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公开(公告)号：US12140286B2
公开(公告)日：2024-11-12
申请号：US18279466
申请日：2022-03-11
Applicant: LG INNOTEK CO., LTD.
Inventor： Kyoung Soo Ahn , Hyun Duck Yang , Young Min Moon , Kee Youn Jang
IPC: F21S41/43 , F21S41/143 , F21S41/151 , F21S41/32 , F21S41/36 , F21S43/14 , F21S43/20 , F21S43/31 , F21Y113/17
Abstract: The lighting device disclosed in the embodiment of the invention includes a substrate; a plurality of light emitting devices disposed on the substrate and emitting light in at least a first direction; a resin layer sealing the plurality of light emitting devices; and an optical member disposed on the resin layer, wherein the resin layer may include a first light blocking portion integrally formed with the resin layer and having a transmittance lower than that of the resin layer on an emission-side region of each of the plurality of light emitting devices.
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公开(公告)号：US09391117B2
公开(公告)日：2016-07-12
申请号：US14406159
申请日：2013-06-07
Applicant: LG INNOTEK CO., LTD.
Inventor： Nam Seok Oh , Young Jun Cho , Kwang Kyu Choi , Young Min Moon , Sun Mi Moon
CPC classification number: H01L27/15 , H01L25/0753 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/647 , H01L2224/45139 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49113 , H01L2224/73265 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00011
Abstract: One embodiment comprises first and second light-emitting chips, each comprising: a package body having a cavity; first to fourth lead frames disposed inside the package body; a first semiconductor layer; an active layer; and a second semiconductor layer and emitting light of a different wavelength from each other, wherein each of the first to fourth lead frames comprises: an upper surface part exposed to the cavity; and a side surface part bent from one side portion of the upper surface part and exposed by one surface of the package body. In addition, the first light-emitting chip is disposed on the upper surface part of the first lead frame, and the second light-emitting chip is disposed on the upper surface part of the third lead frame.
Abstract translation: 一个实施例包括第一和第二发光芯片，每个包括：具有空腔的封装主体; 布置在包装体内的第一至第四引线框架; 第一半导体层; 活性层 和第二半导体层，并且发射彼此不同波长的光，其中所述第一至第四引线框架中的每一个包括：暴露于所述空腔的上表面部分; 以及侧表面部分，其从上表面部分的一个侧部弯曲并且被包装体的一个表面暴露。 此外，第一发光芯片设置在第一引线框架的上表面部分上，第二发光芯片设置在第三引线框架的上表面部分上。
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公开(公告)号：US20150155330A1
公开(公告)日：2015-06-04
申请号：US14406159
申请日：2013-06-07
Applicant: LG INNOTEK CO., LTD.
Inventor： Nam Seok Oh , Young Jun Cho , Kwang Kyu Choi , Young Min Moon , Sun Mi Moon
CPC classification number: H01L27/15 , H01L25/0753 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/647 , H01L2224/45139 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49113 , H01L2224/73265 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00011
Abstract: One embodiment comprises first and second light-emitting chips, each comprising: a package body having a cavity; first to fourth lead frames disposed inside the package body; a first semiconductor layer; an active layer; and a second semiconductor layer and emitting light of a different wavelength from each other, wherein each of the first to fourth lead frames comprises: an upper surface part exposed to the cavity; and a side surface part bent from one side portion of the upper surface part and exposed by one surface of the package body. In addition, the first light-emitting chip is disposed on the upper surface part of the first lead frame, and the second light-emitting chip is disposed on the upper surface part of the third lead frame.
Abstract translation: 一个实施例包括第一和第二发光芯片，每个包括：具有空腔的封装主体; 布置在包装体内的第一至第四引线框架; 第一半导体层; 活性层 和第二半导体层，并且发射彼此不同波长的光，其中所述第一至第四引线框架中的每一个包括：暴露于所述空腔的上表面部分; 以及侧表面部分，其从上表面部分的一个侧部弯曲并且被包装体的一个表面暴露。 此外，第一发光芯片设置在第一引线框架的上表面部分上，第二发光芯片设置在第三引线框架的上表面部分上。
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