-07-04

申请号：US16238046

申请日：2019-01-02

Applicant: LG INNOTEK CO., LTD.

Inventor： Won Jung KIM ,  June O SONG ,  Ki Seok KIM ,  Chang Man LIM

IPC: H01L33/48 ,  H01L33/56 ,  H01L33/62 ,  H01L33/60

Abstract: A light emitting device package according to an embodiment includes: a body including an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface, and first and second openings passing through the upper surface and the lower surface; and a light emitting device including first and second bonding portions disposed on the first and second openings, respectively, wherein the body may include a recess provided on the lower surface, the recess may be vertically overlapped with the first opening and the second opening, and the recess may be exposed at the side surface of the body.

公开(公告)号：US20190067255A1

公开(公告)日：2019-02-28

申请号：US16078973

申请日：2017-02-23

Applicant: LG INNOTEK CO., LTD.

Inventor： Chang Man LIM ,  Sang Hoon LEE ,  Hwan Hee JEONG

IPC: H01L25/075 ,  H01L33/48 ,  H01L33/52 ,  H01L33/62

Abstract: An embodiment relates to a light emitting element package and display device. The light emitting element package according to the embodiment comprises: a substrate; a first light emitting element disposed on the substrate and emitting a red wavelength; a second light emitting element disposed in parallel with the first light emitting element in a first direction and emitting a blue or green wavelength; a third light emitting device disposed in parallel with the first and second light emitting elements in a second direction that is orthogonal to the first direction and emitting a green or blue wavelength; and a molding part covering the first to third light emitting elements, wherein a first upper electrode connected to the first light emitting element, a second upper electrode connected to the second light emitting element, a third upper electrode connected to the third light emitting element, and a fourth upper electrode commonly connected to the first to third light emitting elements are included on the substrate, the first to third light emitting elements are arranged to be misaligned in the first direction, and the centers of the first to third light emitting elements can be arranged within a curvature range having a curvature radius of 250 μm from the center of the substrate. The light emitting element package according to the embodiment can provide full colors, implement uniform color and uniform brightness, and increase a bonding force between the molding part and the substrate. In the embodiment, a configuration can be simplified and slimness can be implemented.

公开(公告)号：US20190044039A1

公开(公告)日：2019-02-07

申请号：US16052247

申请日：2018-08-01

Applicant: LG INNOTEK CO., LTD.

Inventor： Tae Sung LEE ,  Won Jung KIM ,  June O SONG ,  Chang Man LIM

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/32 ,  H01L33/60 ,  H01L33/64

CPC classification number: H01L33/62 ,  H01L33/32 ,  H01L33/36 ,  H01L33/486 ,  H01L33/50 ,  H01L33/60 ,  H01L33/64

Abstract: A light emitting device package according to an embodiment includes: a package body; a light emitting device disposed on the package body; and an adhesive disposed between the package body and the light emitting device. The package body includes first and second openings passing through the package body on an upper surface of the package body and a recess provided to concave in a direction of a lower surface of the package body from the upper surface of the package body. The light emitting device includes a first bonding part disposed on the first opening and a second bonding part disposed on the second opening. The adhesive is provided at the recess.

公开(公告)号：US20210013376A1

公开(公告)日：2021-01-14

申请号：US16646884

申请日：2018-09-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Ki Seok KIM ,  Won Jung KIM ,  June O SONG ,  Chang Man LIM

IPC: H01L33/48 ,  H01L33/56

Abstract: Embodiments relate to a light emitting device package and a light source device. A light emitting device package according to the embodiment may include a first package body; a second package body disposed on the first package body, and comprising an opening passing through an upper surface and a lower surface of the second package body; and a light emitting device disposed in the opening, and comprising a first bonding part and a second bonding part. The first package body may include a first opening and a second opening that pass through an upper surface and a lower surface of the first package body. The upper surface of the first package body may be coupled with the lower surface of the second package body, the first bonding part may be disposed on the first opening, and the second bonding part may be disposed on the second opening.