公开(公告)号：US20190019929A1

公开(公告)日：2019-01-17

申请号：US16035306

申请日：2018-07-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Chang Man LIM ,  Ki Seok KIM ,  Young Shin KIM ,  June O SONG ,  Ju Hyeon OH ,  Chang Hyeong LEE ,  Tae Sung LEE ,  Se Yeon JUNG ,  Byung Yeon CHOI ,  Sung Min HWANG

IPC: H01L33/62 ,  H01L33/38 ,  H01L33/44 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L33/382 ,  H01L33/44 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: The light emitting device package disclosed in the embodiment includes: first and second frames having first and second through holes; a body disposed between the first and second frames; a light emitting device including a first bonding pad and a second bonding pad; and a conductive part in the first and second through holes. wherein at least one of the first and second bonding pads faces the first and second frames and overlaps with the first and second through holes and includes a contact region contacting the conductive part and a first non-contact non-contacting the conducive part.

公开(公告)号：US20200350474A1

公开(公告)日：2020-11-05

申请号：US16643099

申请日：2018-08-31

Applicant: LG INNOTEK CO., LTD.

Inventor： Young Shin KIM ,  June O SONG ,  Chang Man LIM ,  Won Jung KIM ,  Ki Seok KIM

IPC: H01L33/62 ,  H01L33/56 ,  H01L33/60 ,  H01L33/48

Abstract: The light emitting device package disclosed in the embodiment includes first and second frames spaced apart from each other; a body disposed between the first and second frames; a light emitting device including a first bonding portion and a second bonding portion on a lower portion thereof; and a first resin disposed between the body and the light emitting device, wherein the first frame includes a first protruding portion facing the first bonding portion of the light emitting device, and the second frame includes a second protruding portion facing the second bonding portion of the light emitting device, and including a first conductive layer between the first bonding portion and the first protruding portion and a second conductive layer between the second bonding portion and the second protruding portion.

公开(公告)号：US20190027641A1

公开(公告)日：2019-01-24

申请号：US16041081

申请日：2018-07-20

Applicant: LG INNOTEK CO., LTD.

Inventor： Tae Sung LEE ,  June O SONG ,  Ki Seok KIM ,  Young Shin KIM ,  Chang Man LIM

IPC: H01L33/00 ,  H01L33/62

Abstract: A light emitting device package includes a first frame and a second frame disposed to be spaced apart from each other; a body disposed between the first and second frames and comprising a recess; a first adhesive on the recess; a light emitting device on the first adhesive; a second adhesive disposed between the first and second frames and the light emitting device; and a resin portion disposed to surround the second adhesive and a partial region of the light emitting device.

公开(公告)号：US20210175392A1

公开(公告)日：2021-06-10

申请号：US16770910

申请日：2018-12-06

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Min KONG ,  Ki Seok KIM ,  Young Shin KIM

IPC: H01L33/48 ,  H01L33/60

Abstract: The light emitting device package disclosed in an embodiment of the invention includes first and second frames; a body disposed between the first and second frames; and a light emitting device disposed on the first and second frames, wherein the first frame includes a first end portion adjacent to the second frame, and the second frame includes a second end portion adjacent to the first frame and facing the first end portion, wherein the first end portion includes a first protruding portion protruding toward the second frame, and the second end portion includes a second protruding portion protruding toward the first frame. The light emitting device may include a first bonding portion disposed on the first protruding portion and a second bonding portion disposed on the second protruding portion.

公开(公告)号：US20210066552A1

公开(公告)日：2021-03-04

申请号：US16958043

申请日：2018-12-18

Applicant: LG INNOTEK CO., LTD.

Inventor： Young Shin KIM ,  Soon Yong KANG ,  Sung Min KONG ,  Ju Hyeon OH

IPC: H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62

Abstract: The light emitting device package disclosed in the embodiment of the invention includes first and second frames; a body disposed between the first and second frames; and a light emitting devices disposed on the first and second frames. The first frame includes a first end portion adjacent to the second frame, and the second frame includes a second end portion adjacent to the first frame and facing the first end portion, the first end portion includes a first protrusion protruding toward the second frame, and the second end portion includes a second protrusion protruding toward the first frame. The light emitting device includes first and second bonding portions disposed on the first and second protrusions. The body includes first and second reflective portions extending toward both sides of the first protrusion toward the first frame, and third and fourth reflective portions extending toward both sides of the second protrusion toward the second frame. The light emitting device may overlap the first to fourth reflective portions in a vertical direction.