公开(公告)号：US20170278739A1

公开(公告)日：2017-09-28

申请号：US15466369

申请日：2017-03-22

Applicant: LINTEC Corporation

Inventor： Takashi AKUTSU ,  Takuo NISHIDA

IPC: H01L21/683 ,  B32B27/06 ,  B32B7/12 ,  C09J7/02 ,  C09J133/08

CPC classification number: H01L21/6836 ,  B32B7/06 ,  B32B7/12 ,  B32B23/08 ,  B32B25/08 ,  B32B27/06 ,  B32B27/08 ,  B32B27/16 ,  B32B27/286 ,  B32B27/302 ,  B32B27/304 ,  B32B27/308 ,  B32B27/32 ,  B32B27/325 ,  B32B27/36 ,  B32B27/365 ,  B32B27/40 ,  B32B2250/02 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2307/732 ,  B32B2307/748 ,  B32B2457/14 ,  C08L33/08 ,  C09J5/00 ,  C09J7/22 ,  C09J7/38 ,  C09J133/064 ,  C09J133/08 ,  C09J133/26 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2205/31 ,  C09J2433/00 ,  H01L2221/68327 ,  H01L2221/6834

Abstract: The semiconductor processing sheet of the present invention is a semiconductor processing sheet including a base material and a pressure sensitive adhesive layer provided on one surface of the base material, wherein the pressure sensitive adhesive layer contains an acrylic polymer (A) having a molecular weight distribution of 3.0 or less and an acrylic polymer (B) having a molecular weight distribution of more than 3.0; and a gel fraction of the pressure sensitive adhesive layer is 50 to 70%, and a number average molecular weight of a sol content thereof is 60,000 or more.

公开(公告)号：US20160372358A1

公开(公告)日：2016-12-22

申请号：US15122195

申请日：2015-03-02

Applicant: LINTEC CORPORATION

Inventor： Yosuke KOMA ,  Takuo NISHIDA ,  Misaki SAKAMOTO

IPC: H01L21/683 ,  C09J5/06 ,  C09J7/02 ,  C09J133/06 ,  H01L21/78 ,  H01L21/324

CPC classification number: H01L21/6836 ,  C08F220/06 ,  C09J4/00 ,  C09J4/06 ,  C09J5/00 ,  C09J5/06 ,  C09J7/22 ,  C09J7/38 ,  C09J7/385 ,  C09J133/06 ,  C09J201/02 ,  C09J2201/122 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2205/31 ,  H01L21/324 ,  H01L21/78 ,  H01L2221/68322 ,  H01L2221/68327

Abstract: As a semiconductor-related-member processing sheet which can stably achieve to enhance the removability of the semiconductor-related-member processing sheet and to suppress the reliability degradation of members comprising chips manufactured from a semiconductor-related member using the semiconductor-related-member processing sheet, there is provided a semiconductor-related-member processing sheet, comprising a base material and a pressure sensitive adhesive layer provided on or above one surface of the base material, wherein the pressure sensitive adhesive layer comprises one or more types of energy ray polymerizable compounds having an energy ray polymerizable functional group, wherein at least one type of the energy ray polymerizable compounds is a polymerizable branched polymer that is a polymer having a branched structure, wherein a contact angle on a measurement target surface is 40° or less when measured using a water droplet under an environment of 25° C. and a relative humidity of 50%.

Abstract translation: 作为能够稳定地实现半导体相关部件处理片的可去除性的半导体相关部件处理片，并且使用半导体相关部件抑制由包括由半导体相关部件制造的芯片的部件的可靠性劣化 提供了一种半导体相关件处理片，其包括基材和设置在基材的一个表面上或之上的压敏粘合剂层，其中该压敏粘合剂层包含一种或多种类型的能量射线 具有能量射线聚合性官能团的可聚合化合物，其中至少一种类型的能量射线可聚合化合物是作为具有支化结构的聚合物的可聚合支化聚合物，其中测量目标表面上的接触角为40°以下， 在25℃的环境和相对湿度下使用水滴测量 50％。