公开(公告)号：US20170324004A1

公开(公告)日：2017-11-09

申请号：US15528058

申请日：2015-10-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Eun Hyung LEE ,  Yoo Hwan KANG ,  Won Ho KIM ,  Tae Ki KIM ,  Sungwon David ROH ,  Hyo Jung MOON ,  Yong Han JEON

IPC: H01L33/38 ,  H01L33/30 ,  H01L33/40 ,  H01L33/46

CPC classification number: H01L33/387 ,  H01L33/08 ,  H01L33/16 ,  H01L33/24 ,  H01L33/30 ,  H01L33/382 ,  H01L33/405 ,  H01L33/46 ,  H01L2933/0016

Abstract: Disclosed is a light emitting device according to the embodiment including a conductive semiconductor layer divided into at least two or more light emitting regions; a plurality of light emitting structures on the conductive semiconductor layer; an electrode layer on the plurality of light emitting structures; a second electrode electrically connected to the electrode layer; and a first electrode electrically connected to the conductive semiconductor layer, wherein each of the light emitting structures includes a rod-shaped first conductivity type semiconductor, an active layer configured to surround the first conductivity type semiconductor and a second conductivity type semiconductor configured to surround the active layer, and each of the light emitting structures has at least two or more outer surfaces having different extending directions with respect to an upper surface of the conductive semiconductor layer.

公开(公告)号：US20240314937A1

公开(公告)日：2024-09-19

申请号：US18263621

申请日：2021-04-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Hee Jung LEE ,  Jin Seok LEE ,  Yong Han JEON

IPC: H05K3/28 ,  H05K1/11

CPC classification number: H05K3/282 ,  H05K1/113 ,  H05K2201/09218 ,  H05K2203/1377

Abstract: A circuit board according to an embodiment includes an insulating layer including a first region and a second region; a circuit pattern disposed on an upper surface of the first region and an upper surface of the second region of the insulating layer; and a solder resist including a first portion disposed on the upper surface of the first region of the insulating layer and a second portion disposed the upper surface of the second region; wherein a height of the first portion of the solder resist is smaller than a height of the circuit pattern, wherein a height of the second portion of the solder resist is greater than the height of the circuit pattern, wherein at least one of the first region and the second region is divided into a plurality of partial regions, wherein at least one of the first portion and the second portion of the solder resist has a different height in the plurality of partial regions.

公开(公告)号：US20230113302A1

公开(公告)日：2023-04-13

申请号：US17906166

申请日：2021-03-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Yong Han JEON ,  Jin Seok LEE ,  Tae Ki KIM

IPC: H05K1/11

Abstract: A circuit board according to an embodiment includes an insulating layer; a circuit pattern disposed on an upper surface of the insulating layer; a first solder resist disposed on an upper surface of the insulating layer and having a height smaller than a height of the circuit pattern; and a second solder resist disposed on an upper surface of the first solder resist and including a first portion having an upper surface lower than an upper surface of the circuit pattern and a second. portion having an upper surface higher than the upper surface of the circuit pattern, wherein the circuit pattern includes: a plurality of first circuit patterns disposed on an upper surface of a first region of the insulating layer, and a plurality of second circuit patterns disposed on an upper surface of a second region of the insulating layer; wherein the first portion of the second solder resist is disposed between the plurality of first circuit patterns to have an upper surface lower than an upper surface of the first circuit pattern; and wherein the second portion of the second solder resist has an upper surface higher than an upper surface of the second circuit pattern, and is disposed to cover the plurality of second circuit patterns between the plurality of second circuit patterns.

公开(公告)号：US20200066936A1

公开(公告)日：2020-02-27

申请号：US16466953

申请日：2017-12-04

Applicant: LG INNOTEK CO., LTD.

Inventor： Deok Ki HWANG ,  Jae Hun JEONG ,  Ki Bum SUNG ,  Sang Jun PARK ,  Tae Yong LEE ,  Yong Han JEON

IPC: H01L33/36 ,  G01N21/17 ,  G01N21/33 ,  G01N17/00

Abstract: A semiconductor device disclosed in an embodiment comprises: a light emitting unit comprising a light emitting structure layer which has a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer; and a sensor unit disposed on the light emitting unit, wherein the sensor unit comprises: a sensing material changing in resistance with light emitted by the light emitting unit; a first sensor electrode comprising a first pad portion and a first extension part extending from the first pad portion and contacting the sensing material; and a second sensor electrode comprising a first pad portion and a second extension part extending toward the first extension part from the second pad portion and contacting the sensing material. The sensor unit senses an external gas in response to the light generated from the light emitting unit.