公开(公告)号：US20210084755A1

公开(公告)日：2021-03-18

申请号：US17106039

申请日：2020-11-27

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Woong Sik KIM ,  Hyung Kyu YOON ,  Min Hwan KIM

IPC: H05K1/02 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H05K1/14 ,  H05K3/28 ,  H05K3/18

Abstract: A flexible circuit board includes a substrate a, a wiring pattern layer provided on the first surface of the substrate, a plating layer provided on the wiring pattern layer and including an open area, and a protective layer that contacts parts of the wiring pattern layer, the plating layer, and the substrate. The protective layer has a larger thickness than a thickness of the plating layer. The first protective layer includes a first overlapping region in which the plating layer and protective layer are in contact with each and a second overlapping region in which the plating layer and the protective layer are in contact with each other. A width of the first overlapping region may be different from a width of the second overlapping region, and each of the widths of the first and second overlapping regions is larger than a thickness of the plating layer.

公开(公告)号：US20180027651A1

公开(公告)日：2018-01-25

申请号：US15657296

申请日：2017-07-24

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Woong Sik KIM ,  Hyung Kyu YOON ,  Min Hwan KIM

IPC: H05K1/02 ,  H01L23/00 ,  H05K3/18 ,  H05K1/18 ,  H05K1/14 ,  H05K3/28 ,  H01L23/498 ,  H01L21/48

CPC classification number: H05K1/0281 ,  H01L21/481 ,  H01L21/4821 ,  H01L23/4985 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15153 ,  H05K1/0271 ,  H05K1/144 ,  H05K1/189 ,  H05K3/18 ,  H05K3/28 ,  H05K2201/055 ,  H05K2201/10128

Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

公开(公告)号：US20220304146A1

公开(公告)日：2022-09-22

申请号：US17836405

申请日：2022-06-09

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Woong Sik KIM ,  Hyung Kyu YOON ,  Min Hwan KIM

IPC: H05K1/02 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H05K1/14 ,  H05K3/28 ,  H05K3/18

Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

公开(公告)号：US20230209705A1

公开(公告)日：2023-06-29

申请号：US18115218

申请日：2023-02-28

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Woong Sik KIM ,  Hyung Kyu YOON ,  Min Hwan KIM

IPC: H05K1/02 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H05K1/14 ,  H05K3/28 ,  H05K3/18

CPC classification number: H05K1/0281 ,  H01L23/4985 ,  H01L24/16 ,  H01L21/481 ,  H01L21/4821 ,  H05K1/144 ,  H05K3/28 ,  H05K3/18 ,  H05K1/0271 ,  H05K1/189

Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

公开(公告)号：US20190239345A1

公开(公告)日：2019-08-01

申请号：US16378943

申请日：2019-04-09

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Woong Sik KIM ,  Hyung Kyu YOON ,  Min Hwan KIM

IPC: H05K1/02 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H05K1/14 ,  H05K3/18 ,  H05K3/28

CPC classification number: H05K1/0281 ,  H01L21/481 ,  H01L21/4821 ,  H01L21/4867 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15153 ,  H05K1/0271 ,  H05K1/144 ,  H05K1/189 ,  H05K3/18 ,  H05K3/28 ,  H05K2201/055 ,  H05K2201/10128

Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.